Patent US5262594A successfully refreshed from Google Patents.
US5262594A
Expired / Lapsed
US
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Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
Assignee: TDY Industries LLC
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Filing: 1990-10-12
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Granted: 1993-11-16
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Expires: 2010-10-12
Abstract
Abstract A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
Inventors
- 👤 Eric R. Edwin
- 👤 James J. Tumlinson
- 👤 Jerome A. Wilson
- 👤 Thad C. McMillan, Jr.
- 👤 Rollin G. Meyer
- 👤 Darryl J. McKenney
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 22:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4688; H05K3/4691; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/0909; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0557; H05K2203/30; H05K2203/308; H05K3/341; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
86 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens, comprising: a rigid printed circuit board section; a pliant, flexible section extending from said rigid printed circuit board section; and means for insulating said flexible section from high temperatures, said means for insulating being removably connected to said rigid printed circuit board section, wherein said means for insulating is capable of being removed to permit said flexible section to be compliantly manipulated into a modified configuration.
Claim 2
Dependent Claim
86 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens, comprising: a rigid printed circuit board section; a pliant, flexible section extending from said rigid printed circuit board section; and means for insulating said flexible section from high temperatures, said means for insulating being removably connected to said rigid printed circuit board section, wherein said means for insulating is capable of being removed to permit said flexible section to be compliantly manipulated into a modified configuration.
Claim 3
Dependent Claim
25 words
The circuit board of claim 1, wherein said rigid printed circuit board section comprises multiple conductor layers, said conductor layers having an insulator layer therebetween.
Claim 4
Dependent Claim
14 words
The circuit board of claim 2, wherein said flexible section comprises multiple conductor layers.
Claim 5
Dependent Claim
75 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens, comprising: a rigid section including multiple conductor layers, said conductor layers having an insulator layer therebetween; a flexible section extending from said rigid section; a top insulating cover; and a bottom insulating cover, wherein said top and bottom insulating covers extend above and below said flexible section and protect said flexible section from high temperatures.
Claim 6
Dependent Claim
75 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens, comprising: a rigid section including multiple conductor layers, said conductor layers having an insulator layer therebetween; a flexible section extending from said rigid section; a top insulating cover; and a bottom insulating cover, wherein said top and bottom insulating covers extend above and below said flexible section and protect said flexible section from high temperatures.
Claim 7
Dependent Claim
25 words
The circuit board of claim 4, wherein said top and bottom insulating covers are supported by said rigid section and separated from said flexible section.
Claim 8
Dependent Claim
27 words
The circuit board of claim 4, wherein said top and bottom insulating covers are integrated with said conductor layers and said insulator layers of said rigid section.
Claim 9
Dependent Claim
38 words
The circuit board of claim 6, wherein said top insulating cover is integral with the top conductor layer and top insulator layer and said bottom insulating cover is integrated with the bottom conductor layer and bottom insulator layer.
Claim 10
Dependent Claim
40 words
The circuit board of claim 5, wherein said means for protecting further comprises: a top spacer positioned between said top insulating cover and said flexible section; and a bottom spacer positioned between said bottom insulating cover and said flexible section.
Claim 11
Dependent Claim
30 words
The circuit board of claim 8, wherein said top and bottom spacers are freely confined in said respective spaces between said top and bottom insulating covers and said flexible section.
Claim 12
Dependent Claim
101 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infared reflow ovens, comprising: a first rigid printed circuit board section; a second rigid printed circuit board section; a pliant, flexible section extending between said first and second rigid printed circuit board sections; and means for insulating said pliant, flexible section from high temperatures, said means for insulating being removably connected to said first and second rigid printed circuit board sections, wherein said means for insulating is capable of being removed to permit said flexible section to be compliantly manipulated into a modified configuration.
Claim 13
Dependent Claim
101 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infared reflow ovens, comprising: a first rigid printed circuit board section; a second rigid printed circuit board section; a pliant, flexible section extending between said first and second rigid printed circuit board sections; and means for insulating said pliant, flexible section from high temperatures, said means for insulating being removably connected to said first and second rigid printed circuit board sections, wherein said means for insulating is capable of being removed to permit said flexible section to be compliantly manipulated into a modified configuration.
Claim 14
Dependent Claim
27 words
The circuit board of claim 10, wherein each of said first and second rigid sections comprises multiple conductor layers, said conductor layers having an insulator layer therebetween.
Claim 15
Dependent Claim
14 words
The circuit board of claim 11, wherein said flexible section comprises multiple conductor layers.
Claim 16
Dependent Claim
99 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens, comprising: a first rigid section; a second rigid section; wherein each of said first and second rigid sections includes multiple conductor layers, said conductor layers having an insulator layer therebetween; a flexible section extending between said first and second rigid sections; a top insulating cover; and a bottom insulating cover; wherein said top and bottom insulating covers extend above and below said flexible section between said first and second rigid sections and protect said flexible section from high temperatures.
Claim 17
Dependent Claim
99 words
A rigid-flex printed circuit board capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens, comprising: a first rigid section; a second rigid section; wherein each of said first and second rigid sections includes multiple conductor layers, said conductor layers having an insulator layer therebetween; a flexible section extending between said first and second rigid sections; a top insulating cover; and a bottom insulating cover; wherein said top and bottom insulating covers extend above and below said flexible section between said first and second rigid sections and protect said flexible section from high temperatures.
Claim 18
Dependent Claim
25 words
The circuit board of claim 13, wherein said top and bottom insulating covers are supported by said rigid section and separated from said flexible section.
Claim 19
Dependent Claim
30 words
The circuit board of claim 13, wherein said top and bottom insulating covers are integral with said conductor layers and said insulator layers of said first and second rigid sections.
Claim 20
Dependent Claim
38 words
The circuit board of claim 15, wherein said top insulating cover is integral with the top conductor layer and top insulator layer and said bottom insulating cover is integral with the bottom conductor layer and bottom insulator layer.
Claim 21
Dependent Claim
40 words
The circuit board of claim 14, wherein said means for protecting further comprises: a top spacer positioned between said top insulating cover and said flexible section; and a bottom spacer positioned between said bottom insulating cover and said flexible section.
Claim 22
Dependent Claim
30 words
The circuit board claim 17, wherein said top and bottom spacers are freely confined located in said respective spaces between said top and bottom insulating covers and said flexible section.
Claim 23
Dependent Claim
45 words
The circuit board of claim 18, wherein said conductor layers and said insulator layers located between said flexible section and said top and bottom covers each have a cutout located over said flexible section which forms said respective spaces for said top and bottom spacers.
Claim 24
Dependent Claim
40 words
The circuit board of claim 19, wherein said top and bottom spacers are made from the material remaining from the cutouts from said conductor layers and said insulator layers located between said flexible section and said top and bottom covers.
Claim 25
Dependent Claim
51 words
The circuit board of claim 20, wherein said top and bottom spacers are comprised of less than all of said conductor layers and said insulator layers located between said flexible section and said top and bottom covers so that the top and bottom spacers are freely confined in said respective spaces.
References Cited (Backward Citations)
US3409732A
Cited
US4424094A
Cited
US4965227A
Cited
US4800461A
Cited
US4959900A
Cited
US4951400A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-15 | 1997-05-17 | 1997-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-15 | 2001-05-17 | 2001-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-15 | 2005-05-17 | 2005-11-16 | $7700.00 | Window Closed / Lapsed |