Patent US5316586A successfully refreshed from Google Patents.
US5316586A
Expired / Lapsed
US
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Silicon sample holder for molecular beam epitaxy on pre-fabricated integrated circuits
Assignee: California Institute of Technology
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Filing: 1992-06-26
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Granted: 1994-05-31
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Expires: 2012-06-26
Abstract
Abstract The sample holder of the invention is formed of the same semiconductor crystal as the integrated circuit on which the molecular beam expitaxial process is to be performed. In the preferred embodiment, the sample holder comprises three stacked micro-machined silicon wafers: a silicon base wafer having a square micro-machined center opening corresponding in size and shape to the active area of a CCD imager chip, a silicon center wafer micro-machined as an annulus having radially inwardly pointing fingers whose ends abut the edges of and center the CCD imager chip within the annulus, and a silicon top wafer micro-machined as an annulus having cantilevered membranes which extend over the top of the CCD imager chip. The micro-machined silicon wafers are stacked in the order given above with the CCD imager chip centered in the center wafer and sandwiched between the base and top wafers. The thickness of the center wafer is about 20% less than the thickness of the CCD imager chip. Preferably, four titanium wires, each grasping the edges of the top and base wafers, compress all three wafers together, flexing the cantilever fingers of the top wafer to accommodate the thickness of the CCD imager chip, acting as a spring holding the CCD imager chip in place.
Inventors
- 👤 Michael E. Hoenk
- 👤 Paula J. Grunthaner
- 👤 Frank J. Grunthaner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 14:37
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/50; C30; C30B; C30B23/00; C30B23/02
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
60 words
Apparatus for holding an integrated circuit, said integrated circuit comprising a thin planar substrate of a particular type of semiconductor material, said apparatus comprising: top and bottom planar plates comprising said type of semiconductor material; means for drawing said top and bottom planar plates toward one another whereby to sandwich said planar substrate between said top and bottom planar plates.
Claim 2
Dependent Claim
60 words
Apparatus for holding an integrated circuit, said integrated circuit comprising a thin planar substrate of a particular type of semiconductor material, said apparatus comprising: top and bottom planar plates comprising said type of semiconductor material; means for drawing said top and bottom planar plates toward one another whereby to sandwich said planar substrate between said top and bottom planar plates.
Claim 3
Dependent Claim
42 words
The apparatus of claim 1 further comprising a middle plate comprising said type of semiconductor material sandwiched between said top and bottom plates and surrounding said planar substrate whereby to center said planar substrate with respect to said top and bottom plates.
Claim 4
Dependent Claim
74 words
The apparatus of claim 2 wherein said means for drawing said top and bottom plates toward one another fastens to outer edges of said top and bottom plates and wherein said center plate has a thickness less than that of said planar substrate, whereby said means for drawing causes said top plate to elastically deform upwardly by a distance corresponding to a difference between the thicknesses of said center plate and said planar substrate.
Claim 5
Dependent Claim
18 words
The apparatus of claim 3 wherein said bottom, center and top plates comprise discs micro-machined from semiconductor wafers.
Claim 6
Dependent Claim
33 words
The apparatus of claim 4 wherein the disc of said bottom plate has an opening in the center thereof corresponding in shape and size to an optically active area of said integrated circuit.
Claim 7
Dependent Claim
34 words
The apparatus of claim 5 wherein the disc of said center plate comprises an open area in the center thereof including edge surfaces terminating at locii corresponding an outer edge of said planar substrate.
Claim 8
Dependent Claim
53 words
The apparatus of claim 6 wherein the disc of said top plate comprises an open area in the center thereof and planar fingers extending into said opening, said planar fingers being elastically deformed whenever said means for drawing draws said top and bottom plates toward one another with said planar substrate sandwiched therebetween.
Claim 9
Dependent Claim
83 words
Apparatus for holding an imager chip, said imager chip comprising a planar substrate having a thinned back side and electronic circuit elements formed on its front side, for molecular beam epitaxial growth on said back side of a doped semiconductor layer of the same type of semiconductor material as said imager chip within a chamber of a molecular beam epitaxy system, said apparatus comprising: a base plate for supporting said imager chip, said base plate formed purely of said type of semiconductor material.
Claim 10
Dependent Claim
83 words
Apparatus for holding an imager chip, said imager chip comprising a planar substrate having a thinned back side and electronic circuit elements formed on its front side, for molecular beam epitaxial growth on said back side of a doped semiconductor layer of the same type of semiconductor material as said imager chip within a chamber of a molecular beam epitaxy system, said apparatus comprising: a base plate for supporting said imager chip, said base plate formed purely of said type of semiconductor material.
Claim 11
Dependent Claim
42 words
The apparatus of claim 8 further comprising: a top plate formed purely of said type of semiconductor material; means for drawing said top and base plates toward one another whereby to sandwich said planar substrate between said top and bottom planar plates.
Claim 12
Dependent Claim
42 words
The apparatus of claim 9 further comprising a middle plate comprising said type of semiconductor material sandwiched between said top and base plates and surrounding said planar substrate whereby to center said planar substrate with respect to said top and base plates.
Claim 13
Dependent Claim
78 words
The apparatus of claim 10 wherein said means for drawing said top and bottom plates toward one another fastens to outer edges of said top and base plates and wherein said center plate has a thickness less than that of said planar substrate, whereby said means for drawing causes at least portions of said top plate to elastically deform upwardly by a distance corresponding to a difference between the thicknesses of said center plate and said planar substrate.
Claim 14
Dependent Claim
18 words
The apparatus of claim 11 wherein said bottom, center and top plates comprise discs micro-machined from semiconductor wafers.
Claim 15
Dependent Claim
33 words
The apparatus of claim 12 wherein the disc of said bottom plate has an opening in the center thereof corresponding in shape and size to an optically active area of said integrated circuit.
Claim 16
Dependent Claim
39 words
The apparatus of claim 13 wherein the disc of said center plate comprises an open area in the center thereof including edge surfaces terminating at locations corresponding to an outer edge of said planar substrate of said integrated circuit.
Claim 17
Dependent Claim
53 words
The apparatus of claim 14 wherein the disc of said top plate comprises an open area in the center thereof and planar fingers extending into said opening, said planar fingers being elastically deformed whenever said means for drawing draws said top and bottom plates toward one another with said planar substrate sandwiched therebetween.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 1997-05-30 | 1997-11-29 | 1998-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-30 | 2001-11-29 | 2002-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-30 | 2005-11-29 | 2006-05-31 | $7700.00 | Window Closed / Lapsed |