US4599277A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Control of the sintering of powdered metals
Assignee: International Business Machines Corp
•
Filing: 1984-10-09
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Granted: 1986-07-08
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Expires: 2004-10-09
Abstract
Abstract In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, an improvement is provided which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide which can be the same as or different from the metal of the aforesaid metal member. The improved sintering process of the present invention is particularly adapted for use in the fabrication of multilayer ceramic substrates which serve as circuit modules for seminconductor chips.
Inventors
- 👤 James M. Brownlow
- 👤 Robert Rosenberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:23
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; B; B22; B22F; B22F3/00; B22F3/10; B22F3/1003; B22F7/00; B22F7/02; C04B41/45; C04B41/50; C04B41/51; C04B41/5127; C04B41/80; C04B41/81; C04B41/85; C04B41/88; H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/12028; Y10T428/12049; Y10T428/12056; Y10T428/12063; Y10T428/12493; Y10T428/1266
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
118 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide which can be the same as or different from the metal of the aforesaid metal member.
Claim 2
Dependent Claim
118 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide which can be the same as or different from the metal of the aforesaid metal member.
Claim 3
Dependent Claim
32 words
The process of claim 1 wherein the metal member is selected from the group consisting of copper, nickel, molybdenum, silver, gold and platinum or a metal alloy containing any of the foregoing.
Claim 4
Dependent Claim
12 words
The process of claim 1 wherein the substrate contains a refractory oxide.
Claim 5
Dependent Claim
12 words
The process of claim 3 wherein the refractory oxide is cordierite ceramic.
Claim 6
Dependent Claim
24 words
The process of claim 1 wherein the organometallic compound decomposes to provide a metal component which increases the densification temperature of the metal member.
Claim 7
Dependent Claim
21 words
The process of claim 5 wherein the organometallic compound is a metal acetyl acetonate which decomposes to provide a metal oxide.
Claim 8
Dependent Claim
19 words
The process of claim 6 wherein the metal acetyl acetonate is aluminum acetyl acetonate which decomposes to provide alumina.
Claim 9
Dependent Claim
24 words
The process of claim 1 wherein the organometallic component decomposes to provide a metal component which decreases the densification temperature of the metal member.
Claim 10
Dependent Claim
20 words
The process of claim 8 wherein the organometallic compound is a metal acetyl acetonate which decomposes to provide a metal.
Claim 11
Dependent Claim
20 words
The process of claim 9 wherein the metal acetyl acetonate is copper acetyl acetonate which decomposes to provide copper metal.
Claim 12
Dependent Claim
31 words
The process of claim 1 wherein sintering is carried out within the range of from about 500° C. to about 1800° C. in the presence or absence of a reducing atmosphere.
Claim 13
Dependent Claim
31 words
The process of claim 11 wherein sintering is carried out within the range of from about 600° C. to about 1000° C. in the presence or absence of a reducing atmosphere.
Claim 14
Dependent Claim
158 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a free metal or metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 15
Dependent Claim
158 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a free metal or metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 16
Dependent Claim
33 words
The process of claim 13 wherein the metal pattern contains a metal selected from the group consisting of copper, nickel, molybdenum, silver, gold, platinum or a metal alloy containing any of the foregoing.
Claim 17
Dependent Claim
13 words
The process of claim 13 wherein the ceramic substrate contains a refractory oxide.
Claim 18
Dependent Claim
11 words
The process of claim 13 wherein the refractory oxide contains alumina.
Claim 19
Dependent Claim
19 words
The process of claim 13 wherein the metal pattern is made with copper and the ceramic substrate contains alumina.
Claim 20
Dependent Claim
28 words
The process of claim 13 wherein the organometallic compound decomposes to provide a metal component which increases the densification temperature of the metal contained in the metal pattern.
Claim 21
Dependent Claim
21 words
The process of claim 18 wherein the organometallic component is a metal acetyl acetonate which decomposes to provide a metal oxide.
Claim 22
Dependent Claim
18 words
The process of claim 19 wherein the organometallic component is aluminum acetyl acetonate which decomposes to provide alumina.
Claim 23
Dependent Claim
31 words
The process of claim 13 wherein sintering is carried out within the range of from about 500° C. to about 1800° C. in the presence or absence of a reducing atmosphere.
Claim 24
Dependent Claim
72 words
An uncured substrate having a non-densified metal member bonded thereto which is especially adapted to be sintered wherein said metal member contains an amount of organometallic compound which will undergo decomposition under sintering conditions and before the densification temperature of the metal member has been reached to provide a densification temperature-modifying amount of a metal or metal oxide which is the same as or different from the metal of the metal member.
Claim 25
Dependent Claim
72 words
An uncured substrate having a non-densified metal member bonded thereto which is especially adapted to be sintered wherein said metal member contains an amount of organometallic compound which will undergo decomposition under sintering conditions and before the densification temperature of the metal member has been reached to provide a densification temperature-modifying amount of a metal or metal oxide which is the same as or different from the metal of the metal member.
Claim 26
Dependent Claim
90 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering a densification temperature-modifying amount of a metal oxide which can be the same as or different from the metal of the aforesaid metal member.
Claim 27
Dependent Claim
90 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering a densification temperature-modifying amount of a metal oxide which can be the same as or different from the metal of the aforesaid metal member.
Claim 28
Dependent Claim
25 words
The process of claim 23 wherein the metal member is selected from the group consisting of copper, nickel, molybdenum, silver, gold, platinum and alloys thereof.
Claim 29
Dependent Claim
12 words
The process of claim 23 wherein the substrate contains a refractory oxide.
Claim 30
Dependent Claim
12 words
The process of claim 23 wherein the refractory oxide is cordierite ceramic.
Claim 31
Dependent Claim
18 words
The process of claim 23 wherein the metal oxide is an oxide of magnesium, titanium, zirconium or aluminum.
Claim 32
Dependent Claim
31 words
The process of claim 23 wherein sintering is carried out within the range of from about 500° C. to about 1800° C. in the presence or absence of a reducing atmosphere.
Claim 33
Dependent Claim
31 words
The process of claim 28 wherein sintering is carried out within the range of from about 600° C. to about 1000° C. in the presence of absence of a reducing atmosphere.
Claim 34
Dependent Claim
130 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering a densification temperature-modifying amount of a metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 35
Dependent Claim
130 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering a densification temperature-modifying amount of a metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 36
Dependent Claim
32 words
The process of claim 30 wherein the pattern contains a metal selected from the group consisting of copper, nickel, molybdenum, silver, gold, platinum or a metal alloy containing any of the foregoing.
Claim 37
Dependent Claim
13 words
The process of claim 30 wherein the ceramic substrate contains a refractory oxide.
Claim 38
Dependent Claim
11 words
The process of claim 32 wherein the refractory oxide contains alumina.
Claim 39
Dependent Claim
19 words
The process of claim 30 wherein the metal pattern is made with copper and the ceramic substrate contains alumina.
Claim 40
Dependent Claim
18 words
The process of claim 30 wherein the metal oxide is an oxide of magnesium, titanium, zirconium or aluminum.
Claim 41
Dependent Claim
31 words
The process of claim 30 wherein sintering is carried out within the range of from about 500° C. to about 1800° C. in the presence or absence of a reducing atmosphere.
Claim 42
Dependent Claim
46 words
An uncured substrate having a non-densified metal member bonded thereto which is especially adapted to be sintered wherein said metal member contains a densification temperature-modifying amount of a metal or metal oxide which is the same as or different from the metal of the metal member.
Claim 43
Dependent Claim
46 words
An uncured substrate having a non-densified metal member bonded thereto which is especially adapted to be sintered wherein said metal member contains a densification temperature-modifying amount of a metal or metal oxide which is the same as or different from the metal of the metal member.
References Cited (Backward Citations)
US4507262A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-07-07 | 1990-01-06 | 1990-07-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-07-07 | 1994-01-06 | 1994-07-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-07-07 | 1998-01-06 | 1998-07-08 | $7700.00 | Window Closed / Lapsed |