Process for producing crack-free nitride-hardened surface on titanium by laser beams

Claim 2

A process for nitride-hardening a surface of a titanium alloy substrate, without cracking of the substrate, comprising: (a) providing a commercially pure substrate of titanium; (b) preheating said substrate to a range of between 1000 F. and 1200 degrees F.; (c) applying a high-density energy source to the surface of said substrate to cause localized areas of melted substrate surface; (d) scanning said energy source along the surface of said substrate to cause said localized melting to move over an area to be hardened; (e) simultaneously shrouding said melted substrate surface in a gaseous atmosphere containing, by volume, at least 70% but not more than 85% nitrogen, and the balance one or more gases that do not react with molten titanium, to cause absorption of nitrogen into said melted substrate; (f) solidifying said melted substrate to form a hardened surface layer on said substrate comprising a matrix of titanium, with TiN particles dispersed therein said surface layer characterized by a minimum hardness of 50 Rockwell C and being free from cracking; and (g) slow cooling said substrate.

Claim 3

The invention of claim 1, wherein said high-density energy source is a laser.

Claim 4

The invention of claim 2 wherein said gaseous atmosphere comprises a mixture of at least 70% to 85%, by volume, of nitrogen, and the balance argon.

Claim 5

The invention of claim 2 wherein said entire substrate is shrouded in said gaseous atmosphere.

Claim 6

The invention of claim 2 wherein all of said localized area of melted substrate and only a portion of the remainder of said substrate are surrounded by said gaseous atmosphere.

Claim 7

The invention of claim 3 wherein said hardened surface layer has a thickness in the range of 0.005 to 0.025 inches.

Claim 8

The invention of claim 3 wherein said scanning is done in the range of 100 to 160 inches per minute.

Claim 9

The invention of claim 5 wherein said gaseous atmosphere flows axially around a beam of light emanating from said laser.

Claim 10

The invention of claim 8 wherein said gaseous atmosphere flows at a rate of between 15 and 30 CFH.

Claim 11

A process for producing on a titanium alloy substrate a nitride hardened surface highly resistant to cracking comprising: (a) providing a titanium substrate; (b) preheating said substrate to a range of between 1000 and 1200 degrees F.; (c) applying a high-density energy source to the surface of said substrate to cause localized areas of melted substrate surface; (d) scanning said energy source along the surface of said substrate to cause said localized melting to move over an area to be hardened; (e) simultaneously shrouding said melted substrate surface in a gaseous atmosphere containing, by volume, not more than 85% nitrogen, and the balance one or more gases that do not react with molten titanium, to cause absorption of nitrogen into said melted substrate; (f) solidifying said melted substrate to form a hardened surface layer on said substrate comprising a matrix of titanium, with TiN particles dispersed therein said surface layer characterized by a minimum hardness of 50 Rockwell C and being free from cracking; and (g) slow cooling said substrate at a cooling rate in the range of between 30 and 60 degrees F./hour.

Claim 12

A process for producing on a titanium alloy substrate a nitride hardened surface highly resistant to cracking comprising: (a) providing a titanium substrate; (b) preheating said substrate to a range of between 1000 and 1200 degrees F.; (c) applying a high-density energy source to the surface of said substrate to cause localized areas of melted substrate surface; (d) scanning said energy source along the surface of said substrate to cause said localized melting to move over an area to be hardened; (e) simultaneously shrouding said melted substrate surface in a gaseous atmosphere containing, by volume, not more than 85% nitrogen, and the balance one or more gases that do not react with molten titanium, to cause absorption of nitrogen into said melted substrate; (f) solidifying said melted substrate to form a hardened surface layer on said substrate comprising a matrix of titanium, with TiN particles dispersed therein said surface layer characterized by a minimum hardness of 50 Rockwell C and being free from cracking; and (g) slow cooling said substrate at a cooling rate in the range of between 30 and 60 degrees F./hour.

Claim 13

The invention of claim 10 in which said preheating is done in a furnace with an atmosphere of air.

Claim 14

The invention of claim 11 in which said substrate is commercially pure titanium.

Claim 15

The invention of claim 12 in which said cooling is done in a furnace with an atmosphere of air.

Claim 16

A process for nitride-hardening a surface of a titanium alloy substrate, without cracking of the substrate, comprising: (a) providing a commercially pure substrate of titanium; (b) preheating said substrate to a range of between 1000 F. and 1200 degrees F.; (c) applying a high-density energy source to the surface of said substrate to cause localized areas of melted substrate surface; (d) scanning said energy source along the surface of said substrate to cause said localized melting to move over an area to be hardened; (e) simultaneously shrouding said melted substrate surface in a gaseous atmosphere containing, by volume, at least 70% but not more than 85% nitrogen, and the balance one or more gases selected from the group consisting essentially of argon and helium, to cause absorption of nitrogen into said melted substrate; (f) solidifying said melted substrate to form a hardened surface layer on said substrate comprising a matrix of titanium, with TiN particles dispersed therein said surface layer characterized by a minimum hardness of 50 Rockwell C and being free from cracking; and (g) slow cooling said substrate at a cooling rate in the range of between 30 and 60 degrees F./hour.

Claim 17

A process for nitride-hardening a surface of a titanium alloy substrate, without cracking of the substrate, comprising: (a) providing a commercially pure substrate of titanium; (b) preheating said substrate to a range of between 1000 F. and 1200 degrees F.; (c) applying a high-density energy source to the surface of said substrate to cause localized areas of melted substrate surface; (d) scanning said energy source along the surface of said substrate to cause said localized melting to move over an area to be hardened; (e) simultaneously shrouding said melted substrate surface in a gaseous atmosphere containing, by volume, at least 70% but not more than 85% nitrogen, and the balance one or more gases selected from the group consisting essentially of argon and helium, to cause absorption of nitrogen into said melted substrate; (f) solidifying said melted substrate to form a hardened surface layer on said substrate comprising a matrix of titanium, with TiN particles dispersed therein said surface layer characterized by a minimum hardness of 50 Rockwell C and being free from cracking; and (g) slow cooling said substrate at a cooling rate in the range of between 30 and 60 degrees F./hour.