Patent US5316853A successfully refreshed from Google Patents.
US5316853A
Expired / Lapsed
US
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Expand tape
Assignee: Rohm Co Ltd
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Filing: 1991-12-27
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Granted: 1994-05-31
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Expires: 2011-12-27
Abstract
Abstract An expand tape used for dicing a semiconductor wafer includes an expandable film, and a preform layer which is provided on the expandable film and is used at die-bonding chips of the diced semiconductor wafer to a frame.
Inventors
- 👤 Kazutaka Shibata
- 👤 Yutaka Murakami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:22
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P72/7416; H10P72/742; H10W; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07337; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10S; Y10S428/00; Y10S428/913; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31522; Y10T428/31529; Y10T428/31721
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
25 words
An expand tape for use at dicing of semiconductor wafers, comprising: an expandable synthetic resin film; and a preform layer provided on said expandable film.
Claim 2
Dependent Claim
25 words
An expand tape for use at dicing of semiconductor wafers, comprising: an expandable synthetic resin film; and a preform layer provided on said expandable film.
Claim 3
Dependent Claim
64 words
An expand tape for use at dicing of semiconductor wafers comprising an expandable synthetic resin film and a preform layer provided on said expandable film, wherein said preform is formed of a material selected from a group consisting of conductive paste of epoxy containing silver, conductive paste of polyimide containing silver, solder paste of Su-Pb, a layer containing Au-Si and a layer containing Au-Ge.
Claim 4
Dependent Claim
64 words
An expand tape for use at dicing of semiconductor wafers comprising an expandable synthetic resin film and a preform layer provided on said expandable film, wherein said preform is formed of a material selected from a group consisting of conductive paste of epoxy containing silver, conductive paste of polyimide containing silver, solder paste of Su-Pb, a layer containing Au-Si and a layer containing Au-Ge.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-30 | 1997-11-29 | 1998-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-30 | 2001-11-29 | 2002-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-30 | 2005-11-29 | 2006-05-31 | $7700.00 | Window Closed / Lapsed |