Stress-free semiconductor leadframe

Claim 1

A stress-free semiconductor lead frame formed in a conventional metallic substrate for use in conventional packaging equipment, comprising: (a) an outer frame comprising a plurality of alignment holes for cooperative engagement with corresponding outer receiving pins in the packaging equipment; (b) an inner island contained within said outer frame and comprising a die pad and a plurality of metallic leads extending therefrom; (c) a plurality of alignment apertures comprised within said inner island for cooperative engagement with a corresponding plurality of inner receiving pins in the packaging equipment, said alignment apertures being disposed outside said die pad in the inner island; and (d) flexible connection means for attaching said inner island to said outer frame, said flexible connection means being the only connection between the inner island and the outer frame; wherein said connection means is capable of compression and expansion, thereby absorbing mechanical stresses resulting from structural deformations of said inner island without transmitting them to said outer frame.