Rapid-curing adhesive formulation for semiconductor devices

Claim 1

A process for continuous production of bonded semiconductor assemblies comprising: preparing an adhesive formulation comprising 10 to 40 wt.% cyanate ester vehicle and 60 to 90 wt.% filler from a group consisting of thermally conductive filler, electrically conductive filler and thermally and electrically conductive filler, said cyanate ester vehicle comprising liquid cyanate ester having about 2 to 6 pph alkylphenol, about 50 to 500 ppm metal catalyst, and a viscosity of about 1 to 5 poise at 25° C., said filler comprising particulate material less than 70 microns, said adhesive formulation having the property of being capable of being cured in a maximum curing time of five minute at 200° C.; intermittently dispensing said adhesive as a film on portions of said substrate to provide intermittent film portions on said substrate; continuously placing semiconductor devices on said intermittent film portions to provide a bonding surface for each semiconductor device on said substrate and to produce a plurality of unbonded semiconductor assemblies; and continuously curing said adhesive of said unbonded semiconductor assemblies to effect bonding of said semiconductor assemblies.