US5281834A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-silicon and silicon bonded structure and method of manufacture
Assignee: Motorola Solutions Inc
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Filing: 1990-08-31
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Granted: 1994-01-25
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Expires: 2010-08-31
Abstract
Abstract A non-silicon substrate is bonded to a silicon substrate with a stress-relief layer between the non-silicon substrate and the silicon substrate. The stress-relief layer reduces the stress between the non-silicon substrate and the silicon substrate. The stress is created by the difference in the thermal expansion coefficients of the two materials. The stress-relief layer may be a low melting point metal, a semiconductor layer having its thermal expansion coefficient close to the thermal expansion coefficient of the non-silicon substrate. The silicon substrate and/or the non-silicon substrate may have a silicon dioxide layer formed thereon such that the silicon dioxide layer is adjacent to the stress-relief layer.
Inventors
- 👤 Bertrand F. Cambou
- 👤 H. Ming Liaw
- 👤 Mamoru Tomozane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 06:24
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
86 words
A structure, comprising: a first self-supporting structure comprised of a silicon substrate; a stress-relief layer disposed on the first self-supporting structure; and a second self-supporting structure comprised of a non-silicon semiconductor substrate disposed on the stress-relief layer, wherein the stress-relief layer is comprised of a semiconductor layer having a thermal expansion coefficient close to the thermal expansion coefficient of the non-silicon semiconductor substrate and wherein the second self-supporting structure is further comprised of an oxide layer disposed between the non-silicon semiconductor substrate and the stress-relief layer.
Claim 2
Dependent Claim
86 words
A structure, comprising: a first self-supporting structure comprised of a silicon substrate; a stress-relief layer disposed on the first self-supporting structure; and a second self-supporting structure comprised of a non-silicon semiconductor substrate disposed on the stress-relief layer, wherein the stress-relief layer is comprised of a semiconductor layer having a thermal expansion coefficient close to the thermal expansion coefficient of the non-silicon semiconductor substrate and wherein the second self-supporting structure is further comprised of an oxide layer disposed between the non-silicon semiconductor substrate and the stress-relief layer.
Claim 3
Dependent Claim
76 words
A structure, comprising: a first self-supporting structure comprised of a silicon substrate; a stress-relief layer disposed on the first self-supporting structure; and a second self-supporting structure comprised of a non-silicon semiconductor substrate disposed on the stress-relief layer, wherein the stress relief layer is comprised of a metal layer having a low melting point and wherein the second self-supporting structure is further comprised of an oxide layer disposed between the non-silicon semiconductor substrate and the stress-relief layer.
Claim 4
Dependent Claim
76 words
A structure, comprising: a first self-supporting structure comprised of a silicon substrate; a stress-relief layer disposed on the first self-supporting structure; and a second self-supporting structure comprised of a non-silicon semiconductor substrate disposed on the stress-relief layer, wherein the stress relief layer is comprised of a metal layer having a low melting point and wherein the second self-supporting structure is further comprised of an oxide layer disposed between the non-silicon semiconductor substrate and the stress-relief layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-24 | 1997-07-26 | 1998-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-24 | 2001-07-26 | 2002-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-24 | 2005-07-26 | 2006-01-25 | $7700.00 | Window Closed / Lapsed |