EP0367181A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Surface acoustic wave filter device
Assignee: Hitachi Ltd
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Filing: 1989-10-30
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Granted: —
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Expires: 2009-10-30
Abstract
Abstract A surface acoustic wave filter device comprises a surface acoustic wave filter chip (3) disposed on the upper surface of a substrate (1), input and output conductor patterns (5, 5′, 6, 6′; 35, 35′, IP, IP′, OP, OP′, 36, 36′; 65-1, 65-2, 66-1, 66-2) provided on each of the upper and lower surfaces of the substrate, and conductor patterns (7; 37, 37′; 57, 57′; E 67) for earth provided on each of the upper and lower surfaces of the substrate so as to surround the input and output conductor patterns on that surface in order to prevent an electromagnetic coupling between the input and output conductor patterns, whereby the out-of-band rejection not smaller than 40 dB is obtained in an operating band not lower than 400 MHz.
Inventors
- 👤 Satoshi Wakamori
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 06:49
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/058; H03H9/0585; H10; H10W; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
175 words
A surface acoustic wave filter device comprising: an insulating substrate (1) having first and second opposite surfaces; at least one surface acoustic wave filter chip (3) provided on said first surface of said substrate; first input and output conductor patterns (5, 6; 35, 36; 65-1, 65-2, 66-1, 66-2) which are provided on said first surface of said substrate and are electrically connected with said chip; second input and output conductor patterns (5′, 6′; 35′, 36′) which are provided on said second surface of said substrate and are electrically connected with said first input and output conductor patterns; shielding means including conductor patterns (7; 37, 37′; 57, 57′; 67E) for earth which are respectively provided on said first and second surfaces of said substrate between said first input and output conductor patterns and between said second input and output conductor patterns to prevent electromagnetic coupling between the input and output conductor patterns and are electrically connected with each other; and sealing means (2; 19, 20) for sealing said chip and the conductor patterns on said substrate.
Claim 2
Dependent Claim
175 words
A surface acoustic wave filter device comprising: an insulating substrate (1) having first and second opposite surfaces; at least one surface acoustic wave filter chip (3) provided on said first surface of said substrate; first input and output conductor patterns (5, 6; 35, 36; 65-1, 65-2, 66-1, 66-2) which are provided on said first surface of said substrate and are electrically connected with said chip; second input and output conductor patterns (5′, 6′; 35′, 36′) which are provided on said second surface of said substrate and are electrically connected with said first input and output conductor patterns; shielding means including conductor patterns (7; 37, 37′; 57, 57′; 67E) for earth which are respectively provided on said first and second surfaces of said substrate between said first input and output conductor patterns and between said second input and output conductor patterns to prevent electromagnetic coupling between the input and output conductor patterns and are electrically connected with each other; and sealing means (2; 19, 20) for sealing said chip and the conductor patterns on said substrate.
Claim 3
Dependent Claim
39 words
A surface acoustic wave filter device according to claim 1, wherein electrically conductive means (12) passing through said substrate is provided for electri cally connecting said conductor patterns for earth between said first and second surfaces of said substrate.
Claim 4
Dependent Claim
69 words
A surface acoustic wave filter device according to claim 2, wherein electrically conductive means (12) passing through said substrate is provided for electrically connecting said first and second input conductor patterns between said first and second surfaces of said substrate and conductor means (12) passing through said substrate is provided for electrically connecting said first and second output conductor patterns between said first and second surfaces of said substrate.
Claim 5
Dependent Claim
41 words
A surface acoustic wave filter device according to claim 1, wherein an insulating spacer (30) is provided on said first surface of said substrate around each of said first input and output conductor patterns (35, 36) to isolate that conductor pattern.
Claim 6
Dependent Claim
48 words
A surface acoustic wave filter device according to claim 1, wherein said conductor patterns (57, 57′) for earth are provided in a stripe form around said substrate between said first input and output conductor patterns (5, 6) and between said second input and output conductor patterns (5′, 6′).
Claim 7
Dependent Claim
57 words
A surface acoustic wave filter device according to claim 1, wherein the conductor pattern (7; 37, 37′) for earth on each said first and second surfaces of said substrate is provided around the input and output conductor patterns (5, 6; 35, 36, 35′, 36′) on that surface so as to surround the input and output conductor patterns.
Claim 8
Dependent Claim
28 words
A surface acoustic wave filter device according to claim 1, wherein said sealing means includes a cap (2) which is made of resin and bonded to said substrate.
Claim 9
Dependent Claim
36 words
A surface acoustic wave filter device according to claim 1, wherein said sealing means includes a cap member (19, 20) which is made of a metallic material and secured to the conductor patterns on said substrate.
Claim 10
Dependent Claim
160 words
An SMT type surface acoustic wave device comprising a surface acoustic wave filter chip (3) including a piezoelectric substrate and having electrode patterns disposed thereon, an insulating substrate (1) secured to said chip by a die bonding adhesive and having upper and lower surfaces thereof on which conductor patterns to be subjected to wire bonding are disposed, and a cap (2; 19, 20) for hermetically sealing the interior, in which the conductor patterns on each of said upper and lower surfaces of said substrate include an input pattern (5, 5′; 35, 35′, IP, IP′, 65-1, 65-2), an output pattern (6, 6′; 36, 36′; OP, OP′, 66-1, 66-2) and a pattern (7; 37, 37′; 57, 57′; E67) for earth, the pattern for earth is disposed between the input pattern and the output pattern so as to surround the input and output patterns, and the corresponding patterns on said upper and lower surfaces of said substrate are electrically connected with each other.
Claim 11
Dependent Claim
160 words
An SMT type surface acoustic wave device comprising a surface acoustic wave filter chip (3) including a piezoelectric substrate and having electrode patterns disposed thereon, an insulating substrate (1) secured to said chip by a die bonding adhesive and having upper and lower surfaces thereof on which conductor patterns to be subjected to wire bonding are disposed, and a cap (2; 19, 20) for hermetically sealing the interior, in which the conductor patterns on each of said upper and lower surfaces of said substrate include an input pattern (5, 5′; 35, 35′, IP, IP′, 65-1, 65-2), an output pattern (6, 6′; 36, 36′; OP, OP′, 66-1, 66-2) and a pattern (7; 37, 37′; 57, 57′; E67) for earth, the pattern for earth is disposed between the input pattern and the output pattern so as to surround the input and output patterns, and the corresponding patterns on said upper and lower surfaces of said substrate are electrically connected with each other.
Claim 12
Dependent Claim
45 words
An SMT type surface acoustic wave device according to claim 9, wherein a plurality of said input patterns and a plurality of said output patterns are disposed on each of said upper and lower surfaces of said substrate and are electrically connected with each other.
Claim 13
Dependent Claim
32 words
A surface acoustic wave filter device according to claim 1, wherein the device has the out-of-band rejection of at least 50 dB in a high frequency region not lower than 400 MHz.
Claim 14
Dependent Claim
26 words
A surface acoustic wave filter device according to claim 8, wherein the device has a hermeticalness of the order of 1 x 10⁻⁸ atm cc/sec He.
References Cited (Backward Citations)
No citation records indexed.
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