JPS522282A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Hitachi Ltd
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Filing: 1975-06-24
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Granted: —
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Expires: 1995-06-24
Abstract
Abstract PURPOSE: A semiconductor device which facilitates automatic bonding of wires, by adhering lead wires on a header with an insulative adhesive layer, mounting a pellet on a tab lead, to heighten the accuracy of mounting positions of the lead wires and pellet. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Takeo Sato
- 👤 Osamu Ito
- 👤 Yuji Arai
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-08 17:13
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 0
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