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Conductive copper paste

Assignee: Murata Manufacturing Co Ltd
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Filing: 1993-02-19
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Granted: 1994-08-09
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Expires: 2013-02-19
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Abstract

Abstract A conductive copper paste contains copper powder and a glass frit of a zinc borosilicate system as a solid component dispersed in an organic vehicle. The content of said glass frit in the solid component falls in a range of 0.5 to 8 percent by weight. The paste is applied to ceramic green sheets and fired simultaneously with the ceramic green sheets to provide copper coatings on the ceramic sheets.

Inventors

  • 👤 Hiroji Tani
  • 👤 Kanehito Honma

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 08:17
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 89 words
A conductive copper paste for formation of copper coatings on ceramic substrates, the conductive copper paste consisting essentially of a solid component dispersed in an organic vehicle, the solid component consisting essentially of about 0.5 to 8 percent by weight of a zinc borosilicate glass frit and the remainder of a copper powder, the glass frit consisting essentially of about 40 to 50% by weight of B 2 O 3 , about 5 to 20% by weight of SiO 2 and about 30 to 40% by weight of ZnO.
Claim 2
Dependent Claim 89 words
A conductive copper paste for formation of copper coatings on ceramic substrates, the conductive copper paste consisting essentially of a solid component dispersed in an organic vehicle, the solid component consisting essentially of about 0.5 to 8 percent by weight of a zinc borosilicate glass frit and the remainder of a copper powder, the glass frit consisting essentially of about 40 to 50% by weight of B 2 O 3 , about 5 to 20% by weight of SiO 2 and about 30 to 40% by weight of ZnO.
Claim 3
Dependent Claim 29 words
The conductive copper paste according to claim 1 in combination with a ceramic substrate wherein the ceramic substrate is made of a BaO.Al 2 O 3 .SiO 2 system.
Claim 4
Dependent Claim 37 words
The conductive copper paste according to claim 1 wherein the conductive copper paste consists essentially of, by weight, about 73.6 to 79.6% copper powder, about 0.4 to 6.4% glass frit, and the remainder of an organic binder.
Claim 5
Dependent Claim 22 words
The conductive copper paste according to claim 1 wherein the copper powder has a particle size of about 0.1 to 5 μm.
Claim 6
Independent Claim 84 words
A method of forming a conductive coating on a ceramic substrate, comprising the steps of: (a) dispersing a copper powder and about 0.5 to 8 percent by weight of a glass frit of a zinc borosilicate system in an organic vehicle to prepare a conductive copper paste; (b) applying the resultant conductive copper paste on a ceramic substrate made of a BaO.Al 2 O 3 .SiO 2 system; and, (c) firing the ceramic substrate coated with the conductive copper paste in a non-oxidizing atmosphere.
Claim 7
Independent Claim 84 words
A method of forming a conductive coating on a ceramic substrate, comprising the steps of: (a) dispersing a copper powder and about 0.5 to 8 percent by weight of a glass frit of a zinc borosilicate system in an organic vehicle to prepare a conductive copper paste; (b) applying the resultant conductive copper paste on a ceramic substrate made of a BaO.Al 2 O 3 .SiO 2 system; and, (c) firing the ceramic substrate coated with the conductive copper paste in a non-oxidizing atmosphere.
Claim 8
Dependent Claim 43 words
The method according to claim 5 wherein the glass frit consists essentially of about 40 to 50% by weight of B 2 O 3 , about 5 to 20% by weight of SiO 2 and about 30 to 40% by weight of ZnO.
Claim 9
Dependent Claim 82 words
A conductive copper paste for formation of a copper coating on a ceramic substrate, the conductive copper paste comprising a solid component dispersed in an organic vehicle, the solid component including about 0.5 to 8 percent by weight of a zinc borosilicate glass frit and a copper powder, the glass frit including about 40 to 50% by weight of B 2 O 3 , about 5 to 20% by weight of SiO 2 and about 30 to 40% by weight of ZnO.
Claim 10
Dependent Claim 82 words
A conductive copper paste for formation of a copper coating on a ceramic substrate, the conductive copper paste comprising a solid component dispersed in an organic vehicle, the solid component including about 0.5 to 8 percent by weight of a zinc borosilicate glass frit and a copper powder, the glass frit including about 40 to 50% by weight of B 2 O 3 , about 5 to 20% by weight of SiO 2 and about 30 to 40% by weight of ZnO.
Claim 11
Dependent Claim 29 words
The conductive copper paste according to claim 7 in combination with a ceramic substrate wherein the ceramic substrate is made of a BaO.Al 2 O 3 .SiO 2 system.
Claim 12
Dependent Claim 32 words
The conductive copper paste according to claim 7 wherein the conductive copper paste includes, by weight, about 73.6 to 79.6% copper powder, about 0.4 to 6.4% glass frit, and an organic binder.
Claim 13
Dependent Claim 22 words
The conductive copper paste according to claim 7 wherein the copper powder has a particle size of about 0.1 to 5 μm.
Claim 14
Dependent Claim 41 words
The method according to claim 5 wherein the glass frit includes about 40 to 50% by weight of B 2 O 3 , about 5 to 20% by weight of SiO 2 and about 30 to 40% by weight of ZnO.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-08-08 1998-02-07 1998-08-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-08-08 2002-02-07 2002-08-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-08-08 2006-02-07 2006-08-09 $7700.00 Window Closed / Lapsed

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