Radiation-curing pressure-sensitive adhesive composition

Abstract

Abstract PURPOSE:To provide the titled adhesive compsn. having excellent adhesion properties without emission of foul odor, prepd. by adding a reaction product of a dithiol and a diacryate monomer to a radiation-curing liquid oligomer having a radical crosslinking ethylenically unsatd. double bond. CONSTITUTION:A reaction product having no unpleasant odor peculiar to thiol is prepd. by reacting 0.1-1mol of a diacrylate monomer (e.g. ethylene glycol diacrylate or 1,6-hexane glycol diacrylate) to 1mol of a dithiol such as ethanedithiol or hexamethylenedithiol. The adhesive compsn. is obtained by adding 0.5-30pts.wt. said reaction product to 100pts.wt. radiation-curing liquid oilgomer having a radical-crosslinking ethylenically unsatd. bond in the molecule. The resultant adhesive compsn. has little unpleasant odor after irradiation to radiation.

Inventors

• 👤 Tomohisa Oota
• 👤 共久 太田
• 👤 Akihiko Dobashi
• 👤 明彦 土橋
• 👤 Toshishige Uehara
• 👤 寿茂 上原

Bibliographic Details