Abstract A multi-step method of filling submicron vias with aluminum includes an initial deposition of about 1000 angstroms of aluminum which is sputter deposited at a temperature of about 150° C. Subsequently, a layer of an aluminum germanium alloy is deposited, again about 1000 angstroms at 150° C. or less. A third layer of aluminum without germanium is deposited at a temperature of about 150° C. Approximately 1000 angstroms is deposited. This is followed by a final aluminum deposition which is conducted at 450° to 500° C. to deposit 5000 to 15,000 angstroms of aluminum in total. The two depositions of aluminum, at the relatively low temperature of 150° C., prevents the germanium from precipitating and also permits the germanium to diffuse into these layers which increases the overall melting temperature of the deposited metal so that at subsequent higher treatment temperatures, the metal does not dewet the via surface.
A method of filling vias in a semiconductor substrate comprising: sputter depositing a first layer of nongermanium containing aluminum onto a substrate containing said vias at a temperature less than 150° C.; sputter depositing a layer of aluminum-germanium alloy at a temperature less than 150° C.; coating said layer of aluminum-germanium alloy with a second layer of a nongermanium containing aluminum alloy by sputter depositing said second layer of nongermanium containing aluminum at less than or equal to 150° C.; depositing a third layer of nongermanium containing aluminum onto said substrate at a temperature of 400° to 500° C. wherein the total thickness of all said layers is from about 5000 to about 15,000 angstroms.
Claim 2
Independent Claim
115 words
A method of filling vias in a semiconductor substrate comprising: sputter depositing a first layer of nongermanium containing aluminum onto a substrate containing said vias at a temperature less than 150° C.; sputter depositing a layer of aluminum-germanium alloy at a temperature less than 150° C.; coating said layer of aluminum-germanium alloy with a second layer of a nongermanium containing aluminum alloy by sputter depositing said second layer of nongermanium containing aluminum at less than or equal to 150° C.; depositing a third layer of nongermanium containing aluminum onto said substrate at a temperature of 400° to 500° C. wherein the total thickness of all said layers is from about 5000 to about 15,000 angstroms.
Claim 3
Independent Claim
17 words
The method claimed in claim I wherein said aluminum-germanium alloy comprises 1 to about 5% of germanium.
Claim 4
Dependent Claim
19 words
The method claimed in claim 2 wherein said first deposition of non-germainium containing aluminum is conducted through a collimator.
Claim 5
Dependent Claim
17 words
The method claimed in claim 3 wherein said deposition of aluminum-germanium alloy is conducted through a collimator.
Claim 6
Dependent Claim
26 words
The method claimed in claim 1 wherein said aluminum-germanium alloy is deposited at a temperature less than 150° C. with an applied power of 10-15 kilowatts.
Claim 7
Dependent Claim
15 words
The method claimed in claim 1 wherein said first layer is about 1000 angstroms thick.
Claim 8
Dependent Claim
34 words
The method claimed in claim 1 wherein said substrate is maintained at a temperature of 450° C. to 500° C. after said third layer is deposited for a period of 1 to 2 minutes.