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JPH0431336A Expired / Lapsed JP ⏱️ 0.0 years remaining

Thick film conductor composition

Assignee: Resonac Holdings Corp
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Filing: 1990-05-25
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Granted: —
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Expires: 2010-05-25
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Abstract

Abstract PURPOSE:To obtain a thick film conductor composition having high adhering strength to aluminum nitride and high reliability by adding a vehicle component to glass powder having a specific composition, copper oxide, Cu-Ag alloy powder and Cu powder and making to pasty state. CONSTITUTION:40-5wt.% vehicle component is added to 60-95wt.% inorganic solid component composed of 1-10wt.% glass powder comprising 40-60wt.% ZnO, 10-45wt,% B2O3 and 4-30wt.% SiO2, 0,5-13wt.% copper oxide, 1-10wt.% Cu-Ag alloy powder and Cu powder of residual part and kneaded to pasty state to afford the aimed thick film conductor composition for porcelain plate. Other said components, at least a species of Al2O3, BaO and ZrO is able to be suitably added to stabilize glass. Furthermore, PbO is also able to be suitably added and Al2O3 and BaO are able to be added within a range not generating steep raising of softening point. Said Al2O3 is able to be added in a range of <=10wt.% and BaO is also able to be added in a range of <=10wt.%.

Inventors

  • 👤 Toshiyuki Yamamoto
  • 👤 俊幸 山本
  • 👤 Takashi Shoji
  • 👤 孝志 荘司

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 17:14
CPC Classifications
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