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US5354623A
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Joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal
Assignee: Cook Medical Technologies LLC
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Filing: 1993-09-03
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Granted: 1994-10-11
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Expires: 2013-09-03
Abstract
Abstract A joint and a laminate including a nickel-titanium alloy such as Nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying a halogen containing flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein and deposits a metal from the halogen containing flux on the oxidation free surface. The activated flux also coats the member surface for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the tinned surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the metal from the halogen containing flux, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.
Inventors
- 👤 Todd A. Hall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 10:26
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/34; B23K35/001; B23K35/004; B23K35/005; B23K35/36; B23K35/3601; B23K35/3603; A; A61; A61M; A61M25/00; A61M25/01; A61M25/09; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12458; Y10T428/12493; Y10T428/12771; Y10T428/12806
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
128 words
A laminate comprising: a base substrate of a metal alloy having by weight a first percentage of nickel and a second percentage of titanium, superelastic and shape memory properties, and an annealing temperature above which said superelastic and shape memory properties are impaired, said base substrate having a surface substantially free of a contaminant including titanium dioxide; a metal from a metallic halide containing flux deposited on said base substrate, said metallic halide containing flux having an activation temperature below said annealing temperature of said base substrate and being capable of removing said contaminant from said surface of said base substrate; and a solder material having a melting temperature less than said annealing temperature of said metal alloy and adhering to said metal deposited on said base substrate.
Claim 2
Dependent Claim
128 words
A laminate comprising: a base substrate of a metal alloy having by weight a first percentage of nickel and a second percentage of titanium, superelastic and shape memory properties, and an annealing temperature above which said superelastic and shape memory properties are impaired, said base substrate having a surface substantially free of a contaminant including titanium dioxide; a metal from a metallic halide containing flux deposited on said base substrate, said metallic halide containing flux having an activation temperature below said annealing temperature of said base substrate and being capable of removing said contaminant from said surface of said base substrate; and a solder material having a melting temperature less than said annealing temperature of said metal alloy and adhering to said metal deposited on said base substrate.
Claim 3
Dependent Claim
23 words
A joint comprising said laminate of claim 1 and further comprising a second member having an outside surface bonded to said solder material.
Claim 4
Dependent Claim
88 words
The laminate of claim 1 wherein said metal is deposited on said base substrate by: applying to said base substrate said metallic halide containing flux, said metallic halide containing flux having a composition suitable for removing said contaminant on said surface of said base substrate; heating said metallic halide containing flux to said activation temperature; suspending said contaminant in said metallic halide containing flux heated to said activation temperature; and depositing said metal from said metallic halide of said metallic halide containing flux heated to said activation temperature.
Claim 5
Independent Claim
117 words
A method of preparing a surface of a nickel-titanium alloy member having an annealing temperature and a contaminant on the surface thereof for bonding a layer of another metal thereto, the method comprising the steps of: applying to said member surface a halogen containing flux having an activation temperature below the annealing temperature of said alloy member, said halogen containing flux having a composition suitable for removing said contaminant from said member surface and including a metallic halide; heating said halogen containing flux to said activation temperature; suspending said contaminant in said halogen containing flux heated to said activation temperature; and depositing a metal from said metallic halide on said member surface with said contaminant removed therefrom.
Claim 6
Independent Claim
117 words
A method of preparing a surface of a nickel-titanium alloy member having an annealing temperature and a contaminant on the surface thereof for bonding a layer of another metal thereto, the method comprising the steps of: applying to said member surface a halogen containing flux having an activation temperature below the annealing temperature of said alloy member, said halogen containing flux having a composition suitable for removing said contaminant from said member surface and including a metallic halide; heating said halogen containing flux to said activation temperature; suspending said contaminant in said halogen containing flux heated to said activation temperature; and depositing a metal from said metallic halide on said member surface with said contaminant removed therefrom.
Claim 7
Dependent Claim
21 words
The method of claim 4 wherein said halogen containing flux further contains a fluorine compound in addition to the metallic halide.
Claim 8
Dependent Claim
12 words
The method of claim 5 wherein the fluorine compound is hydrofluoric acid.
Claim 9
Dependent Claim
15 words
The method of claim 6 further comprising a carrier which functions also as a flux.
Claim 10
Dependent Claim
12 words
The method of claim 7 wherein the carrier is an organic amine.
Claim 11
Dependent Claim
12 words
The method of claim 8 wherein the organic amine is ethanol amine.
Claim 12
Dependent Claim
12 words
The method of claim 5 wherein the metallic halide is a chloride.
Claim 13
Dependent Claim
25 words
The method of claim 10 wherein the metallic chloride is selected from the group consisting of tin, zinc, silver, copper, manganese, potassium, magnesium, and lead.
Claim 14
Dependent Claim
25 words
The method of claim 5 wherein the metallic halide is a halide of at least one of tin, zinc, silver, copper, manganese, magnesium, and lead.
Claim 15
Dependent Claim
19 words
The method of claim 1 wherein the metallic halide includes at least a tin chloride and a zinc chloride.
Claim 16
Dependent Claim
22 words
The method of claim 1 wherein the halogen containing flux further comprises an organic amine as a carrier and active flux component.
Claim 17
Dependent Claim
12 words
The method of claim 14 wherein the organic amine is ethanol amine.
Claim 18
Dependent Claim
27 words
The method of claim 1 further comprising flowing a solder material in a molten state on said metal after said metal is deposited on said member surface.
Claim 19
Independent Claim
150 words
A method for soldering an alloy member including nickel and titanium and having oxidation on the surface thereof to an other member, said alloy member having at least one of superelastic and shape memory properties and an annealing temperature above which said superelastic and shape memory properties are impaired, said method comprising the steps of: applying to said surface a halogen containing flux having an activation temperature below said annealing temperature of said alloy, said flux having a composition suitable for removing said oxidation from the surface of said alloy member; heating said flux to said activation temperature; suspending said contaminant in said flux heated to said activation temperature; flowing a solder in a molten state on said surface and on said other member to thereby displace from said surface said flux with said solder flowing on said surface; and cooling said solder on said surface to a solid state.
Claim 20
Independent Claim
150 words
A method for soldering an alloy member including nickel and titanium and having oxidation on the surface thereof to an other member, said alloy member having at least one of superelastic and shape memory properties and an annealing temperature above which said superelastic and shape memory properties are impaired, said method comprising the steps of: applying to said surface a halogen containing flux having an activation temperature below said annealing temperature of said alloy, said flux having a composition suitable for removing said oxidation from the surface of said alloy member; heating said flux to said activation temperature; suspending said contaminant in said flux heated to said activation temperature; flowing a solder in a molten state on said surface and on said other member to thereby displace from said surface said flux with said solder flowing on said surface; and cooling said solder on said surface to a solid state.
Claim 21
Dependent Claim
27 words
A method for soldering an alloy member according to claim 17 wherein said halogen containing flux further contains a fluorine compound in addition to another halogen compound.
Claim 22
Dependent Claim
18 words
A method for soldering an alloy member according to claim 18 wherein the fluorine compound is hydrofluoric acid.
Claim 23
Dependent Claim
23 words
A method for soldering an alloy according to claim 19 wherein the flux further comprises a carrier which functions also as a flux.
Claim 24
Dependent Claim
17 words
A method for soldering an alloy according to claim 20 wherein the carrier is an organic amine.
Claim 25
Dependent Claim
17 words
A method for soldering an alloy according to claim 21 wherein the organic amine is ethanol amine.
Claim 26
Dependent Claim
17 words
A method for soldering an alloy according to claim 18 wherein the halogen compound is a chloride.
Claim 27
Dependent Claim
29 words
A method for soldering an alloy according to claim 23 wherein the halogen compound is a metallic chloride which deposits a metal on the surface of the alloy member.
Claim 28
Dependent Claim
31 words
A method for soldering an alloy member according to claim 24 wherein the metallic chloride is selected from the group consisting of tin, zinc, silver, copper, manganese, potassium, magnesium, and lead.
Claim 29
Dependent Claim
29 words
A method for soldering an alloy according to claim 18 wherein the halogen compound is a metallic halide which deposits a metal on the surface of the alloy member.
Claim 30
Dependent Claim
31 words
A method for soldering an alloy according to claim 26 wherein the metallic halide is a halide of at least one of tin, zinc, silver, copper, manganese, potassium, magnesium, and lead.
Claim 31
Dependent Claim
31 words
A method for soldering an alloy member according to claim 17 wherein the halogen containing flux comprises a metallic halide which deposits a metal on the surface of the alloy member.
Claim 32
Dependent Claim
30 words
A process for soldering an alloy member according to claim 28 wherein the metallic halide is a halide of at least one of tin, zinc, silver, copper, manganese and lead.
Claim 33
Dependent Claim
26 words
A method for soldering an alloy member according to claim 29 wherein the flux further comprises a fluorine containing compound in addition to the metallic halide.
Claim 34
Dependent Claim
26 words
A method for soldering an alloy member according to claim 30 wherein the flux further comprises an organic amine as a carrier and active flux component.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |