US5283104A — Via paste compositions and use thereof to form co…

Claim 1

Independent Claim 156 words

A circuitized ceramic structure comprising at least one layer of dielectric ceramic composition and at least one via, said at least one via being filled with a conductive via body comprising an electrically conductive skeletal network of a metal contained within a ceramic matrix, said conductive via body being a solid, non-porous mass represented by a major amount by volume of cosintered packed spheres of ceramic material having the spaces therebetween filled with a minor amount by volume of particles of said metal which are smaller in size than said spheres, to form a conductive path, the ceramic composition of said at least one dielectric layer being cosinterable with said ceramic matrix of each said via body, whereby the ceramic matrix is cosintered with and integrated with the at least one dielectric layer in the area of said via to form a hermetic seal between said solid via body and said at least one dielectric layer.

Claim 2

Dependent Claim 156 words

A circuitized ceramic structure comprising at least one layer of dielectric ceramic composition and at least one via, said at least one via being filled with a conductive via body comprising an electrically conductive skeletal network of a metal contained within a ceramic matrix, said conductive via body being a solid, non-porous mass represented by a major amount by volume of cosintered packed spheres of ceramic material having the spaces therebetween filled with a minor amount by volume of particles of said metal which are smaller in size than said spheres, to form a conductive path, the ceramic composition of said at least one dielectric layer being cosinterable with said ceramic matrix of each said via body, whereby the ceramic matrix is cosintered with and integrated with the at least one dielectric layer in the area of said via to form a hermetic seal between said solid via body and said at least one dielectric layer.

Claim 3

Dependent Claim 35 words

A structure according to claim 1 in which the ceramic composition of said at least one dielectric layer and the ceramic matrix of each said via body each comprises a glass containing a crystalline phase.

Claim 4

Dependent Claim 79 words

A structure according to claim 1 in which each said via body comprises a cosintered body of spheres of glass-ceramic composition having a substantially uniform sphere diameter which is less than about 10% of the diameter of said via, and in which, said sphere diameter is within the range of from about 0.5μm to about 6μm, and particles of said metal having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

Claim 5

Dependent Claim 13 words

A structure according to claim 3 in which said metal particles comprise spheres.

Claim 6

Dependent Claim 12 words

A structure according to claim 1 in which said metal comprises copper.

Claim 7

Dependent Claim 27 words

A structure according to claim 1 in which said metal comprises a beryllium-containing alloy of copper having greater than 0% and up to 2% by weight beryllium.

Claim 8

Dependent Claim 34 words

A structure according to claim 1 in which said metal comprises a mixture of copper and an iron-cobalt alloy, said alloy having a TCE about the same as the ICE of said ceramic material.

Claim 9

Dependent Claim 51 words

A structure accorder to claim 7 in which said iron-cobalt alloy is selected from the group consisting of 31wt % nickel, 4 to 6wt % cobalt, balance iron; 36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium; and 37wt % iron, 30wt % nickel, 25wt % cobalt, 8wt % chromium.

Claim 10

Dependent Claim 209 words

A multilayer circuitized ceramic structure comprising at least two insulating layers of dielectric ceramic composition having insulated therebetween a thin electrically-conductive body, said structure having one or more vertical via holes formed through at least one insulating layer present at a surface of said structure and communicating with said electrically-conductive body, characterized by said via hole being filled with a conductive via body comprising an electrically-conductive skeletal network of a minor amount by volume of a metal contained within a major amount by volume of a ceramic matrix, said conductive via body being a solid, non-porous mass represented by cosintered packed spheres of ceramic material having the spaces therebetween filled with particles of said metal which are smaller in size than said spheres, to form a conductive path between the surface of said via body present at a surface of said ceramic circuit structure and said thin electrically-conductive body otherwise insulated between said layers of dielectric ceramic composition, the ceramic composition of said dielectric layers being cosinterable with said ceramic matrix of each said via body, whereby the ceramic matrix is cosintered with and integrated with the dielectric layer in the area of said via hole to form a hermetic seal between said via body and said dielectric layer.

Claim 11

Dependent Claim 209 words

A multilayer circuitized ceramic structure comprising at least two insulating layers of dielectric ceramic composition having insulated therebetween a thin electrically-conductive body, said structure having one or more vertical via holes formed through at least one insulating layer present at a surface of said structure and communicating with said electrically-conductive body, characterized by said via hole being filled with a conductive via body comprising an electrically-conductive skeletal network of a minor amount by volume of a metal contained within a major amount by volume of a ceramic matrix, said conductive via body being a solid, non-porous mass represented by cosintered packed spheres of ceramic material having the spaces therebetween filled with particles of said metal which are smaller in size than said spheres, to form a conductive path between the surface of said via body present at a surface of said ceramic circuit structure and said thin electrically-conductive body otherwise insulated between said layers of dielectric ceramic composition, the ceramic composition of said dielectric layers being cosinterable with said ceramic matrix of each said via body, whereby the ceramic matrix is cosintered with and integrated with the dielectric layer in the area of said via hole to form a hermetic seal between said via body and said dielectric layer.

Claim 12

Dependent Claim 39 words

A structure according to claim 9 in which the ceramic composition of said dielectric layers and the ceramic matrix of each said via body each comprises glass containing a crystalline phase and having a stable thermal coefficient of expansion.

Claim 13

Dependent Claim 80 words

A structure according to claim 9 in which each said via body comprises a cosintered body of spheres of glass-ceramic composition having a substantially uniform sphere diameter which is less than about 10% of the diameter of said via holes, and in which, said sphere diameter is within the range of from about 0.5μm to about 6μm, and particles of said metal having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

Claim 14

Dependent Claim 13 words

A structure according to claim 11 in which said metal particles comprise spheres.

Claim 15

Dependent Claim 12 words

A structure according to claim 9 in which said metal comprises copper.

Claim 16

Dependent Claim 27 words

A structure according to claim 9 in which said metal comprises a beryllium-containing alloy of copper having greater than 0% and up to 2% by weight beryllium.

Claim 17

Dependent Claim 34 words

A structure according to claim 9 in which said metal comprises mixture of copper and an iron- cobalt alloy, said alloy having a TCE about the same as the TCE of said ceramic material.

Claim 18

Dependent Claim 51 words

A structure according to claim 15 in which said iron-cobalt alloy is selected from the group consisting of 31wt % nickel, 4 to 6wt % cobalt, balance iron; 36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium; and 37wt % iron, 30wt % nickel, 25wt % cobalt, 8wt % chromium.

Claim 19

Dependent Claim 163 words

A cosinterable via-fill paste composition comprising a uniform mixture of (a) a major amount by volume of spheres of ceramic composition having a substantially- uniform average diameter between about 0.5 μm and 6 μm, (b) a minor amount by volume of particles of low-resistive metal having a maximum size between about 1/3 and 1/4 the diameter of said ceramic spheres, and (c) a minor amount of an organic binder material in a volatile vehicle, said mixture containing a sufficient volume of said ceramic spheres to form densely packed via fill in which each of said spheres is in surface contact with at least two other spheres and a sufficient volume of said smaller metal particles to fill substantially all of the void spaces surrounding said ceramic spheres, whereby when said uniform mixture of spheres and metal particles is cosintered, there results a solid, substantially non-porous conductive via body comprising a continuous skeletal network of said metal contained within a matrix of ceramic composition.

Claim 20

Dependent Claim 163 words

A cosinterable via-fill paste composition comprising a uniform mixture of (a) a major amount by volume of spheres of ceramic composition having a substantially- uniform average diameter between about 0.5 μm and 6 μm, (b) a minor amount by volume of particles of low-resistive metal having a maximum size between about 1/3 and 1/4 the diameter of said ceramic spheres, and (c) a minor amount of an organic binder material in a volatile vehicle, said mixture containing a sufficient volume of said ceramic spheres to form densely packed via fill in which each of said spheres is in surface contact with at least two other spheres and a sufficient volume of said smaller metal particles to fill substantially all of the void spaces surrounding said ceramic spheres, whereby when said uniform mixture of spheres and metal particles is cosintered, there results a solid, substantially non-porous conductive via body comprising a continuous skeletal network of said metal contained within a matrix of ceramic composition.

Claim 21

Dependent Claim 18 words

A composition according to claim 17 in which said ceramic composition comprises a glass containing a crystalline phase.

Claim 22

Dependent Claim 13 words

A composition according to claim 17 in which said metal particles comprise spheres.

Claim 23

Dependent Claim 15 words

A composition according to claim 17 in which said organic binder material comprises ethyl cellulose.

Claim 24

Dependent Claim 12 words

A composition according to claim 17 in which said metal comprises copper.

Claim 25

Dependent Claim 27 words

A composition according to claim 17 in which said metal comprises a beryllium-containing alloy of copper having greater than 0% and up to 2% by weight beryllium.

Claim 26

Dependent Claim 34 words

A composition according to claim 17 in which said metal comprises a mixture of copper and an iron-cobalt alloy, said alloy having a TCE about the same as the TCE of said ceramic material.

Claim 27

Dependent Claim 50 words

A composition according to claim 23 in which said iron-cobalt alloy is selected from the group consisting of 31wt % nickel, 4 to 6wt % cobalt, balance iron; 36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium; and 37wt % iron, 30wt % nickel, 25wt % cobalt, 8wt %.

Claim 28

Dependent Claim 81 words

A conducting composite having a thermal coefficient of expansion matched to the thermal coefficient of the expansion of a glass-ceramic layer, comprising a paste containing a mixture of a minor amount by volume of copper particles and a major amount by volume of glass-ceramic spheres having a thermal coefficient of expansion about the same as that of said glass-ceramic layer, said copper particles having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

Claim 29

Dependent Claim 81 words

A conducting composite having a thermal coefficient of expansion matched to the thermal coefficient of the expansion of a glass-ceramic layer, comprising a paste containing a mixture of a minor amount by volume of copper particles and a major amount by volume of glass-ceramic spheres having a thermal coefficient of expansion about the same as that of said glass-ceramic layer, said copper particles having a maximum dimension less than about one-third to about one-fourth the uniform diameter of said glass-ceramic spheres.

Claim 30

Dependent Claim 27 words

A via-fill composition according to claim 25, in which said copper particles consist essentially of an alloy of copper and a minor amount by weight of beryllium.

Claim 31

Dependent Claim 20 words

A via-fill composition according to claim 26 in which said alloy contains from 0% to 2% by weight of beryllium.

Claim 32

Dependent Claim 35 words

A via-fill composition according to claim 25 having a thermal coefficient of expansion matched to the thermal coefficient of expansion of glass-ceramic layers containing the via, comprising a mixture of copper and an iron-cobalt alloy.

Claim 33

Dependent Claim 31 words

A via fill composition according to claim 28 in which said iron-cobalt alloy has zero thermal coefficient of expansion and comprises 31wt % nickel, 4 to 6wt % cobalt, remainder iron.

Claim 34

Dependent Claim 23 words

A via-fill composition according to claim 28 in which said iron-cobalt alloy comprises 36-37wt % iron, 53-55wt % cobalt and 9-10wt % chromium.

Claim 35

Dependent Claim 26 words

A via-fill composition according to claim 28 in which said iron-cobalt alloy comprises 37wt % iron, 30wt % nickel, 25wt % cobalt and 8wt % chromium.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1997-01-31	1997-08-02	1998-02-01	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2001-01-31	2001-08-02	2002-02-01	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2005-01-31	2005-08-02	2006-02-01	$7700.00	Window Closed / Lapsed

Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates

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