Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
227 words
An electronic circuit package comprising: first and second modules each having opposite connecting surfaces, at least a part of one of said connecting surfaces of one of said modules being contiguous to at least a part of one of said connecting surfaces of the other of said modules, said modules each being a low temperature co-fired ceramic (LTCC) monolithic structure comprising: a plurality of cofired ceramic dielectric layers in a stacked assembly, and a conductive pattern on one surface of some of said plurality of dielectric layers such that said conductive patterns are separated by said dielectric layers in said stacked assembly, the other of said connecting surfaces of each module being on opposite sides of said stacked assembly, and said connecting surfaces having co-fired mating features therein, wherein said first module has said mating features comprising a first pattern of protrusions projecting from one of its connecting surfaces, said second module has said mating features comprising a second pattern of depressions in one of its connecting surfaces, said patterns having at least pattern portions in mating engagement with each other, with protrusions of said portions of said first pattern being received in depressions of said portions of said second pattern, and wherein said opposite connecting surface of at least one module has the other of protrusion and depression mating features for making electronic circuit package connections.
Claim 2
Dependent Claim
227 words
An electronic circuit package comprising: first and second modules each having opposite connecting surfaces, at least a part of one of said connecting surfaces of one of said modules being contiguous to at least a part of one of said connecting surfaces of the other of said modules, said modules each being a low temperature co-fired ceramic (LTCC) monolithic structure comprising: a plurality of cofired ceramic dielectric layers in a stacked assembly, and a conductive pattern on one surface of some of said plurality of dielectric layers such that said conductive patterns are separated by said dielectric layers in said stacked assembly, the other of said connecting surfaces of each module being on opposite sides of said stacked assembly, and said connecting surfaces having co-fired mating features therein, wherein said first module has said mating features comprising a first pattern of protrusions projecting from one of its connecting surfaces, said second module has said mating features comprising a second pattern of depressions in one of its connecting surfaces, said patterns having at least pattern portions in mating engagement with each other, with protrusions of said portions of said first pattern being received in depressions of said portions of said second pattern, and wherein said opposite connecting surface of at least one module has the other of protrusion and depression mating features for making electronic circuit package connections.
Claim 3
Dependent Claim
21 words
The package of claim 1 wherein said protrusions and depressions are configured and arranged to register said modules to one another.
Claim 4
Dependent Claim
22 words
The package of claim 1 wherein said protrusions and depressions are configured and arranged to connect said modules to one another electrically.
Claim 5
Dependent Claim
22 words
The package of claim 1 wherein said protrusions and depressions are configured and arranged to connect said modules to one another mechanically.
Claim 6
Dependent Claim
24 words
The package of claim 1 wherein said patterns are a mechanical snap fit with one another to physically connect the modules to each other.
Claim 7
Dependent Claim
19 words
The package of claim 1 wherein said engaging patterns include pairs of protrusions and depressions that are electrically interconnected.
Claim 8
Dependent Claim
26 words
The package of claim 1 wherein said patterns are formed by arrays of protrusions and depressions of which at least some are metallized and electrically interconnected.
Claim 9
Dependent Claim
18 words
The package of claim 1 wherein said first module comprises a cover for protection of said second module.
Claim 10
Dependent Claim
56 words
The package of claim 8 wherein said first pattern of protrusions comprises a continuous tongue extending around the perimeter of said first module, and wherein said second pattern comprises a continuous groove extending around the perimeter of said second module, said groove receiving said tongue in sealing relation to seal said cover to said second module.
Claim 11
Dependent Claim
44 words
The package of claim 1 wherein both said modules include circuit layers, wherein said patterns are a friction fit with one another and at least some mating pairs of depressions and protrusions are metallized and connected electrically to circuit layers in the respective modules.
Claim 12
Dependent Claim
78 words
The package of claim 1 including a third module, said third module having a connecting surface with a third pattern of depressions projecting therefrom, said third pattern depression being in mating engagement with a portion of the first pattern of protrusions on said first module, said first moduler bridging between said second and third modules to provide a physical and electrical interconnection therebetween, at least some of said depressions and protrusions having conductive surfaces to provide electrical connections.
Claim 13
Dependent Claim
38 words
The package of claim 1 wherein said first module comprises a circuity test board and said second module comprises a circuit module to be tested, and wherein said first and second modules are electrically secured to each other.
Claim 14
Dependent Claim
29 words
The package of claim 3 wherein said protrusions of one said module physically snap-fit into said depressions of the other said module to further mechanically connect said modules together.
Claim 15
Dependent Claim
27 words
The package of claim 4 wherein said protrusions of one said module snap-fit into said depressions of the other said module to mechanically connect said modules together.