EP0248522A1
Expired / Lapsed
EP
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Electroless copper plating and bath therefor
Assignee: MSA Safety Inc
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Filing: 1987-04-24
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Granted: —
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Expires: 2007-04-24
Abstract
Abstract In the present invention electroless copper is plated from aqueous plating baths comprising a soluble copper salt, ethyleneidamine tetraacetic acid, dimethylamine borane, thiodyglycolic acid and a surfactant reaction product of ethylene oxide and an acetylenic glycol with sufficient ammonium hydroxide to adjust the pH between about 8.O and 11.5.
Inventors
- 👤 John Wilbert Milius
- 👤 Jill Dana Alderson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 22:34
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
84 words
An electroless copper plating bath consisting essentially of an aqueous solution of (1) about O.6 to 6.4 g/l of a water soluble copper salt, (2) about 6 to 5O g/l of ethylenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 5O mg/l of thiodiglycolic acid, (5) about 2.5 to 1OOO mg/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and (6) sufficient ammonium hydroxide to adjust the pH between about 8.O and 11.5.
Claim 2
Dependent Claim
84 words
An electroless copper plating bath consisting essentially of an aqueous solution of (1) about O.6 to 6.4 g/l of a water soluble copper salt, (2) about 6 to 5O g/l of ethylenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 5O mg/l of thiodiglycolic acid, (5) about 2.5 to 1OOO mg/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and (6) sufficient ammonium hydroxide to adjust the pH between about 8.O and 11.5.
Claim 3
Dependent Claim
18 words
A bath according to claim 1 in which the acetylenic glycol is 2, 4, 7, 9 tetra-methyl-5-decyne-4, 7-diol.
Claim 4
Dependent Claim
14 words
A bath according to claim 1 in which the copper salt is copper sulfate.
Claim 5
Dependent Claim
14 words
A bath according to claim 2 in which the copper salt is copper sulfate.
Claim 6
Dependent Claim
54 words
A bath according to claim 1 having a pH between 9.5 and 1O.5 and containing about 3.2 g/l of copper sulfate, about 12 g/l ethylene diamine tetraacetic acid, about 5.5 g/l of dimethylamine borane, about 1O mg/l of thiodiglycolic acid, and about 11 mg/l of a surfactant adduct of ethylene oxide and 2,4,7,9-tetra-methyl-5-decyne-4,7 diol.
Claim 7
Independent Claim
101 words
A method for the electroless deposition of copper on a substrate comprising contacting the substrate with an aqueous bath at a temperature between about 25°C and 8O°C, the bath containing (1) about O.6 to 6.4 g/l a water soluble copper salt, (2) about 6 to 5O g/l of ethylenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 5O g/l of thiodiglycolic acid, (5) about 2.5 to 1OOO g/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and, (6) sufficient ammonium hydroxide to adjust the pH between about 8.O and 11.5.
Claim 8
Independent Claim
101 words
A method for the electroless deposition of copper on a substrate comprising contacting the substrate with an aqueous bath at a temperature between about 25°C and 8O°C, the bath containing (1) about O.6 to 6.4 g/l a water soluble copper salt, (2) about 6 to 5O g/l of ethylenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 5O g/l of thiodiglycolic acid, (5) about 2.5 to 1OOO g/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and, (6) sufficient ammonium hydroxide to adjust the pH between about 8.O and 11.5.
Claim 9
Dependent Claim
59 words
A method according to claim 6 in which the bath has a pH between about 9.5 and 1O.5 and contains about 3.2 g/l of copper sulfate, about 12 g/l ethylene diamine tetraacetic acid, about 5.5 g/l of dimethylamine borane, about 1O mg/l of thiodiglycolic acid, and about 11 mg/l of a surfactant adduct of ethylene oxide and 2,4,7,9-tetra-methyl-5-decyne-4,7 diol.
References Cited (Backward Citations)
US3902907A
Cited
EP0039757A1
Cited
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