Polymeric composite lead wire and method for making same

Claim 2

An electrical lead comprising an elongated polymeric dielectric core and a conducting metal layer disposed thereon, said conducting metal layer having a first conductive path disposed along a first peripheral edge region of said polymeric dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path.

Claim 3

The electrical lead of claim 1, wherein said polymeric dielectric core comprises an elongated structure having top and bottom planar surfaces, said conducting metal layer disposed substantially over said top and bottom planar surfaces for providing said first and second conductive paths.

Claim 4

The electrical lead of claim 2, wherein said first and second conductive paths are electrically insulated from one another by removing a portion of said conducting metal layer to expose a portion of said polymeric dielectric core.

Claim 5

The electrical lead of claim 2, wherein said first and second conductive paths comprise copper.

Claim 6

The electrical lead of claim 1, wherein said polymeric dielectric core comprises a fiber-reinforced resin.

Claim 7

The electrical lead of claim 1 further comprising assembly joining means for connecting said electrical lead to a second electrical lead.

Claim 8

The electrical lead of claim 6, wherein said assembly joining means comprises a laterally displaced projection of said polymeric dielectric core.

Claim 9

The electrical lead of claim 1, wherein said conducting metal layer comprises a metal foil laminated to said core.

Claim 10

The electrical lead of claim 8, wherein said laminated metal comprises an extended foot portion.

Claim 11

The electrical lead of claim 9, wherein said extended foot portion comprises a tinned surface.

Claim 12

An electrical lead suitable for providing circuit continuity between an electronic device and a printed circuit board, said lead comprising an elongated polymeric dielectric core having disposed thereon a metallic conductor layer comprising at least two separate conductive paths including a first conductive path disposed along a first peripheral edge region of said polymeric dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path.

Claim 13

An electrical lead suitable for providing circuit continuity between an electronic device and a printed circuit board, said lead comprising an elongated polymeric dielectric core having disposed thereon a metallic conductor layer comprising at least two separate conductive paths including a first conductive path disposed along a first peripheral edge region of said polymeric dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path.

Claim 14

The electrical lead of claim 11, wherein said polymeric dielectric core comprises a plateable resin.

Claim 15

The electrical lead of claim 11, wherein said plateable resin comprises reinforcing glass fibers.

Claim 16

The electrical lead of claim 11, wherein said metallic conductor layer comprises electroless copper.

Claim 17

The electrical lead of claim 14 further comprising an electroplated copper layer disposed on said electroless copper layer.

Claim 18

The electrical lead of claim 15 further comprising a solder tinning layer disposed on said electroplated copper layer.

Claim 19

A semiconductor device comprising a molded main body containing an electronic circuit element and a plurality of electrical leads extending therefrom and existing said main body, each of said leads comprising a polymeric dielectric core having disposed thereon a metallic conductor layer comprising at least two separate conductor paths for connecting a pair of terminals disposed on said circuit element to a pair of conductive surfaces on a printed circuit board, a first conductor paths being disposed along peripheral edge regions of said dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path by an exposed portion of said polymeric dielectric core.

Claim 20

A semiconductor device comprising a molded main body containing an electronic circuit element and a plurality of electrical leads extending therefrom and existing said main body, each of said leads comprising a polymeric dielectric core having disposed thereon a metallic conductor layer comprising at least two separate conductor paths for connecting a pair of terminals disposed on said circuit element to a pair of conductive surfaces on a printed circuit board, a first conductor paths being disposed along peripheral edge regions of said dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path by an exposed portion of said polymeric dielectric core.

Claim 21

The semiconductor device of claim 17, wherein said polymeric dielectric core of each lead comprises a high strength, plateable resin.

Claim 22

The semiconductor device of claim 17, wherein said metallic conductor layer of each lead comprises a first conductive path disposed along a first peripheral edge region of said polymeric dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path by an exposed portion of said polymeric dielectric core.

Claim 23

The semiconductor device of claim 17, wherein said metallic conductor layer further comprises a plated copper layer substantially only on a top, bottom, and transverse side edge portion of said polymeric dielectric core.

Claim 24

The semiconductor device of claim 17, wherein said polymeric dielectric core comprises a glass-reinforced resin.

Claim 25

The semiconductor device of claim 17, wherein said metallic conductor layer comprises a laminated metal adhered to said polymeric dielectric core.

Claim 26

An electrical lead assembly having at least four conductive paths, and comprising a pair of leads, each of said leads having a polymeric dielectric core comprising a metallic conductive layer having at least two separate conductive paths thereon, a first of said leads comprising a dielectric, laterally extending male portion, and a second of said leads comprising a dielectric laterally extending female portion, said male and female portions being adhered together to form said lead assembly.

Claim 27

An electrical lead assembly having at least four conductive paths, and comprising a pair of leads, each of said leads having a polymeric dielectric core comprising a metallic conductive layer having at least two separate conductive paths thereon, a first of said leads comprising a dielectric, laterally extending male portion, and a second of said leads comprising a dielectric laterally extending female portion, said male and female portions being adhered together to form said lead assembly.

Claim 28

A semiconductor hybrid device assembly including a surface mount semiconductor device soldered to the lead assembly of claim 23.