US4740830A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low temperature single step curing polyimide adhesive
Assignee: National Starch and Chemical Investment Holding Corp
•
Filing: 1987-08-19
•
Granted: 1988-04-26
•
Expires: 2007-08-19
Abstract
Abstract Disclosed is a silver-filled paste, an electronic assembly comprising a semiconductive device attached to a substrate by said silver-filled paste, and a method of bonding an electronic device to a substrate using said silver-filled paste. The silver-filled paste comprises a silver powder; a resin having the formula: ##STR1## wherein R comprises a divalent linking group; and a solvent for the resin which comprises one or more electron donor groups.
Inventors
- 👤 Celia H. Ketley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:16
CPC Classifications
C; C09; C09J; C09J179/00; C09J179/04; C09J179/08; C09J179/085; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/12; C08G73/124; C08G73/126; C08G73/127; C08K; C08K3/00; C08K3/02; C08K3/08; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
64 words
An electronic assembly comprising: a substrate; a semiconductive device attached to said substrate by a bond, said bond comprising a silver-filled paste comprising: a silver powder; a resin having the formula: ##STR11## wherein R comprises a divalent linking group which provides an aromatic ring adjacent each of the nitrogen atoms; and a solvent for the resin which comprises one or more electron donor groups.
Claim 2
Dependent Claim
64 words
An electronic assembly comprising: a substrate; a semiconductive device attached to said substrate by a bond, said bond comprising a silver-filled paste comprising: a silver powder; a resin having the formula: ##STR11## wherein R comprises a divalent linking group which provides an aromatic ring adjacent each of the nitrogen atoms; and a solvent for the resin which comprises one or more electron donor groups.
Claim 3
Dependent Claim
36 words
The electronic assembly of claim 1 wherein R is selected from the group consisting of: ##STR12## wherein X comprises a linking group, ##STR13## wherein R 1 is an aromatic group and n is 1 or 2.
Claim 4
Dependent Claim
47 words
The electronic assembly of claim 2 wherein the silver filled paste comprises: (a) 50-85% by weight of silver powder; (b) 15-50% by weight of a resin having the formula: ##STR14## (c) 15-30% by weight of a solvent selected from the group consisting of butyrolactone and propylene carbonate.
Claim 5
Dependent Claim
22 words
The electronic assembly of claim 3, wherein said semiconductive device is selected from the group consisting of silicon devices and chip capacitators.
Claim 6
Independent Claim
89 words
The method of bonding an electronic device to a substrate comprising: (a) applying a silver-filled composition onto said substrate, said composition comprising: a silver powder; a resin having the formula: ##STR15## wherein R comprises a divalent linking group which provides an aromatic ring adjacent each of the nitrogen atoms; and a solvent for the resin which comprises one or more electron donor groups; (b) setting said device into said composition with pressure to form an assembly; and (c) curing said assembly at a temperature ranging from about 140°-180° C.
Claim 7
Independent Claim
89 words
The method of bonding an electronic device to a substrate comprising: (a) applying a silver-filled composition onto said substrate, said composition comprising: a silver powder; a resin having the formula: ##STR15## wherein R comprises a divalent linking group which provides an aromatic ring adjacent each of the nitrogen atoms; and a solvent for the resin which comprises one or more electron donor groups; (b) setting said device into said composition with pressure to form an assembly; and (c) curing said assembly at a temperature ranging from about 140°-180° C.
Claim 8
Dependent Claim
21 words
The method of claim 5 wherein said electronic device is selected from the group consisting of silicon devices and chip capacitators.
Claim 9
Dependent Claim
35 words
The method of claim 6 wherein R is selected from the group consisting of: ##STR16## wherein X comprises a linking group, ##STR17## wherein R 1 is an aromatic group and n is 1 or 2.
Claim 10
Dependent Claim
45 words
The method of claim 7 wherein the silver-filled composition comprises: (a) 50-85% by weight of silver powder; (b) 15-50% by weight of a resin having the formula: ##STR18## (c) 15-30% by weight of a solvent selected from the group consisting of butyrolactone and propylene carbonate.
References Cited (Backward Citations)
US3497774A
Cited
US3990896A
Cited
US3985928A
Cited
US4323662A
Cited
US4401767A
Cited
US4436785A
Cited
US4459166A
Cited
JPS5914956A
Cited
US4519941A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-26 | 1991-10-26 | 1992-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-26 | 1995-10-26 | 1996-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-26 | 1999-10-26 | 2000-04-26 | $7700.00 | Window Closed / Lapsed |