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Actinic radiation-reactive pressure-sensitive adhesive composition wherein adhesiveness is reduced upon irradiation

Assignee: Adeka Corp
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Filing: 1990-12-21
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Granted: 1994-01-11
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Expires: 2010-12-21
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Abstract

Abstract An actinic radiation-reactive pressure-sensitive adhesive composition can be cured in air at a high speed, without irritation and bad smell, and comprises 1 a pressure-sensitive adhesive organic compound, and 2 an actinic radiation-curable resin comprising (1) one or more polythiol compounds and (2) one or more polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds in the molecule.

Inventors

  • 👤 Kazuo Ohkawa
  • 👤 Seiichi Saito

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 13:07
CPC Classifications
H; H10; H10P; H10P50/00; C; C08; C08F; C08F299/00; C09; C09J; C09J167/00; C09J201/00; G; G03; G03F; G03F7/00; G03F7/0012; C08L; C08L2666/00; C08L2666/02

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 83 words
An actinic radiation-reactive pressure-sensitive adhesive composition having an essential components: a pressure-sensitive adhesive organic compound comprising an acrylate copolymer, and an actinic radiation-curable resin comprising one or more polythiol compounds and one or more polyene compounds, said polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds derived from a substituted or unsubstituted allyl alcohol and the equivalent ratio of carbon-to-carbon double bonds to the thiol groups being between 0.7:1.0 and 1.5:1.0, said composition having a reduced adhesion strength after curing.
Claim 2
Dependent Claim 83 words
An actinic radiation-reactive pressure-sensitive adhesive composition having an essential components: a pressure-sensitive adhesive organic compound comprising an acrylate copolymer, and an actinic radiation-curable resin comprising one or more polythiol compounds and one or more polyene compounds, said polyene compounds each having at least two actinic radiation-reactive carbon-to-carbon double bonds derived from a substituted or unsubstituted allyl alcohol and the equivalent ratio of carbon-to-carbon double bonds to the thiol groups being between 0.7:1.0 and 1.5:1.0, said composition having a reduced adhesion strength after curing.
Claim 3
Dependent Claim 44 words
An actinic radiation-reactive pressure-sensitive adhesive composition as set forth in claim 1, wherein the actinic radiation-curable resin is contained in the adhesive composition in an amount of 1 to 500 parts by weight per 100 parts by weight of the pressure-sensitive adhesive organic compound.
Claim 4
Dependent Claim 44 words
An actinic radiation-reactive pressure-sensitive adhesive composition as set forth in claim 1, wherein the actinic radiation-curable resin is contained in the adhesive composition in an amount of 10 to 200 parts by weight per 100 parts by weight of the pressure-sensitive adhesive organic compound.
Claim 5
Dependent Claim 40 words
An actinic radiation-reactive pressure-sensitive composition as set forth in claim 1, having an adhesive force of from 200 to 1000 g/20 mm for a semiconductor wafer before curing and an adhesive force of 100 g/20 mm or lower after curing.

References Cited (Backward Citations)

US3920877A Cited
US3925320A Cited
US3908039A Cited
US4234676A Cited
US4264658A Cited
JPS601273A Cited
EP0147959A2 Cited
US4587313A Cited
WO1988001281A1 Cited
US4999242A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-01-10 1997-07-12 1998-01-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-01-10 2001-07-12 2002-01-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-01-10 2005-07-12 2006-01-11 $7700.00 Window Closed / Lapsed

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