US5329237A
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US
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Method and system for decoupling inoperative passive elements on a semiconductor chip
Assignee: Micron Technology Inc
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Filing: 1993-02-12
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Granted: 1994-07-12
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Expires: 2013-02-12
Abstract
Abstract The present invention teaches a method and system for disconnecting shorted decoupling capacitors, wherein a semiconductor chip having a plurality of redundant decoupling capacitors. Each of the capacitors is coupled, by means of a link, to a bus having a predetermined voltage. Each link is accessible to light emissions, in planar view. The system comprises a tester for testing the operability of each of the capacitors. In a preferred embodiment, the tester comprises a heating element and a high voltage stress testing element. Under thermal and voltage stress, an infrared signal identifying shorted decoupling capacitors is generated by shorted decoupling capacitors. The system further comprises a sensor for sensing the infrared signal. In one embodiment of the present invention, the sensor comprises an emission microscope for multilevel inspection ("EMMI"). Each inoperable capacitor is decoupled from the bus by disintegrating the link with a laser in response to the infrared signal. In an alternate embodiment, the link is disintegrated by an acid etch comprising H2SO4, H2SO4 and H2O2, or H2PO4.
Inventors
- 👤 Andrew Horch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 22:35
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/23; H10P74/232; G; G06; G06F; G06F11/00; G06F11/07; G06F11/16; G06F11/20; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/427; H10W20/49; H10W20/493; H10W20/494; H10W20/495; H10W20/496; H10W44/00; H10W44/601
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
80 words
A method for decoupling inoperative elements on a semiconductor chip comprising the steps of: providing said semiconductor chip having a plurality of redundant passive elements, each of said elements coupled to a bus by means of a link, said bus associated with a predetermined voltage; testing each of said elements for operability, said testing generating a signal identifying which of said elements are inoperable; and decoupling each of said inoperable elements externally from said bus in response to said signal.
Claim 2
Independent Claim
80 words
A method for decoupling inoperative elements on a semiconductor chip comprising the steps of: providing said semiconductor chip having a plurality of redundant passive elements, each of said elements coupled to a bus by means of a link, said bus associated with a predetermined voltage; testing each of said elements for operability, said testing generating a signal identifying which of said elements are inoperable; and decoupling each of said inoperable elements externally from said bus in response to said signal.
Claim 3
Dependent Claim
21 words
A method for decoupling inoperative elements, according to claim 1, wherein at least one of said elements is a decoupling capacitor.
Claim 4
Dependent Claim
18 words
A method for decoupling inoperative elements, according to claim 2, wherein said link comprises substantially low resistive characteristics.
Claim 5
Dependent Claim
61 words
A method for decoupling inoperative elements, according to claim 3, wherein said predetermined voltage is substantially in the range of 3 Volts and 5 Volts, and said testing comprises the step of: applying a voltage along said bus substantially in the range of 7 Volts and 8 Volts for a time substantially in the range of 1 minute and 48 hours.
Claim 6
Dependent Claim
47 words
A method for decoupling inoperative elements, according to claim 4, wherein said testing further comprises the step of: heating said semiconductor chip to a temperature substantially in the range of 120° C. and 140° C. for a time substantially in the range 1 hour and 48 hours.
Claim 7
Dependent Claim
28 words
A method for decoupling inoperative elements, according to claim 5, wherein said testing further comprises the step of: sensing a light emission from each of said inoperative elements.
Claim 8
Dependent Claim
21 words
A method for decoupling inoperative elements, according to claim 6, wherein said light emission is substantially within the infrared wavelength spectrum.
Claim 9
Dependent Claim
24 words
A method for decoupling inoperative elements, according to claim 7, wherein said sensing is accomplished by means of an emission microscope for multilevel inspection.
Claim 10
Dependent Claim
31 words
A method for decoupling inoperative elements, according to claim 7, wherein said decoupling comprises the step of: disintegrating said link of said inoperable element in response to said infrared light emission.
Claim 11
Dependent Claim
32 words
A method for decoupling inoperative elements, according to claim 9, wherein said disintegrating is performed by exposing said link to external energy substantially in the range of 0.1 μWatt and 10 mWatt.
Claim 12
Dependent Claim
19 words
A method for decoupling inoperative elements, according to claim 10, wherein said external energy is generated by a laser.
Claim 13
Dependent Claim
21 words
A method for decoupling inoperative elements, according to claim 9, wherein said disintegrating is performed by means of an acid etch.
Claim 14
Dependent Claim
41 words
A method for decoupling inoperative elements, according to claim 12, wherein said acid etch comprises at least one of H 2 SO 4 , H 2 SO 4 diluted with H 2 O 2 , and H 2 PO 4 .
Claim 15
Independent Claim
112 words
A system for decoupling inoperative elements on a semiconductor chip, the semiconductor chip having a plurality of redundant passive elements, each of said elements coupled to a bus by means of a link, said bus associated with a predetermined voltage; the system comprising: a. a base for mounting the semiconductor chip, and for providing operative power to the semiconductor chip; b. means for evaluating the operability of each of said elements, said means for evaluating generating a signal identifying which of said elements are inoperable; and c. means for externally decoupling each of said inoperable elements from said bus by disintegrating said link, said means for externally decoupling responsive to said signal.
Claim 16
Independent Claim
112 words
A system for decoupling inoperative elements on a semiconductor chip, the semiconductor chip having a plurality of redundant passive elements, each of said elements coupled to a bus by means of a link, said bus associated with a predetermined voltage; the system comprising: a. a base for mounting the semiconductor chip, and for providing operative power to the semiconductor chip; b. means for evaluating the operability of each of said elements, said means for evaluating generating a signal identifying which of said elements are inoperable; and c. means for externally decoupling each of said inoperable elements from said bus by disintegrating said link, said means for externally decoupling responsive to said signal.
Claim 17
Dependent Claim
23 words
A system for decoupling inoperative elements, according to claim 14, where said link comprises substantially low resistive characteristics and is accessible to light.
Claim 18
Dependent Claim
21 words
A system for decoupling inoperative elements, according to claim 15, wherein at least one of said elements is a decoupling capacitor.
Claim 19
Dependent Claim
65 words
A system for decoupling inoperative elements, according to claim 16, wherein said predetermined voltage is substantially in the range of 3 Volts and 5 Volts, and said means for evaluating comprises a stressing element coupled to said bus for applying a voltage substantially in the range of 7 Volts and 8 Volts for a time substantially in the range of 1 minute and 48 hours.
Claim 20
Dependent Claim
50 words
A system for decoupling inoperative elements, according to claim 17, wherein said means for evaluating comprises a heating element for heating said semiconductor chip to a temperature substantially in the range between 120° C. and 140° C. for a time substantially in the range between 1 hour and 48 hours.
Claim 21
Dependent Claim
29 words
A system for decoupling inoperative elements, according to claim 18, wherein said means for evaluating comprises a sensor for sensing a light emission from each of said inoperative elements.
Claim 22
Dependent Claim
21 words
A system for decoupling inoperative elements, according to claim 19, wherein said light emission is substantially within the infrared wavelength spectrum.
Claim 23
Dependent Claim
20 words
A system for decoupling inoperative elements, according to claim 20, wherein said sensor comprises an emission microscope for multilevel inspection.
Claim 24
Dependent Claim
44 words
A system for decoupling inoperative elements, according to claim 20, wherein said means for externally decoupling comprises a generator for generating energy externally, substantially in the range of 0.1 μWatt and 10 mWatt, to disintegrate said link in response to said infrared light emission.
Claim 25
Dependent Claim
16 words
A system for decoupling inoperative elements, according to claim 22, wherein said generator comprises a laser.
Claim 26
Dependent Claim
33 words
A system for decoupling inoperative elements, according to claim 20, wherein said means for externally decoupling comprises an applicator for applying acid to disintegrate said link in response to said infrared light emission.
Claim 27
Dependent Claim
40 words
A system for decoupling inoperative elements, according to claim 24, wherein said acid comprises at least one of H 2 SO 4 , H 2 SO 4 diluted with H 2 O 2 , and H 2 PO 4 .
Claim 28
Dependent Claim
205 words
An automated system for decoupling inoperative capacitors on a semiconductor chip, the semiconductor chip having a plurality of redundant capacitors, each of said capacitors coupled to a bus by a link, said bus associated with a predetermined voltage, said link comprising substantially low resistive characteristics and being accessible to light emissions; the system comprising: a. means for testing the operability of each of said capacitors, said means for testing generating an infrared signal identifying which of said capacitors are inoperative, said means for testing comprising: (1) a heating element for heating said semiconductor chip to a temperature substantially in the range between 120° C. and 140° C. for a time substantially in the range between 1 hour and 48 hours; (2) a stressing element coupled to said bus for applying substantially in the range of 7 Volts and 8 Volts for a time substantially in the range of 1 minute and 48 hours; and b. a sensor for sensing said infrared signal from each of said inoperative capacitors; and c. a laser for externally decoupling each of said inoperative capacitors from said bus by disintegrating said link, said laser responsive to said signal and having a power range substantially between 0.1 μWatt and 10 mWatt.
Claim 29
Dependent Claim
205 words
An automated system for decoupling inoperative capacitors on a semiconductor chip, the semiconductor chip having a plurality of redundant capacitors, each of said capacitors coupled to a bus by a link, said bus associated with a predetermined voltage, said link comprising substantially low resistive characteristics and being accessible to light emissions; the system comprising: a. means for testing the operability of each of said capacitors, said means for testing generating an infrared signal identifying which of said capacitors are inoperative, said means for testing comprising: (1) a heating element for heating said semiconductor chip to a temperature substantially in the range between 120° C. and 140° C. for a time substantially in the range between 1 hour and 48 hours; (2) a stressing element coupled to said bus for applying substantially in the range of 7 Volts and 8 Volts for a time substantially in the range of 1 minute and 48 hours; and b. a sensor for sensing said infrared signal from each of said inoperative capacitors; and c. a laser for externally decoupling each of said inoperative capacitors from said bus by disintegrating said link, said laser responsive to said signal and having a power range substantially between 0.1 μWatt and 10 mWatt.
References Cited (Backward Citations)
US4879631A
Cited
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Cited
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