US3848077A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for electronic semiconductor devices
Assignee: Individual
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Filing: 1970-10-16
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Granted: 1974-11-12
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Expires: 1990-10-16
Abstract
Abstract A ceramic package for electronic semiconductor devices comprising a bottom layer, an intermediate layer and a top layer. The bottom layer is formed with a plurality of holes disposed adjacent the outer wall thereof. Seated centrally on the bottom layer is a conventional semiconductor device. The holes of the bottom layer are filled with a suitable conductor metal for establishing electrical connections between the package and an electrical circuit to be connected thereto. The intermediate layer is formed with holes aligned with and in registration with the holes of the bottom layer. The holes of the intermediate layer are filled with a suitable conductor metal for establishing electrical connections with the metal filled holes, respectively, of the bottom layer. A cavity is formed centrally in the intermediate layer for receiving the semiconductor device. Conductor metallic tabs project laterally from the metal filled holes, respectively, of the intermediate layer to establish electrical connections between the metal filled holes of the intermediate layer and the terminal leads. The terminal leads, in turn, are connected to the terminals on the semiconductor device. The top layer is formed with a cavity greater in dimension than the cavity formed in the intermediate layer, whereby a shoulder or ledge is formed for the seating of the electrical connection tabs thereon. A suitable cover is sealed on the top layer to form an encapsulated, hermetically sealed package for the semiconductor device.
Inventors
- 👤 M Whitman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 22:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
201 words
A package for an electronic semiconductor device comprising: a. a ceramic base with a metal pad on which the semiconductor device is seated with the terminals thereof at an elevated position; b. first ceramic wall means on said base formed with a cavity therein for receiving the semiconductor device; c. second ceramic wall means on said first ceramic wall means, said second ceramic wall means being formed with a cavity of greater dimension than said cavity of said first ceramic wall means, said second cermaic wall means being seated on said first ceramic wall means to form a shoulder on said first ceramic wall means; d. metallic conductor tabs disposed on said shoulder of said first ceramic wall means, said metaLlic conductor tabs being directed transversely for establishing electrical connections with the terminals of the semiconductor device; e. metallic conductors disposed perpendicularly to said transversely directed conductor tabs and extending through said first ceramic wall means and said base in contact with said conductor tabs respectively for establishing electrical connections between said conductor tabs respectively and electrical connections to said package; and f. a cover hermetically sealed to said second ceramic wall means for encapsulating the semiconductor device within said package.
Claim 2
Dependent Claim
201 words
A package for an electronic semiconductor device comprising: a. a ceramic base with a metal pad on which the semiconductor device is seated with the terminals thereof at an elevated position; b. first ceramic wall means on said base formed with a cavity therein for receiving the semiconductor device; c. second ceramic wall means on said first ceramic wall means, said second ceramic wall means being formed with a cavity of greater dimension than said cavity of said first ceramic wall means, said second cermaic wall means being seated on said first ceramic wall means to form a shoulder on said first ceramic wall means; d. metallic conductor tabs disposed on said shoulder of said first ceramic wall means, said metaLlic conductor tabs being directed transversely for establishing electrical connections with the terminals of the semiconductor device; e. metallic conductors disposed perpendicularly to said transversely directed conductor tabs and extending through said first ceramic wall means and said base in contact with said conductor tabs respectively for establishing electrical connections between said conductor tabs respectively and electrical connections to said package; and f. a cover hermetically sealed to said second ceramic wall means for encapsulating the semiconductor device within said package.
Claim 3
Dependent Claim
23 words
A package as claimed in claim 1 wherein said first ceramic wall means and said second ceramic wall means form a unitary structure.
Claim 4
Dependent Claim
210 words
A package for an electronic semiconductor device comprising: a. a ceramic bottom layer formed with a plurality of vertically disposed holes therethrough filled with metallic conducting material, a metallic pad centrally disposed on said bottom layer on which is seated the semiconductor device with the terminals thereof elevated; b. a ceramic intermediate layer formed with a centrally located cavity for receiving the semiconductor device and with a plurality of vertically disposed holes therethrough filled with metallic conducting material, said metallic filled holes of said intermediate layer being disposed in register with respective metallic filled holes of said bottom layer for establishing electrical connections therewith; c. a top layer formed with a cavity of greater dimension than said cavity of said intermediate layer and disposed on said intermediate layer for defining a shoulder on said intermediate layer; d. a plurality of transversely directed metallic conductor tabs seated on said shoulder of said intermediate layer in contact respectively with the metallic conducting material of said plurality of vertically disposed holes of said intermediate layer for establishing electrical connections therewith; and e. said bottom layer, said intermediate layer and said top layer forming a unitary structure; f. a cover hermetically sealed to said top layer for encapsulating the semiconductor device within said package.
Claim 5
Dependent Claim
210 words
A package for an electronic semiconductor device comprising: a. a ceramic bottom layer formed with a plurality of vertically disposed holes therethrough filled with metallic conducting material, a metallic pad centrally disposed on said bottom layer on which is seated the semiconductor device with the terminals thereof elevated; b. a ceramic intermediate layer formed with a centrally located cavity for receiving the semiconductor device and with a plurality of vertically disposed holes therethrough filled with metallic conducting material, said metallic filled holes of said intermediate layer being disposed in register with respective metallic filled holes of said bottom layer for establishing electrical connections therewith; c. a top layer formed with a cavity of greater dimension than said cavity of said intermediate layer and disposed on said intermediate layer for defining a shoulder on said intermediate layer; d. a plurality of transversely directed metallic conductor tabs seated on said shoulder of said intermediate layer in contact respectively with the metallic conducting material of said plurality of vertically disposed holes of said intermediate layer for establishing electrical connections therewith; and e. said bottom layer, said intermediate layer and said top layer forming a unitary structure; f. a cover hermetically sealed to said top layer for encapsulating the semiconductor device within said package.
References Cited (Backward Citations)
US3312771A
Cited
US3558993A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-11-11 | 1978-05-13 | 1978-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-11-11 | 1982-05-13 | 1982-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-11-11 | 1986-05-13 | 1986-11-12 | $7700.00 | Window Closed / Lapsed |