Patent US5107950A successfully refreshed from Google Patents.
Patent US5319242A successfully refreshed from Google Patents.
US5319242A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package having an exposed die surface
Assignee: NXP USA Inc
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Filing: 1992-03-18
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Granted: 1994-06-07
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Expires: 2012-03-18
Abstract
Abstract A semiconductor package includes a die having a first surface including a plurality of bond pads disposed thereon and a second surface. Inner lead portions of a TAB leadframe are coupled to the bond pads and outer lead portions electrically coupled to the inner lead portions extend therefrom. An encapsulation is disposed on the first surface of the die including the bond pads having the inner lead portions of the TAB leadframe bonded thereto. Encapsulation is also disposed about the sides of the die. The second surface of the die remains exposed. This allows for a relatively thin package having superior thermal dissipation properties.
Inventors
- 👤 Francis J. Carney
- 👤 Edward M. Majors
- 👤 James H. Knapp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 17:18
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10D; H10D62/00; H10D62/10; H10D62/117; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/40; H10W70/453; H10W74/00; H10W74/10; H10W74/111
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
93 words
A semiconductor package comprising: a semiconductor die having a first surface including a plurality of bond pads disposed thereon, a second surface and sides between said first and second surface; a TAB leadframe having a plurality of inner lead portions coupled to said bond pads and a plurality of outer lead portions electrically coupled to said inner lead portions; a molded encapsulation disposed on said first surface including said bond pads and said inner lead portions of said leadframe and on said sides; and wherein said second surface of said die is exposed.
Claim 2
Dependent Claim
93 words
A semiconductor package comprising: a semiconductor die having a first surface including a plurality of bond pads disposed thereon, a second surface and sides between said first and second surface; a TAB leadframe having a plurality of inner lead portions coupled to said bond pads and a plurality of outer lead portions electrically coupled to said inner lead portions; a molded encapsulation disposed on said first surface including said bond pads and said inner lead portions of said leadframe and on said sides; and wherein said second surface of said die is exposed.
Claim 3
Dependent Claim
26 words
The package of claim 1 further including a protective coating disposed on the first surface of the die including the inner lead portions of the leadframe.
Claim 4
Dependent Claim
18 words
The package of claim 2 wherein the protective coating comprises a polyimide, an epoxy, a polyester or silicone.
Claim 5
Dependent Claim
20 words
The package of claim 1 wherein means comprise the die having its sides tapered inward adjacent to the second surface.
Claim 6
Dependent Claim
18 words
The package of claim 1 wherein the encapsulation comprises a polymer, a plastic, an epoxy or a polyester.
Claim 7
Dependent Claim
65 words
A semiconductor package comprising: a semiconductor die having a first surface, a second surface and sides therebetween; a leadframe having a plurality of leads electrically coupled to said die; protective means disposed on said first surface of said die including a portion of said leads coupled to said die; and a molded encapsulation disposed about said die except for said second surface which remains exposed.
Claim 8
Dependent Claim
65 words
A semiconductor package comprising: a semiconductor die having a first surface, a second surface and sides therebetween; a leadframe having a plurality of leads electrically coupled to said die; protective means disposed on said first surface of said die including a portion of said leads coupled to said die; and a molded encapsulation disposed about said die except for said second surface which remains exposed.
Claim 9
Dependent Claim
27 words
The package of claim 6 wherein the die includes bond pads disposed on the first surface thereof to which the leads of the leadframe are electrically coupled.
Claim 10
Dependent Claim
44 words
The package of claim 7 wherein the leadframe comprises a TAB leadframe having a plurality of inner lead portions physically and electrically coupled to the bond pads of the die and a plurality of outer lead portions electrically coupled to said inner lead portions.
Claim 11
Dependent Claim
17 words
The package of claim 6 wherein protective means comprise a coating of polyimide, epoxy, polyester or silicone.
Claim 12
Dependent Claim
23 words
The package of claim 6 wherein means for mechanically enhancing comprise the die having its sides tapered inward adjacent to the second surface.
Claim 13
Dependent Claim
18 words
The package of claim 6 wherein the encapsulation comprises a polymer, a plastic, an epoxy or a polyester.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-06 | 1997-12-06 | 1998-06-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-06 | 2001-12-06 | 2002-06-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-06 | 2005-12-06 | 2006-06-07 | $7700.00 | Window Closed / Lapsed |