Patent US5314842A successfully refreshed from Google Patents.
US5314842A
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Resin-sealed type semiconductor device and method for manufacturing the same
Assignee: Toshiba Corp
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Filing: 1992-09-14
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Granted: 1994-05-24
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Expires: 2012-09-14
Abstract
Abstract A resin-sealed type semiconductor device comprises a lead frame having a bed and external leads, a semiconductor element mounted on the bed and having electrodes, a fine metal wire for making an electrical connection between the electrode and the lead frame, a resin layer which seals the semiconductor element, fine metal wire and portion of the lead frame therein and a recess formed at a central portion of one surface side of the resin layer and having a controlled depth, whereby the development of cracks in the resin layer as caused by heat load is prevented.
Inventors
- 👤 Hiromichi Sawaya
- 👤 Toshio Ishigami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10689; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
129 words
A method for manufacturing a resin-sealed type semiconductor device, comprising the steps of: preparing a lead frame having a bed and external leads, mounting a semiconductor element on the bed, said semiconductor element having at least one electrode; electrically connecting the lead frame to the electrode by a fine metal wire; fixedly sealing said semiconductor element, said fine metal wire and a portion of said lead frame with a resin layer formed in a mold; and forming a recess having a controlled depth of about 60 μm or less in the resin layer by knocking the resin layer out of the mold with an ejector pin, the controlled depth being sufficiently shallow to substantially prevent cracks from occurring in the bottom of the recess during a subsequent soldering process.
Claim 2
Independent Claim
129 words
A method for manufacturing a resin-sealed type semiconductor device, comprising the steps of: preparing a lead frame having a bed and external leads, mounting a semiconductor element on the bed, said semiconductor element having at least one electrode; electrically connecting the lead frame to the electrode by a fine metal wire; fixedly sealing said semiconductor element, said fine metal wire and a portion of said lead frame with a resin layer formed in a mold; and forming a recess having a controlled depth of about 60 μm or less in the resin layer by knocking the resin layer out of the mold with an ejector pin, the controlled depth being sufficiently shallow to substantially prevent cracks from occurring in the bottom of the recess during a subsequent soldering process.
Claim 3
Dependent Claim
44 words
The method according to claim 1, wherein said recess is formed on a side opposite to that on which said semiconductor element is located, said recess being in an opposing relation to the semiconductor element and being smaller in dimension than the semiconductor element.
Claim 4
Independent Claim
155 words
A method for manufacturing a resin-sealed type semiconductor device, comprising the steps of: preparing a lead frame having a bed and external leads; mounting a semiconductor element on the bed, the semiconductor element having at least one electrode; electrically connecting the lead frame to the electrode by a fine metal wire; fixedly sealing the semiconductor element, fine metal wire and a portion of the lead frame with a resin layer formed in a mold; forming a recess having a controlled depth of about 60 μm or less in the resin layer by knocking the resin layer out of the mold with an ejector pin; temporarily fixing the resin layer to a mount substrate by coating a bond material near the recess; and fixedly soldering the external lead to the substrate, the controlled depth of the recess being sufficiently shallow to substantially prevent cracks from occurring in the bottom of the recess during the soldering step.
Claim 5
Independent Claim
155 words
A method for manufacturing a resin-sealed type semiconductor device, comprising the steps of: preparing a lead frame having a bed and external leads; mounting a semiconductor element on the bed, the semiconductor element having at least one electrode; electrically connecting the lead frame to the electrode by a fine metal wire; fixedly sealing the semiconductor element, fine metal wire and a portion of the lead frame with a resin layer formed in a mold; forming a recess having a controlled depth of about 60 μm or less in the resin layer by knocking the resin layer out of the mold with an ejector pin; temporarily fixing the resin layer to a mount substrate by coating a bond material near the recess; and fixedly soldering the external lead to the substrate, the controlled depth of the recess being sufficiently shallow to substantially prevent cracks from occurring in the bottom of the recess during the soldering step.
Claim 6
Dependent Claim
43 words
The method according to claim 3, wherein said recess is formed on a side opposite to that on which said semiconductor element is located, said recess being an opposing relation to the semiconductor element and being smaller in dimension than the semiconductor element.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-23 | 1997-11-22 | 1998-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-23 | 2001-11-22 | 2002-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-23 | 2005-11-22 | 2006-05-24 | $7700.00 | Window Closed / Lapsed |