US5334488A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacture of multilayer circuit board
Assignee: Shipley Co Inc
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Filing: 1993-05-10
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Granted: 1994-08-02
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Expires: 2013-05-10
Abstract
Abstract The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.
Inventors
- 👤 Charles R. Shipley, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:05
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/205; H05K3/46; H05K3/4644; H05K3/465; H05K3/4661; H05K3/4682; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0565; H05K2203/14; H05K2203/1407; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/18; H05K3/181; H05K3/182; H05K3/184
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
101 words
A method for the formation of a circuit board having two or more layers of circuitry, said method comprising the steps of applying a permanent dielectric coating over a first circuit layer having imaged openings defining interconnections, catalyzing the surface of the permanent dielectric coating and the imaged openings by contact with an electroless plating catalyst, applying a coating over said catalyzed permanent dielectric coating, said coating having imaged openings defining a circuit pattern, and electrolessly plating metal into said openings for interconnections and circuitry whereby, when plated, there is formed a second circuit in electrical contact with said first circuit.
Claim 2
Independent Claim
101 words
A method for the formation of a circuit board having two or more layers of circuitry, said method comprising the steps of applying a permanent dielectric coating over a first circuit layer having imaged openings defining interconnections, catalyzing the surface of the permanent dielectric coating and the imaged openings by contact with an electroless plating catalyst, applying a coating over said catalyzed permanent dielectric coating, said coating having imaged openings defining a circuit pattern, and electrolessly plating metal into said openings for interconnections and circuitry whereby, when plated, there is formed a second circuit in electrical contact with said first circuit.
Claim 3
Dependent Claim
21 words
The method of claim 1 where the electroless plating catalyst is a colloidal metal catalyst applied to a particulate free surface.
Claim 4
Dependent Claim
19 words
The method of claim 2 where the imaged openings are formed by exposure through a mask and wet development.
Claim 5
Dependent Claim
14 words
The method of claim 2 where the imaged openings are formed by laser ablation.
Claim 6
Dependent Claim
14 words
The method of claim 2 where the colloidal metal catalyst is a palladium catalyst.
Claim 7
Dependent Claim
19 words
The method of claim 2 where the permanent dielectric coating has a dielectric constant that does not exceed 4.5.
Claim 8
Dependent Claim
13 words
The method of claim 6 where the dielectric constant does not exceed 3.5.
Claim 9
Dependent Claim
11 words
The method of claim 2 where the deposited metal is copper.
Claim 10
Dependent Claim
20 words
The method of claim 2 where the permanent dielectric is a member selected from the group of epoxies and polyamines.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-01 | 1998-01-31 | 1998-08-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-01 | 2002-01-31 | 2002-08-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-01 | 2006-01-31 | 2006-08-02 | $7700.00 | Window Closed / Lapsed |