Patent US5309016A successfully refreshed from Google Patents.
US5309016A
Expired / Lapsed
US
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Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads
Assignee: Fujitsu Semiconductor Ltd
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Filing: 1992-05-29
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Granted: 1994-05-03
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Expires: 2012-05-29
Abstract
Abstract A semiconductor integrated circuit device includes a semiconductor element having pads, a lead frame stage on which the semiconductor element is mounted, and a plurality of terminal members mounted on the lead frame stage and located outside the semiconductor element, the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the semiconductor element is made. The device includes inner leads spaced part from the lead frame stage, a first group of bonding members connecting the pads of the semiconductor element and the electrically conductive patterns of the terminal members to each other, and a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other.
Inventors
- 👤 Junichi Kasai
- 👤 Michio Sono
- 👤 Tosiyuki Honda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:54
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
130 words
A semiconductor integrated circuit device comprising: an integrated circuit chip having pads; a lead frame stage having first and second areas, the integrated circuit chip being mounted on the first area; a plurality of terminal members mounted on the second area of the lead frame stage, the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the integrated circuit chip is made; inner leads spaced apart from the lead frame stage; a first group of bonding members connecting the pads of the integrated circuit chip and the electrically conductive patterns of the terminal members to each other; and a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other.
Claim 2
Dependent Claim
130 words
A semiconductor integrated circuit device comprising: an integrated circuit chip having pads; a lead frame stage having first and second areas, the integrated circuit chip being mounted on the first area; a plurality of terminal members mounted on the second area of the lead frame stage, the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the integrated circuit chip is made; inner leads spaced apart from the lead frame stage; a first group of bonding members connecting the pads of the integrated circuit chip and the electrically conductive patterns of the terminal members to each other; and a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other.
Claim 3
Dependent Claim
24 words
A semiconductor integrated circuit device s claimed in claim 1, wherein said terminal members are located along peripheral edges of said integrated circuit chip.
Claim 4
Dependent Claim
23 words
A semiconductor integrated circuit device as claimed in claim 1, wherein: said integrated circuit chip comprises silicon; and said terminal members comprises silicon.
Claim 5
Dependent Claim
35 words
A semiconductor integrated circuit device as claimed in claim 1, wherein the pads of said integrated circuit chip are located at a level identical to that of the electrically conductive patterns of said terminal members.
Claim 6
Dependent Claim
30 words
A semiconductor integrated circuit device as claimed in claim 1, wherein the electrically conductive patterns are arranged in a line on an upper surface of each of the terminal members.
Claim 7
Dependent Claim
20 words
A semiconductor integrated circuit device as claimed in claim 1, wherein each of the terminal members has a rectangular shape.
Claim 8
Dependent Claim
48 words
A semiconductor integrated circuit device as claimed in claim 1, wherein: each of the terminal members comprises an insulating layer formed in a surface portion of each of the terminal members; and the electrically conductive patterns are formed on the insulating layer of each of the terminal members.
Claim 9
Dependent Claim
24 words
A semiconductor integrated circuit device as claimed in claim 1, wherein each of the terminal members comprises an identical number of electrically conductive patterns.
Claim 10
Dependent Claim
168 words
A semiconductor integrated circuit device comprising: an integrated circuit chip having pads; a lead frame stage having first and second areas, the integrated circuit chip being mounted on the first area; a plurality of terminal members mounted on a second area of the lead frame stage, the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the integrated circuit chip is made, a first of the terminal members comprising a first number of electrically conductive patterns, and a second of the terminal members comprising a second number of electrically conductive patterns different from the first number of electrically conductive patterns; inner leads spaced apart from the lead frame stage; a first group of bonding members connecting the pads of the integrated circuit chip and the electrically conductive patterns of the terminal members to each other; and a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other.
Claim 11
Dependent Claim
168 words
A semiconductor integrated circuit device comprising: an integrated circuit chip having pads; a lead frame stage having first and second areas, the integrated circuit chip being mounted on the first area; a plurality of terminal members mounted on a second area of the lead frame stage, the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the integrated circuit chip is made, a first of the terminal members comprising a first number of electrically conductive patterns, and a second of the terminal members comprising a second number of electrically conductive patterns different from the first number of electrically conductive patterns; inner leads spaced apart from the lead frame stage; a first group of bonding members connecting the pads of the integrated circuit chip and the electrically conductive patterns of the terminal members to each other; and a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other.
Claim 12
Dependent Claim
29 words
A semiconductor integrated circuit device as claimed in claim 1, wherein the integrated circuit chip and the terminal members are fixed to the lead frame stage by die bonding.
Claim 13
Dependent Claim
22 words
A semiconductor integrated circuit device as claimed in claim 1, wherein the inner leads are radially arranged around the lead frame stage.
Claim 14
Dependent Claim
149 words
A semiconductor integrated circuit device comprising: an integrated circuit chip having pads; a lead frame stage; a terminal member mounted on the lead frame stage, the terminal member having an upper surface with first and second areas said integrated circuit chip being mounted on the first area of the upper surface of the terminal member, said terminal member being made of a material identical to a material of which the integrated circuit chip is made; electrically conductive patterns formed on the second area of the upper surface of the terminal member; inner leads spaced apart from the lead frame stage; a first group of bonding members connecting the pads of said integrated circuit chip and the electrically conductive patterns of the terminal member to each other; and a second group of bonding members connecting the electrically conductive patterns of the terminal member and the inner leads to each other.
Claim 15
Dependent Claim
149 words
A semiconductor integrated circuit device comprising: an integrated circuit chip having pads; a lead frame stage; a terminal member mounted on the lead frame stage, the terminal member having an upper surface with first and second areas said integrated circuit chip being mounted on the first area of the upper surface of the terminal member, said terminal member being made of a material identical to a material of which the integrated circuit chip is made; electrically conductive patterns formed on the second area of the upper surface of the terminal member; inner leads spaced apart from the lead frame stage; a first group of bonding members connecting the pads of said integrated circuit chip and the electrically conductive patterns of the terminal member to each other; and a second group of bonding members connecting the electrically conductive patterns of the terminal member and the inner leads to each other.
Claim 16
Dependent Claim
24 words
A semiconductor integrated circuit device as claimed in claim 12, wherein said terminal members are located along peripheral edges of said integrated circuit chip.
Claim 17
Dependent Claim
23 words
A semiconductor integrated circuit device as claimed in claim 12, wherein: said integrated circuit chip comprises silicon; and said terminal member comprises silicon.
Claim 18
Dependent Claim
35 words
A semiconductor integrated circuit device as claimed in claim 12, wherein the pads of said integrated circuit chip are located at a level identical to that of the electrically conductive patterns of said terminal member.
Claim 19
Dependent Claim
28 words
A semiconductor integrated circuit device as claimed in claim 12, wherein the electrically conductive patterns are arranged in a line on the upper surface of the terminal member.
Claim 20
Dependent Claim
18 words
A semiconductor integrated circuit device as claimed in claim 12, wherein the terminal member has a plate shape.
Claim 21
Dependent Claim
42 words
A semiconductor integrated circuit device as claimed in claim 12, wherein: the terminal member comprises an insulating layer formed in the upper surface of the terminal member; and the electrically conductive patterns are formed on the insulating layer of the terminal member.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-02 | 1997-11-01 | 1998-05-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-02 | 2001-11-01 | 2002-05-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-02 | 2005-11-01 | 2006-05-03 | $7700.00 | Window Closed / Lapsed |