Leads for semiconductor chip assembly and method

Claim 1

A method of making a semiconductor device with leads formed directly on the semiconductor chip, comprising the steps of: forming a semiconductor device with bond pads thereon in a central conductive area of a semiconductor chip leaving a peripheral area of non-conductive semiconductor material that is electrically separate from the semiconductor device; forming a plurality of conductors on said non-conductive peripheral area around said centrally located semiconductor device, said conductors being electrically connected to said semiconductor device; bonding and forming a lead wire from a continuous wire feed source to each of said conductors; and cutting said formed lead wire to length.

Claim 2

A method of making a semiconductor device with leads formed directly on the semiconductor chip, comprising the steps of: forming a semiconductor device with bond pads thereon in a central conductive area of a semiconductor chip leaving a peripheral area of non-conductive semiconductor material that is electrically separate from the semiconductor device; forming a plurality of conductors on said non-conductive peripheral area around said centrally located semiconductor device, said conductors being electrically connected to said semiconductor device; bonding and forming a lead wire from a continuous wire feed source to each of said conductors; and cutting said formed lead wire to length.

Claim 7

A method of making a semiconductor device with leads formed directly on the semiconductor chip, comprising the steps of: forming a semiconductor device with bond pads thereon in a first conductive area of a semiconductor chip leaving a second non-conductive area of semiconductor material that is separate from the semiconductor device; forming a plurality of conductors on said second non-conductive area adjacent said first area, and electrically connecting them to the bond pads on said semiconductor device; electrically connecting and forming a lead wire to each conductor on said second area of said semiconductor chip; and encapsulating only the top surface of the device.

Claim 8

A method of making a semiconductor device with leads formed directly on the semiconductor chip, comprising the steps of: forming a semiconductor device with bond pads thereon in a first conductive area of a semiconductor chip leaving a second non-conductive area of semiconductor material that is separate from the semiconductor device; forming a plurality of conductors on said second non-conductive area adjacent said first area, and electrically connecting them to the bond pads on said semiconductor device; electrically connecting and forming a lead wire to each conductor on said second area of said semiconductor chip; and encapsulating only the top surface of the device.