Surface acoustic wave device with improved junction bonding and package miniaturization

Claim 1

A surface acoustic wave device element for a surface acoustic device, comprising: a piezoelectric substrate; electrodes formed on a first surface of said substrate; input/output and grounding terminal pads formed on the first surface of said substrate. a plurality of metal bumps formed on the input/output and grounding terminal pads on the first surface of said substrate; a plate having input/output and grounding metal patterns formed on a first surface thereof, said plate being positioned so as contact the plurality of metal bumps with corresponding metal patterns; a frame formed so as to surround an outer periphery of said piezoelectric substrate and positioned on the first surface of said plate; and a lid positioned with said frame so as to sealably enclose said substrate, said electrodes, said terminal pads, said plurality of metal bumps and the metal patterns between said plate, said frame and said lid, wherein said lid is positioned to press said piezoelectric substrate against said plate so as to maintain electrical connection between said plate and said plurality of metal bumps on said substrate, and a distance B between metal patterns for signal lines and a metal pattern for grounding is smaller than widths A of the metal bumps for signal lines of the surface acoustic wave element.