US5325012A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element
Assignee: Hitachi Engineering and Services Co Ltd
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Filing: 1992-02-20
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Granted: 1994-06-28
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Expires: 2012-02-20
Abstract
Abstract The features of the present invention are 1) to apply metallization on the bonding surface of a piezoelectric ceramic with a metal likely to react with the piezoelectric ceramic material, 2) when the piezoelectric ceramic material is soldered on the bonding surface, to apply metallization with a metal likely to react with the solder material, 3) to provide between the metallizing layers formed in 1) and 2) a metallizing layer including metal which prevents reaction between the metals and their diffusion, 4) to use a mounting member for the piezoelectric ceramic which has substantially the same thermal expansion coefficient as the piezoelectric ceramic in non-polarization condition and 5) to solder in the non-polarization condition and thereafter to polarize. As the result, a bonded type piezoelectric apparatus with a high reliability or with a broad application temperature range near from the absolute zero temperature to the Curie point of the piezoelectric element, and a method of manufacturing the same are provided.
Inventors
- 👤 Ichiya Sato
- 👤 Takao Yoneyama
- 👤 Hisanori Okamura
- 👤 Satoshi Kokura
- 👤 Minoru Yanagibashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:09
CPC Classifications
H; H10; H10N; H10N30/00; H10N30/01; H10N30/06; H10N30/07; H10N30/072; H10N30/073
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
88 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; and a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer.
Claim 2
Dependent Claim
88 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; and a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer.
Claim 3
Dependent Claim
27 words
A bonded type piezoelectric apparatus according to claim 1, wherein said solder layer is made of a material selected from the group consisting of gold and silver.
Claim 4
Dependent Claim
116 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer; and a barrier layer provided between said active layer and said solder layer, said barrier layer preventing diffusion of the metals in said active layer and said solder layer.
Claim 5
Dependent Claim
116 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of metal selected from the group consisting of Zr, Nb, Mo, Hf, Ta and W provided directly on said at least one planar surface; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer provided between said active layer and said securing member; a solder layer having a high fusibility with said bonding layer provided between said active layer and said bonding layer; and a barrier layer provided between said active layer and said solder layer, said barrier layer preventing diffusion of the metals in said active layer and said solder layer.
Claim 6
Dependent Claim
28 words
A bonded type piezoelectric apparatus according to claim 3, wherein said barrier layer is made of a material selected from the group consisting of Pt, Ni and Cr.
Claim 7
Dependent Claim
145 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member, wherein said securing member is made of a material having a thermal expansion coefficient substantially the same as that of said piezoelectric ceramic material when said piezoelectric ceramic material is in a non-polarization condition; wherein said solder layer is made of a metal having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member.
Claim 8
Dependent Claim
145 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member, wherein said securing member is made of a material having a thermal expansion coefficient substantially the same as that of said piezoelectric ceramic material when said piezoelectric ceramic material is in a non-polarization condition; wherein said solder layer is made of a metal having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member.
Claim 9
Dependent Claim
28 words
A bonded type piezoelectric apparatus according to claim 5, wherein said securing member is made of a material having a thermal expansion coefficient less than 6×10 -6 /°C.
Claim 10
Dependent Claim
18 words
A bonded type piezoelectric apparatus according to claim 5, wherein said securing member is a metal mounting plate.
Claim 11
Dependent Claim
120 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member; wherein said solder layer is made of a material selected from the group consisting of gold and silver having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member.
Claim 12
Dependent Claim
120 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member; wherein said solder layer is made of a material selected from the group consisting of gold and silver having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member.
Claim 13
Dependent Claim
142 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member, wherein said solder layer is made of a metal having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member; and further comprising a barrier layer provided between said active layer and said solder layer, said barrier layer preventing diffusion of the metals in said active layer and said solder layer.
Claim 14
Dependent Claim
142 words
A bonded type piezoelectric apparatus, comprising: a piezoelectric ceramic material having at least one planar surface; an active layer of a metal having a high fusibility with said piezoelectric ceramic material provided directly on said at least one planar surface; a solder layer provided on said active layer; a securing member to which said piezoelectric ceramic material is bonded via a bonding layer made of a metallic solder material provided between said solder layer and said securing member, wherein said solder layer is made of a metal having a high fusibility with said bonding layer and wherein said securing member is a metal mounting plate or an insulating ceramic securing member; and further comprising a barrier layer provided between said active layer and said solder layer, said barrier layer preventing diffusion of the metals in said active layer and said solder layer.
Claim 15
Dependent Claim
28 words
A bonded type piezoelectric apparatus according to claim 9, wherein said barrier layer is made of a material selected from the group consisting of Pt, Ni and Cr.
Claim 16
Dependent Claim
32 words
A bonded type piezoelectric apparatus according to claim 9, wherein said active layer is made of Ti, said barrier layer is made of Pt, and said solder layer is made of Au.
Claim 17
Dependent Claim
79 words
A bonded type piezoelectric apparatus comprising: a piezoelectric ceramic material having at least one planar surface; a metallizing layer provided directly on said one major planar surface; and a metal mounting plate to which said piezoelectric ceramic material is bonded via a bonding layer; wherein said metal mounting plate is made of a material having a thermal expansion coefficient substantially the same as that of said piezoelectric ceramic material when said piezoelectric ceramic material is in a non-polarization condition.
Claim 18
Dependent Claim
79 words
A bonded type piezoelectric apparatus comprising: a piezoelectric ceramic material having at least one planar surface; a metallizing layer provided directly on said one major planar surface; and a metal mounting plate to which said piezoelectric ceramic material is bonded via a bonding layer; wherein said metal mounting plate is made of a material having a thermal expansion coefficient substantially the same as that of said piezoelectric ceramic material when said piezoelectric ceramic material is in a non-polarization condition.
Claim 19
Dependent Claim
29 words
A bonded type piezoelectric apparatus according to claim 12, wherein said metal mounting plate is made of a material having a thermal expansion coefficient leas than 6×10 -6 /°C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |