Method for assigning pins to connection points

Claim 1

A method for assigning pins connecting first and second layers of a multilayer electrical device to connection points located on the first layer and for connecting the connection points to assigned pins which are to be further connected through wiring located on the second layer, comprising the steps of: a. identifying the location of a first connection point on the first layer that needs to be assigned to a pin and the location of a destination point to be connected to the first connection point through the pin; b. computing the location of a first area located about the first connection point, the first area including all points on the first layer within a first length limit distance from the first connection point, the first length limit distance being determined by physical characteristics of the first layer that limit the length of wires formed within the first layer; c. computing the location of a second area located about the destination point, the second area including all points on the second layer within a second length limit distance from the destination point, the second length limit distance being determined by physical characteristics of the second layer that limit the length of wires formed within the second layer; d. computing an enclosing rectangle for the first connection point and the destination point, the first connection point and the destination point being located on opposite vertices of the enclosing rectangle; e. determining a best area for selecting the pin to be assigned to the first connection point by calculating the overflapping intersection of the first area, the second area and the enclosing rectangle; f. assigning a pin located within the best area to the first connection point; and g. connecting the first connection point to the second layer through the assigned pin by forming a wire in the first layer between the first connection point and the assigned pin, the wire having a length that is no longer than the first length limit.

Claim 2

A method for assigning pins connecting first and second layers of a multilayer electrical device to connection points located on the first layer and for connecting the connection points to assigned pins which are to be further connected through wiring located on the second layer, comprising the steps of: a. identifying the location of a first connection point on the first layer that needs to be assigned to a pin and the location of a destination point to be connected to the first connection point through the pin; b. computing the location of a first area located about the first connection point, the first area including all points on the first layer within a first length limit distance from the first connection point, the first length limit distance being determined by physical characteristics of the first layer that limit the length of wires formed within the first layer; c. computing the location of a second area located about the destination point, the second area including all points on the second layer within a second length limit distance from the destination point, the second length limit distance being determined by physical characteristics of the second layer that limit the length of wires formed within the second layer; d. computing an enclosing rectangle for the first connection point and the destination point, the first connection point and the destination point being located on opposite vertices of the enclosing rectangle; e. determining a best area for selecting the pin to be assigned to the first connection point by calculating the overflapping intersection of the first area, the second area and the enclosing rectangle; f. assigning a pin located within the best area to the first connection point; and g. connecting the first connection point to the second layer through the assigned pin by forming a wire in the first layer between the first connection point and the assigned pin, the wire having a length that is no longer than the first length limit.

Claim 5

A method for assigning pins to connection points according to claim further comprises: in step (a) identifying at least one additional destination point to be connected to the first connection point through the pin; the method further includes the step of computing the location of an area about each additional destination point that includes pins closer to the additional destination point than a length limit for wires from the additional destination point to the pin; in step (d) computing an enclosing rectangle for the first connection point and all destination points; and in step (e) determining a best area for selecting the pin to be assigned to the first connection point by calculating the intersection of the first area, the second area, the enclosing rectangle and all areas about additional destination points.