US4780371A
Expired / Lapsed
US
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Electrically conductive composition and use thereof
Assignee: International Business Machines Corp
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Filing: 1986-02-24
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Granted: 1988-10-25
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Expires: 2006-02-24
Abstract
Abstract An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electically conductive bond between a supporting substrate and a semiconductor.
Inventors
- 👤 Charles A. Joseph
- 👤 James R. Petrozello
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 23:52
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; C; C04; C04B; C04B26/00; C04B26/02; C04B26/10; C04B26/14; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31518; Y10T428/31522
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
116 words
A product comprising a substrate and a semiconductor wherein the semiconductor and substrate are bonded together by a composition containing: (A) about 15 to 65% by weight of a photosensitive epoxy polymer component; (B) about 1 to about 15% by weight of a plasticizer reactive with said epoxy component; and (C) about 25 to about 80% by weight of electrically conductive particles having electrically conductive outer surfaces selected from the group of platinum, palladium, gold or mixtures thereof, and being spherical in shape; wherein the above amounts of (A), (B) and (C) are based upon the total weight of (A), (B) and (C) and wherein said composition provides electrical conductivity between said semiconductor and said substrate.
Claim 2
Dependent Claim
116 words
A product comprising a substrate and a semiconductor wherein the semiconductor and substrate are bonded together by a composition containing: (A) about 15 to 65% by weight of a photosensitive epoxy polymer component; (B) about 1 to about 15% by weight of a plasticizer reactive with said epoxy component; and (C) about 25 to about 80% by weight of electrically conductive particles having electrically conductive outer surfaces selected from the group of platinum, palladium, gold or mixtures thereof, and being spherical in shape; wherein the above amounts of (A), (B) and (C) are based upon the total weight of (A), (B) and (C) and wherein said composition provides electrical conductivity between said semiconductor and said substrate.
Claim 3
Dependent Claim
25 words
The product of claim 1 wherein said epoxy polymer is a reaction product of an α, β ethylenically unsaturated carboxylic acid and epichlorohydrinbisphenol A epoxy.
Claim 4
Dependent Claim
18 words
The product of claim 1 wherein the plasticizer is a polyalkylene glycol, or polyoxyalkylene glycol, or mixtures thereof.
Claim 5
Dependent Claim
11 words
The product of claim 1 wherein said plasticizer is polyethylene glycol.
Claim 6
Dependent Claim
10 words
The product of claim 1 wherein said particles are hollow.
Claim 7
Dependent Claim
12 words
The product of claim 1 wherein said particles are hollow gold particles.
Claim 8
Dependent Claim
34 words
The product of claim 1 which contains about 35% to 45% by weight of (A), about 1% to about 10% by weight of (B), and about 35% to about 60% by weight of (C).
Claim 9
Dependent Claim
13 words
The product of claim 1 wherein said semiconductor is silicon or polycrystalline silicon.
Claim 10
Dependent Claim
12 words
The product of claim 8 wherein said substrate is a ceramic substrate.
Claim 11
Dependent Claim
12 words
The product of claim 1 wherein said substrate is a ceramic substrate.
Claim 12
Dependent Claim
81 words
The product of claim 1 wherein said composition further contains a (D) non-photosensitive epoxy polymer and (E) an anhydride and wherein the amount of (A) is about 15% to about 35% by weight, the amount of (B) is about 1 to about 4% by weight, the amount of (C) is about 25% to about by weight, the amount of (D) is about 20% to about 45% by weight, and the amount of (E) is about 10% to about 25% by weight.
Claim 13
Dependent Claim
20 words
The product of claim 11 wherein said composition further contains about 0.1% to about 3% by weight of an accelerator.
Claim 14
Dependent Claim
88 words
An electrically conductive composition containing: (A) about 15 to 65% by weight of a photosensitive epoxy polymer; (B) about 1 to about 15% by weight of a plasticizer reactive with said epoxy polymer component; and (C) about 25 to about 80% by weight of electrically conductive particles having electrically conductive outer surfaces selected from the group of platinum, palladium, gold or mixtures thereof, and being spherical in shape; wherein the above amounts of (A), (B) and (C) are based upon the total weight of (A), (B), and (C).
Claim 15
Dependent Claim
88 words
An electrically conductive composition containing: (A) about 15 to 65% by weight of a photosensitive epoxy polymer; (B) about 1 to about 15% by weight of a plasticizer reactive with said epoxy polymer component; and (C) about 25 to about 80% by weight of electrically conductive particles having electrically conductive outer surfaces selected from the group of platinum, palladium, gold or mixtures thereof, and being spherical in shape; wherein the above amounts of (A), (B) and (C) are based upon the total weight of (A), (B), and (C).
Claim 16
Dependent Claim
26 words
The composition of claim 13 wherein said epoxy polymer is a reaction product of an α, β ethylenically unsaturated carboxylic acid and epichlorohydrin bisphenol A epoxy.
Claim 17
Dependent Claim
18 words
The composition of claim 13 wherein the plasticizer is a polyalkylene glycol, or polyoxyalkylene glycol, or mixtures thereof.
Claim 18
Dependent Claim
11 words
The composition of claim 13 wherein said plasticizer is polyethylene glycol.
Claim 19
Dependent Claim
10 words
The composition of claim 13 wherein said particles are hollow.
Claim 20
Dependent Claim
12 words
The composition of claim 13 wherein said particles are hollow gold particles.
Claim 21
Dependent Claim
34 words
The composition of claim 13 which contains about 35% to 45% by weight of (A), about 1% to about 10% by weight of (B), and about 35% to about 60% by weight of (C).
Claim 22
Dependent Claim
50 words
The product of claim 1 wherein said substrate is a ceramic substrate, said semiconductor is silicon or polycrystalline silicon, said epoxy polymer is a reaction product of an α,β ethylenically unsaturated carboxylic acid and epichloroxydiin bisphenol A epoxy, said plasticizer is polyethylene glycol, and said particles are hollow gold particles.
Claim 23
Dependent Claim
34 words
The product of claim 20 which contains about 35% to 45% by weight of (A), about 1% to about 10% by weight of (B), and about 35% to about 60% by weight of (C).
Claim 24
Dependent Claim
79 words
The product of claim 1 which further contains (D) non-photosensitive epoxy polymer and (E) an anhydride, and wherein the amount of (A) is about 15% to about 35% by weight, the amount of (B) is about 1% to about 4% by weight, the amount of (C) is about 25% to about 45% by weight, the amount of (D) is about 20% to about 45% by weight, and the amount of (E) is about 10% to about 25% by weight.
Claim 25
Dependent Claim
18 words
The composition of claim 22 which also includes about 0.1% to about 3% by weight of an accelerator.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-10-25 | 1992-04-25 | 1992-10-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-10-25 | 1996-04-25 | 1996-10-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-10-25 | 2000-04-25 | 2000-10-25 | $7700.00 | Window Closed / Lapsed |