Anisotropic conductive adhesive film

Claim 2

A moisture resistant anisotropically electrically conductive adhesive comprising: a) about 100 parts of cyanate ester resin, including one or more cyanate ester compounds, b) from about 10 to about 300 parts of a film formable thermoplastic resin, c) from about 10 to about 500 parts of an epoxy resin, d) from about 0.01 to about 10 parts of an organometallic catalyst, wherein said catalyst contains at least one carbon atom covalently bonded to a transition metal atom, and e) from about 0.1 to about 20 parts conductive particles selected from the group consisting of metal particles, including coagulated metal particles, and metal-covered polymeric particles per 100 parts total weight of said adhesive, said adhesive having been cured in 60 seconds or less at 180° C.

Claim 3

The moisture resistant, anisotropic adhesive of claim 1 wherein said film formable thermoplastic resin is selected from the group consisting of polyvinylbutyral, polyvinylformal, polyvinylacetal, polyamide, phenoxy, polysulfone, polyacrylate, glycidyl acrylate, styrene-butadiene-styrene block copolymers, carboxylic styrene-ethylene-butylene-styrene block copolymers, and epoxylic styrene-ethylene-butylene-styrene block copolymers.

Claim 4

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein the film formable thermoplastic resin has a molecular weight of from about 3,000 to about 200,000.

Claim 5

The moisture resistant, anisotropic adhesive of claim 1 wherein said cyanate esters have cyanate equivalent weight of from about 50 to about 500.

Claim 6

The moisture resistant anisotropically conductive of claim 1 wherein said cyanate ester compounds have a molecular weight of from about 150 to about 2000.

Claim 7

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein said cyanate ester resin includes one or more cyanate ester resin compositions having the following general formulas: Q(OCN).sub.p Formula I wherein p can be from 2 to 7, and wherein Q comprises at least one of the following categories: (1) a mono-, di-, tri-, or tetra-substituted aromatic hydrocarbon containing from about 5 to about 30 carbon atoms, (2) a 1 to 5 aliphatic or polycyclic aliphatic mono-, di-, tri-or tetra- substituted hydrocarbon containing from about 7 to about 20 carbon atoms; ##STR8## where X is a single bond, a lower alkylene group having from 1 to 4 carbons, --S--, or the SO 2 group; and where R l , R 2 , R 3 , R 4 , R 5 , and R 6 are independently hydrogen, an alkyl group having from one to three carbon atoms, or the cyanate ester group (--OC.tbd.N), with the proviso that at least two of R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are cyanate ester groups. In preferred compounds, each of the R groups is either --H, methyl or the cyanate ester group. Formula III is represented by ##STR9## where n is from 0 to about 5, ##STR10## wherein R 7 and R 8 are independently ##STR11## wherein R 9 , R 10 , R 11 are independently --H, a lower alkyl group having from about 1 to about 5 carbon atoms, or the cyanate ester group, preferably hydrogen, methyl or the cyanate ester group, with the proviso that R 7 , and R 8 combined include at least two cyanate ester groups.

Claim 8

The moisture resistant anisotropically conductive adhesive of claim 6 wherein said cyanate ester compounds according to Formula I contain from 1 to 10 heteroatoms selected from the group consisting of non-periodic oxygen, sulfur, non-phosphino phosphorus, non-amino nitrogen, halogen and silicon.

Claim 9

The moisture resistant anisotropically conductive adhesive of claim 1 wherein the cyanate ester is selected from the group consisting of: 2,2-bis(4-cyanatophenyl)propane, 2,2-bis(4-cyanatophenyl)propane, 2,2-bis(4-cyanatophenyl)propane, bis(3,5-dimethyl)(4-cyanatophenyl)methane, and cycloaliphatic cyanate ester.

Claim 10

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein said epoxy resin has from about 150 to about 400 epoxy equivalents.

Claim 11

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein said epoxy resin is selected from the group consisting of cycloaliphatic epoxies, glycidyl ethers, and epoxy modified polymers or oligomers, and mixtures thereof.

Claim 12

The moisture resistant, anisotropically conductive adhesive of claim 10 wherein said cycloaliphatic epoxies are derivatives of cyclohexene oxide.

Claim 13

The moisture resistant, anisotropically conductive adhesive of claim 10 wherein said epoxy resin contains at least on glycidyl ether of bisphenol A.

Claim 14

The moisture resistant, anisotropically conductive adhesive of claim 1 further including a silane coupling agent.

Claim 15

The moisture resistant, anisotropically conductive adhesive of claim 13 wherein said silane coupling agent is present at a level of from about 0.1 to about 5 percent by weight.

Claim 16

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein said conductive particles are selected from the group consisting of metal particles, and conductive particles having a polymer core and a thin metal surface layer.

Claim 17

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein said adhesive is attached to a release liner.

Claim 18

The moisture resistant, anisotropically conductive adhesive of claim 1 wherein said metal particles are selected from the group consisting of coagulated metal particles and solder particles.