Patent US5269838A successfully refreshed from Google Patents.
US5269838A
Expired / Lapsed
US
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Electroless plating solution and plating method with it
Assignee: Dipsol Chemicals Co Ltd
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Filing: 1993-03-12
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Granted: 1993-12-14
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Expires: 2013-03-12
Abstract
Abstract An electroless plating solution comprises nickel ion, a chelating agent for nickel ion, dimethylamine borane, one or more soluble salts of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid, and an electroless plating method comprises the step of immersing a substrate to be plated in this electroless plating solution for sufficent time period to form a nickel or nickel alloy layer on the substrate. The electroless plating solution has a high bath stability and is capable of forming an excellent thick deposit free from pits and cracks.
Inventors
- 👤 Manabu Inoue
- 👤 Mitsutada Kaneta
- 👤 Junko Ozawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:42
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/32; C23C18/34
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
34 words
An electroless plating solution comprising nickel ion, a chelating agent for nickel ion, a reducing agent for nickel ion, a soluble salt of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid.
Claim 2
Dependent Claim
34 words
An electroless plating solution comprising nickel ion, a chelating agent for nickel ion, a reducing agent for nickel ion, a soluble salt of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid.
Claim 3
Dependent Claim
19 words
The electroless plating solution of claim 1 wherein the reducing agent for nickel ion is a soluble borane compound.
Claim 4
Dependent Claim
15 words
The electroless plating solution of claim 2 wherein the soluble borane compound is dimethylamine borane.
Claim 5
Dependent Claim
28 words
The electroless plating solution of claim 1 wherein the soluble salt of a condensate of an arylsulfonic acid with formalin is a soluble salt of arylsulfonic acid/formalin condensate.
Claim 6
Dependent Claim
13 words
The electroless plating solution of claim 1 wherein it further contains a propynesulfonate.
Claim 7
Dependent Claim
67 words
The electroless plating solution of claim 1 wherein it comprises 0.02 to 0.2 mol/l of soluble nickel salt for providing nickel ion, 0.05 to 2.0 mol/l of the chelating agent, 0.01 to 0.1 mol/l of the reducing agent, 5 to 500 mg/l of the soluble salt of a condensate of an arylsulfonic acid with formalin, 10 to 1000 mg/l of thiodiglycolic acid and a balance of water.
Claim 8
Dependent Claim
19 words
The electroless plating solution of claim 6 wherein the reducing agent for nickel ion is a soluble borane compound.
Claim 9
Dependent Claim
28 words
The electroless plating solution of claim 6 wherein the soluble salt of a condensate of an arylsulfonic acid with formalin is a soluble salt of arylsulfonic acid/formalin condensate.
Claim 10
Dependent Claim
18 words
The electroless plating solution of claim 6 wherein it further contains 10 to 1000 mg/l of a propynesulfonate.
Claim 11
Dependent Claim
18 words
The electroless plating solution of claim 6 wherein pH of the electroless plating solution is 3 to 14.
Claim 12
Dependent Claim
72 words
An electroless plating method comprising the step of immersing a substrate to be plated in an electroless plating solution comprising nickel ion, a chelating agent for nickel ion, a reducing agent for nickel ion, a soluble salt of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid for sufficient time period to form a nickel or nickel alloy film having a thickness of 5 to 200 μm on the substrate.
Claim 13
Dependent Claim
72 words
An electroless plating method comprising the step of immersing a substrate to be plated in an electroless plating solution comprising nickel ion, a chelating agent for nickel ion, a reducing agent for nickel ion, a soluble salt of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid for sufficient time period to form a nickel or nickel alloy film having a thickness of 5 to 200 μm on the substrate.
Claim 14
Dependent Claim
20 words
The electroless plating method of claim 11 wherein the immersing is conducted at a temperature of 50° to 90° C.
Claim 15
Dependent Claim
24 words
The electroless plating method of claim 11 wherein the immersing is conducted while the substrate is rocking or while barrel processing is carried out.
Claim 16
Dependent Claim
22 words
The electroless plating method of claim 11 wherein the immersing is conducted while the electroless plating solution is subjected to continuous filtration.
Claim 17
Dependent Claim
24 words
The electroless plating method of claim 11 wherein the substrate is a substrate which has been subjected to an electroless plating with Ni-P alloy.
Claim 18
Dependent Claim
70 words
The electroless plating method of claim 11 wherein the electroless plating solution comprises 0.02 to 0.2 mol/l of soluble nickel salt for providing nickel ion, 0.05 to 2.0 mol/l of the chelating agent, 0.01 to 0.1 mol/l of the reducing agent, 5 to 500 mg/l of the soluble salt of a condensate of an arylsulfonic acid with formalin, 10 to 1000 mg/l of thiodiglycolic acid and a balance of water.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-12-13 | 1997-06-14 | 1997-12-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-12-13 | 2001-06-14 | 2001-12-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-12-13 | 2005-06-14 | 2005-12-14 | $7700.00 | Window Closed / Lapsed |