Patent US2429776A successfully refreshed from Google Patents.
US5289632A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Applying conductive lines to integrated circuits
Assignee: International Business Machines Corp
•
Filing: 1992-11-25
•
Granted: 1994-03-01
•
Expires: 2012-11-25
Abstract
Abstract A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
Inventors
- 👤 Pedro A. Chalco
- 👤 Matthew F. Cali
- 👤 Laertis Economikos
- 👤 James L. Speidell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:35
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/225; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/064; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/1306; G02F1/1309; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/10; H05K2203/107; H05K2203/17; H05K2203/173; H05K3/0011; H05K3/0017; H05K3/02; H05K3/027; H05K3/10; H05K3/20; H05K3/28; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49718; Y10T29/49732; Y10T29/49742
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
79 words
A method of applying a conductive line to a substrate, comprising the steps of: aligning a conductive line in juxtaposition with a selected area of a substrate, said conductive line being suspended in a carrier having a carrier opening therethrough, said carrier opening being defined by sidewalls, and said conductive line being suspended by said sidewalls of said carrier opening; bonding said conductive line to said selected area of said substrate; and detaching said conductive line from said carrier.
Claim 2
Independent Claim
79 words
A method of applying a conductive line to a substrate, comprising the steps of: aligning a conductive line in juxtaposition with a selected area of a substrate, said conductive line being suspended in a carrier having a carrier opening therethrough, said carrier opening being defined by sidewalls, and said conductive line being suspended by said sidewalls of said carrier opening; bonding said conductive line to said selected area of said substrate; and detaching said conductive line from said carrier.
Claim 3
Dependent Claim
23 words
A method of applying a conductive line to a substrate according to claim 1, wherein said selected area is an open circuit defect.
Claim 4
Dependent Claim
24 words
A method of applying, a conductive line to a substrate according to claim 1, wherein said step of bonding comprises heating said conductive line.
Claim 5
Dependent Claim
23 words
A method of applying a conductive line to a substrate according to claim 3, wherein said heating is accomplished using a bonding tip.
Claim 6
Dependent Claim
26 words
A method of applying a conductive line to a substrate according to claim 4, wherein said bonding tip is energized with ultrasonic vibration and laser energy.
Claim 7
Dependent Claim
26 words
A method of applying a conductive line to a substrate according to claim 4, wherein said bonding tip has a bonding end which is conical shaped.
Claim 8
Dependent Claim
27 words
A method of applying a conductive line to a substrate according to claim 6, wherein said bonding end has a capping layer for sealing said bonding end.
Claim 9
Dependent Claim
20 words
A method of applying, a conductive line to a substrate according to claim 7, wherein said capping layer is flat.
Claim 10
Dependent Claim
26 words
A method of applying a conductive line to a substrate according to claim 7, wherein said capping layer covers the entire footprint of said bonding end.
Claim 11
Dependent Claim
19 words
A method of applying a conductive line to a substrate according to claim 1, wherein said carrier is transparent.
Claim 12
Dependent Claim
20 words
A method of applying a conductive line to a substrate according to claim 1, wherein said carrier comprises a polymer.
Claim 13
Dependent Claim
19 words
A method of applying a conductive line to a substrate according to claim 11, wherein said polymer comprises polyimide.
Claim 14
Dependent Claim
26 words
A method of applying a conductive line to a substrate according to claim 1, wherein said conductive line is between 1 micron and 10 microns thick.
Claim 15
Dependent Claim
26 words
A method of applying a conductive line to a substrate according to claim 1, wherein said step of detaching comprises using a minimal amount of force.
Claim 16
Independent Claim
81 words
A method of repairing an open circuit defect, comprising the steps of: aligning a repair line in juxtaposition with an open circuit defect of a circuit line, said repair line being suspended in a carrier having a carrier opening therethrough, said carrier opening being defined by sidewalls, and said repair line being suspended by the sidewalls of said carrier opening; bonding said repair line to said circuit line over said open circuit defect; and detaching said repair line from said carrier.
Claim 17
Independent Claim
81 words
A method of repairing an open circuit defect, comprising the steps of: aligning a repair line in juxtaposition with an open circuit defect of a circuit line, said repair line being suspended in a carrier having a carrier opening therethrough, said carrier opening being defined by sidewalls, and said repair line being suspended by the sidewalls of said carrier opening; bonding said repair line to said circuit line over said open circuit defect; and detaching said repair line from said carrier.
Claim 18
Dependent Claim
22 words
A method of repairing an open circuit defect according to claim 15, wherein said step of bonding comprises heating said repair line.
Claim 19
Dependent Claim
21 words
A method of repairing an open circuit defect according to claim 16, wherein said heating is accomplished using a bonding tip.
Claim 20
Dependent Claim
24 words
A method of repairing an open circuit defect according to claim 17, wherein said bonding tip is energized with ultrasonic vibration and laser energy.
Claim 21
Dependent Claim
24 words
A method of repairing an open circuit defect according to claim 16, wherein said bonding tip has a bonding end which is conical shaped.
Claim 22
Dependent Claim
25 words
A method of repairing an open circuit defect according to claim 19, wherein said bonding end has a capping layer for sealing said bonding end.
Claim 23
Dependent Claim
18 words
A method of repairing an open circuit defect according to claim 20, wherein said capping layer is flat.
Claim 24
Dependent Claim
24 words
A method of repairing an open circuit defect according to claim 20, wherein said capping layer covers the entire footprint of said bonding end.
Claim 25
Dependent Claim
17 words
A method of re an open circuit defect according to claim 15, wherein said carrier is transparent.
Claim 26
Dependent Claim
18 words
A method of repairing an open circuit defect according to claim 15, wherein said carrier comprises a polymer.
Claim 27
Dependent Claim
17 words
A method of repairing an open circuit defect according to claim 24, wherein said polymer comprises polyimide.
Claim 28
Dependent Claim
24 words
A method of repairing an open circuit defect according to claim 15, wherein said conductive line is between 1 micron and 10 microns thick.
Claim 29
Dependent Claim
24 words
A method of repairing an open circuit defect according to claim 15, wherein said step of detaching comprises using a minimal amount of force.
References Cited (Backward Citations)
US3614832A
Cited
US4418264A
Cited
US4630355A
Cited
US4588468A
Cited
US4704304A
Cited
US4859263A
Cited
GB2213999A
Cited
US4908938A
Cited
US4902364A
Cited
US4970365A
Cited
US5079070A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-28 | 1997-08-30 | 1998-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-28 | 2001-08-30 | 2002-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-28 | 2005-08-30 | 2006-03-01 | $7700.00 | Window Closed / Lapsed |