Patent US5268533A successfully refreshed from Google Patents.
US5268533A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pre-stressed laminated lid for electronic circuit package
Assignee: Raytheon Co
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Filing: 1991-05-03
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Granted: 1993-12-07
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Expires: 2011-05-03
Abstract
Abstract A lid (2) for an electronic circuit housing (4) has inner (24) and outer (22) laminated layers that are formed from two different materials, joined to each other and bowed outward from the housing (4) so that the inner layer (24) is under tensile bending stress at the interface between the layers, and the outer layer (22) is under compressive bending stress at the interface. This forms a pre-stress on the lid that resists external loads, and causes the lid to deflect under loading in a linear, predictable and recoverable fashion. The lid is preferably formed by thermal bonding of two materials having different coefficients of thermal expansion, with the bow forming as the materials cool. In one example two different metals are used, and in another a metal is bonded to a glass-ceramic tape.
Inventors
- 👤 Alan L. Kovacs
- 👤 Gary W. Johnson
- 👤 William A. Vitriol
- 👤 Clifford L. Shock, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:58
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W76/00; H10W76/10; H10W76/12; H10W72/00; H10W72/50; H10W72/541; H10W72/547; H10W72/5473
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
84 words
A lid for an electronic circuit housing, comprising: inner and outer laminated layers shaped as a lid for an electronic circuit housing, said layers being formed from two different materials, joined to each other to inhibit relative sideways slippage between the layers, and bowed outward with respect to said housing so that at their juncture the inner layer is under tensile bending stress and the outer layer is under compressive bending stress, the stresses on said layers resisting loads applied to said outer layer.
Claim 2
Dependent Claim
84 words
A lid for an electronic circuit housing, comprising: inner and outer laminated layers shaped as a lid for an electronic circuit housing, said layers being formed from two different materials, joined to each other to inhibit relative sideways slippage between the layers, and bowed outward with respect to said housing so that at their juncture the inner layer is under tensile bending stress and the outer layer is under compressive bending stress, the stresses on said layers resisting loads applied to said outer layer.
Claim 3
Dependent Claim
14 words
The lid of claim 1, said two materials having different coefficients of thermal expansion.
Claim 4
Dependent Claim
19 words
The lid of claim 2, wherein one of said materials is metallic and the other material is a ceramic.
Claim 5
Dependent Claim
21 words
The lid of claim 3, wherein said other material is a glass-ceramic tape, a glass-ceramic thick film or a devitrified glass.
Claim 6
Dependent Claim
18 words
The lid of claim 3, wherein said inner layer is a ceramic and said outer layer is metallic.
Claim 7
Dependent Claim
35 words
The lid of claim 5, further comprising a third layer joined to the outer surface of said metallic layer, said third layer being formed from said ceramic to a greater thickness than said inner layer.
Claim 8
Dependent Claim
18 words
The lid of claim 3, wherein said inner layer is metallic and said outer layer is a ceramic.
Claim 9
Dependent Claim
13 words
The lid of claim 2, one of said materials comprising an iron-nickel alloy.
Claim 10
Dependent Claim
14 words
The lid of claim 2, wherein said first and second materials are both metallic.
Claim 11
Dependent Claim
14 words
The lid of claim 2, wherein said layers are diffusion bonded to each other.
Claim 12
Dependent Claim
11 words
The lid of claim 2, wherein said layers are brazed together.
Claim 13
Dependent Claim
64 words
A package for an electronic circuit, comprising: a housing for an electronic circuit, a domed lid covering said housing, said lid comprising a first layer of a first material having an outwardly bowed shape relative to the interior of said housing, and a second layer of a second material that is joined to said first layer and resists inward bending of said first layer.
Claim 14
Dependent Claim
64 words
A package for an electronic circuit, comprising: a housing for an electronic circuit, a domed lid covering said housing, said lid comprising a first layer of a first material having an outwardly bowed shape relative to the interior of said housing, and a second layer of a second material that is joined to said first layer and resists inward bending of said first layer.
Claim 15
Dependent Claim
21 words
The electronic circuit package of claim 12, wherein one of said materials is metallic and the other material is a ceramic.
Claim 16
Dependent Claim
23 words
The electronic circuit package of claim 13, wherein said other material is a glass-ceramic tape, a glass-ceramic thick film or a devitrified glass.
Claim 17
Dependent Claim
23 words
The electronic circuit package of claim 13, wherein said ceramic layer is on the inner portion of said lid, relative to said housing.
Claim 18
Dependent Claim
22 words
The electronic circuit package of claim 15, further comprising electronic circuitry formed on said ceramic layer facing the interior of said housing.
Claim 19
Dependent Claim
24 words
The electronic circuit package of claim 16, wherein said circuitry on the ceramic layer includes means for monitoring the interior environment of said package.
Claim 20
Dependent Claim
23 words
The electronic circuit package of claim 16, wherein said circuitry on the ceramic layer includes means for monitoring mechanical stresses on said lid.
Claim 21
Dependent Claim
37 words
The electronic circuit package of claim 15, further comprising a third layer joined to the outer surface of said metallic layer, said third layer being formed from said ceramic to a greater thickness than said inner layer.
Claim 22
Dependent Claim
20 words
The electronic circuit package of claim 12, wherein said inner layer is metallic and said outer layer is a ceramic.
Claim 23
Dependent Claim
34 words
The electronic circuit package of claim 12, the upper portion of said housing including a peripheral sealing member, said lid being sealed to said sealing member with its dome extending above said sealing member.
Claim 24
Dependent Claim
44 words
The electronic circuit package of claim 21, said lid including a peripheral lip formed from one of said layers and sealed to the sealing member on said housing, the other of said lid layers being disposed on said domed portion inward from said lip.
Claim 25
Dependent Claim
18 words
The electronic circuit package of claim 22, wherein said sealing member and said lip both being nickel coated.
Claim 26
Dependent Claim
16 words
The electronic circuit package of claim 12, wherein said first and second materials are both metallic.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-12-06 | 1997-06-07 | 1997-12-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-12-06 | 2001-06-07 | 2001-12-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-12-06 | 2005-06-07 | 2005-12-07 | $7700.00 | Window Closed / Lapsed |