US5358992A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Die-attach composition comprising polycyanate ester monomer
Assignee: Henkel Loctite Corp
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Filing: 1993-02-26
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Granted: 1994-10-25
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Expires: 2013-02-26
Abstract
Abstract In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
Inventors
- 👤 Stephen M. Dershem
- 👤 Deborah L. Derfelt
- 👤 Dennis B. Patterson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 03:08
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; C; C08; C08G; C08G73/00; C08G73/06; C08G73/0622; C08G73/0638; C08G73/065; C08G73/0655; C08K; C08K3/00; C08K3/02; C08K3/08
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
57 words
A composition for attaching a semiconductor device to a substrate comprising: 8 to 20 wt. percent monomer vehicle comprising at least one polycyanate ester monomer; 80 to 92 wt. percent electrically conductive metal filler substantially free of catalytically active metal ions; and 50 to 1500 ppm metal catalyst wherein said monomer vehicle is liquid under ambient conditions.
Claim 2
Dependent Claim
57 words
A composition for attaching a semiconductor device to a substrate comprising: 8 to 20 wt. percent monomer vehicle comprising at least one polycyanate ester monomer; 80 to 92 wt. percent electrically conductive metal filler substantially free of catalytically active metal ions; and 50 to 1500 ppm metal catalyst wherein said monomer vehicle is liquid under ambient conditions.
Claim 3
Dependent Claim
34 words
A composition according to claim 1 wherein said filler is rendered substantially free of catalytically active metal ions by treatment with an ionic chelating agent, a reducing agent, a non-ionic lubricant, or combinations thereof.
Claim 4
Dependent Claim
25 words
A composition according to claim 2 wherein said filler is rendered substantially free of catalytically active metal ions by treatment with an ionic chelating agent.
Claim 5
Dependent Claim
18 words
A composition according to claim 3 wherein said chelating agent is tartaric acid, thiodiglycolic acid or dithiosuccinic acid.
Claim 6
Dependent Claim
13 words
A composition according to claim 4 wherein said chelating agent is tartaric acid.
Claim 7
Dependent Claim
15 words
A composition according to claim 3 wherein said chelating agent is also a lubricating agent.
Claim 8
Dependent Claim
26 words
A composition according to claim 6 wherein said chelating/lubricating agent is the reaction product of a dianhydride with a hydroxy or amino terminated poly (alkylene oxide).
Claim 9
Dependent Claim
24 words
A composition according to claim 2 wherein said filler is rendered substantially free of catalytically active metal ions by treatment with a reducing agent.
Claim 10
Dependent Claim
14 words
A composition according to claim 8 wherein said reducing agent is a covalent hydride.
Claim 11
Dependent Claim
14 words
A composition according to claim 9 wherein said reducing agent is a silicon hydride.
Claim 12
Dependent Claim
24 words
A composition according to claim 2 wherein said filler is rendered substantially free of catalytically active metal ions by treatment with a non-ionic lubricant.
Claim 13
Dependent Claim
17 words
A composition according to claim 11 wherein said non-ionic lubricant is a fatty acid monoester of glycerol.
Claim 14
Dependent Claim
21 words
A composition according to claim 1 wherein said electrically conductive filler is selected from silver, nickel, copper, aluminum, or mixtures thereof.
Claim 15
Dependent Claim
11 words
A composition according to claim 13 wherein said filler is silver.
Claim 16
Dependent Claim
43 words
A composition for attaching a semiconductor device to a substrate comprising: 13 to 20 wt. percent monomer vehicle comprising 1,1-bis(4-cyanatophenyl)ethane(I) and 2,2-bis(4-cyanatophenyl)propane(II); 80 to 87 wt. percent silver filler substantially free of catalytically active silver ions; and 50 to 500 ppm cobalt acetylacetonate.
Claim 17
Dependent Claim
43 words
A composition for attaching a semiconductor device to a substrate comprising: 13 to 20 wt. percent monomer vehicle comprising 1,1-bis(4-cyanatophenyl)ethane(I) and 2,2-bis(4-cyanatophenyl)propane(II); 80 to 87 wt. percent silver filler substantially free of catalytically active silver ions; and 50 to 500 ppm cobalt acetylacetonate.
Claim 18
Dependent Claim
38 words
A composition according to claim 15 wherein said monomers comprise from about 80 to about 95 wt. percent (I) and from about 5 to about 20 wt. percent (II), with the combined percentages representing total wt. percent vehicle.
Claim 19
Dependent Claim
41 words
A composition according to claim 1 wherein said vehicle further comprises additional monomer selected from the group consisting of vinyl ethers, divinyl ethers, diallyl ethers, dipropargyl ethers, propargyl allyl ethers, monomaleimides, bismaleimides and mixtures of any two or more such monomers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-24 | 1998-04-25 | 1998-10-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-24 | 2002-04-25 | 2002-10-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-24 | 2006-04-25 | 2006-10-25 | $7700.00 | Window Closed / Lapsed |