Functional fluid additives for acid copper electroplating baths

Claim 2

An improved high acid/low copper electroplating bath for plating of copper onto substrates comprising: from about 13 to about 45 g/l copper ions; from about 45 to about 262 g/l of an acid with effective amounts of a bath soluble multi-functional polymer said polymer comprising at least three distinct ether groups linked in said polymer wherein one of the ether linkages is derived from an alcohol, a bisphenol A or an epoxy and also comprising propoxy and ethoxy groups said multi-functional polymers providing improved leveling over surface imperfections, improved adhesion and improved plating in low density current areas.

Claim 3

The improved copper electroplating bath of claim 1 wherein the effective amount of the functional polymer further comprises: from about 1 to about 2000 mg/l of a functional fluid having the formula: (R.sub.1).sub.m --(R.sub.2).sub.n --(R.sub.3).sub.o --R.sub.4 wherein: R 1 is selected from the group consisting of: an alkyl ether group derived from an alcohol having from about 4 to about 10 carbon atoms; an ether group derived from a bisphenol A moiety; an ether group derived from an epoxy moiety; or mixtures thereof; and, m is selected to be from about 1 to about 10; R 2 and R 3 are interchangeable in their order within the formula and are utilized in blocks or random order in the formula; R 2 is selected from the group consisting of: ##STR4## and mixtures thereof; and R 3 is selected from the group consisting of ##STR5## and mixtures thereof: and R 4 is selected from the group consisting of H, CH 3 , an alkyl group, a hydroxyalkyl group, alkylether groups having 1 to 3 carbons, a polar alkyl group, an ionic constituent or an alkyl group having an ionic constituent and mixtures thereof wherein n and o are selected such that the ratio of n to o is from about 1/2:1 to about 1:30 and such that the functional fluid has a molecular weight of from about 500 to 10,000.

Claim 4

The bath of claim 2 wherein said molecular weight of said functional fluid is from about 1,000 to about 2,500.

Claim 5

The bath of claim 2 wherein said functional fluid is used in amounts of from about 1 to about 1,000 mg/l.

Claim 6

The bath of claim 2 wherein said ratio of n to o is from about 1:1 to about 1:20.

Claim 7

The bath of claim 2 wherein R 1 is an alkyl ether derived from an alcohol or epoxy having from about 4 to about 6 carbon atoms.

Claim 8

The bath of claim 2 wherein said functional fluid is used in amounts of from about 10 to about 1,200 mg/l.

Claim 9

The bath of claim 2 wherein m is from about 1 to about 3.

Claim 10

A process for electrolytic depositing of a copper deposit onto a substrate comprising the steps of: 1) providing an improved high acid/low copper plating bath having from about 15 to about 45 g/l copper ions, from about 45 to about 262 g/l of an acid and a bath soluble multi-functional polymer having at least one 4 to 10 carbon chain ether group derived from an alcohol and having a bisphenol A or an epoxy, propoxy and ethoxy functionality contained in said solution in effective amounts for leveling of imperfections and good adhesion and ductility; 2) providing a substrate for electrolytic plating thereover and immersing said substrate in the bath; and 3) subjecting said bath to a sufficient electroplating current for depositing the copper deposit on the substrate, wherein the copper deposit provides enough thickness and conductivity to allow any desired further processing of the work.

Claim 11

A process for electrolytic depositing of a copper deposit onto a substrate comprising the steps of: 1) providing an improved high acid/low copper plating bath having from about 15 to about 45 g/l copper ions, from about 45 to about 262 g/l of an acid and a bath soluble multi-functional polymer having at least one 4 to 10 carbon chain ether group derived from an alcohol and having a bisphenol A or an epoxy, propoxy and ethoxy functionality contained in said solution in effective amounts for leveling of imperfections and good adhesion and ductility; 2) providing a substrate for electrolytic plating thereover and immersing said substrate in the bath; and 3) subjecting said bath to a sufficient electroplating current for depositing the copper deposit on the substrate, wherein the copper deposit provides enough thickness and conductivity to allow any desired further processing of the work.

Claim 12

The process of claim 9 wherein said functional polymer is a functional fluid having the formula: (R.sub.1).sub.m --(R.sub.2).sub.n --(R.sub.3).sub.o --R.sub.4 wherein: R 1 is selected from the group consisting of: an ether group derived from an alcohol moiety having from about 4 to about 10 carbon atoms; an ether group derived from a bisphenol A moiety; an ether group derived from an epoxy; and mixtures thereof and m is selected to be from about 1 to about 10; R 2 and R 3 are interchangeable in their order within the formula; R 2 is selected from the group consisting of: ##STR6## and mixtures thereof; and R 3 is selected from the group consisting of ##STR7## and mixtures thereof; and R 4 selected from the group consisting of H, CH 3 , an alkyl group, a hydroxyalkyl group, alkylether groups having 1 to 3 carbons, a polar alkyl group, an ionic constituent or an alkyl group having an ionic constituent and mixtures thereof wherein n and o are selected such that the ratio of n to o is from about 1/2:1 to about 1:30 and such that the functional fluid has a molecular weight of from about 500 to 10.000.

Claim 13

The process of claim 10 wherein said functional fluid has a molecular weight of from about 1000 to about 2,500.

Claim 14

The process of claim 10 wherein the bath further comprises a barrel plating bath and in said bath comprising from about 10 to about 1,200 mg/l of said functional fluid.

Claim 15

The process of claim 10 wherein the bath further comprises a bath for depositing copper for use in electrical applications and comprises from about 20 to about 2,000 mg/l of the functional fluid.

Claim 16

The process of claim 10 wherein the bath further comprises a copper strike bath and comprises from about 1 to about 1000 mg/l of the functional fluid.

Claim 17

The process of claim 10 wherein the ratio of n to o is from about 1:1 to about 1:20.

Claim 18

The process of claim 10 wherein R 1 is an alkyl ether group derived from an alcohol or epoxy having from about 4 to about 6 carbon atoms.

Claim 19

The process of claim 10 wherein m is from about 1 to about 3.

Claim 20

An improved copper electroplating bath for plating of copper onto substrates comprising: from about 13 to about 45 g/l copper ions; from about 45 to about 262 g/l of an acid; effective amounts of brighteners and leveling additives; and from about 1 to about 2000 mg/l of a functional fluid having the formula: (R.sub.1).sub.m --(R.sub.2).sub.n --(R.sub.3).sub.o --R.sub.4 wherein: R 1 is selected from the group consisting of: an alkyl ether group derived from an alcohol having from about 4 to about 10 carbon atoms; an alkyl ether group derived from a bisphenol A moiety; an epoxy moiety; or mixtures thereof and m is selected to be from about 1 to about 3; R 2 and R 3 are interchangeable in their order within the formula; R 2 is selected from the group consisting of: ##STR8## and mixtures thereof; and R 3 is selected from the group consisting of ##STR9## and mixtures thereof; and R 4 is selected from the group consisting of H, CH 3 , an alkyl group, a hydroxyalkyl group, alkylether groups having 1 to 2 carbons, a polar alkyl group, an ionic constituent or an alkyl group having an ionic constituent and mixtures thereof wherein n and o are selected such that the ratio of n to o is from about 1/2:1 to about 1:30 and such that the functional fluid has a molecular weight of from about 500 to 10.000.

Claim 21

An improved copper electroplating bath for plating of copper onto substrates comprising: from about 13 to about 45 g/l copper ions; from about 45 to about 262 g/l of an acid; effective amounts of brighteners and leveling additives; and from about 1 to about 2000 mg/l of a functional fluid having the formula: (R.sub.1).sub.m --(R.sub.2).sub.n --(R.sub.3).sub.o --R.sub.4 wherein: R 1 is selected from the group consisting of: an alkyl ether group derived from an alcohol having from about 4 to about 10 carbon atoms; an alkyl ether group derived from a bisphenol A moiety; an epoxy moiety; or mixtures thereof and m is selected to be from about 1 to about 3; R 2 and R 3 are interchangeable in their order within the formula; R 2 is selected from the group consisting of: ##STR8## and mixtures thereof; and R 3 is selected from the group consisting of ##STR9## and mixtures thereof; and R 4 is selected from the group consisting of H, CH 3 , an alkyl group, a hydroxyalkyl group, alkylether groups having 1 to 2 carbons, a polar alkyl group, an ionic constituent or an alkyl group having an ionic constituent and mixtures thereof wherein n and o are selected such that the ratio of n to o is from about 1/2:1 to about 1:30 and such that the functional fluid has a molecular weight of from about 500 to 10.000.

Claim 22

The improved copper electroplating bath of claim 2 wherein said ionic constituent is selected from the group consisting of carboxylic acids, sulfates, sulfonates, phosphorates, alkali metal ions and mixtures thereof.

Claim 23

The process of claim 10 wherein said ionic constituent is selected from the group consisting of carboxylic acids, sulfates, sulfonates, phosphorates, alkali metal ions and mixtures thereof.

Claim 24

The process of claim 18 wherein said ionic constituent is selected from the group consisting of carboxylic acids, sulfates, sulfonates, phosphorates, alkali metal ions and mixtures thereof.