Electronic circuit module with power feed spring assembly

Claim 1

An electronic circuit module comprising: an insulative substrate having an array of male connectors arranged thereon for engagement with external female connectors and an electrically conductive layer of power distribution pattern embedded therein and coupled to said male connectors; an array of integrated circuit packages, each including an electrically conductive housing, an integrated circuit chip secured thereto in a thermally conductive relationship, a base plate having a conductive pattern embedded therein and connected to said conductive housing, means establishing a source/ground current conduction path between said conductive pattern and said integrated circuit chip, and means establishing a drain/source current conduction path between said integrated circuit chip and the layer of said insulative substrate; a spring assembly including an array of electrically conductive springs and means supporting said springs in pressure contact relationship with the conductive housings of successive integrated circuit packages, said spring assembly being adapted to be coupled to an external power voltage terminal for supplying power to said integrated circuit packages; and cooling means defining an array of cooling surfaces respectively contacting said conductive housings of the integrated circuit packages in a thermally conductive relationship.