Semiconductor device and electronic apparatus using semiconductor device

Claim 2

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 3

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is formed to dissipate heat caused by an operation of said semiconductor element through said heat dissipation body, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 4

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is formed to dissipate heat caused by an operation of said semiconductor element through said heat dissipation body, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 5

A semiconductor device having a package structure comprising an electrically insulated base body, a semiconductor element being mounted on a first portion of said electrically insulated body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 6

A semiconductor device having a package structure comprising an electrically insulated base body, a semiconductor element being mounted on a first portion of said electrically insulated body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 7

A semiconductor device having a package structure comprising an electrically insulated base body, a semiconductor element being mounted on a first portion of said electrically insulated base body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said electrically insulated body has a dissipation fin member, said dissipation fin member is mounted on a surface of said electrically insulated base body, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member and from said dissipation fin member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 8

A semiconductor device having a package structure comprising an electrically insulated base body, a semiconductor element being mounted on a first portion of said electrically insulated base body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said electrically insulated body has a dissipation fin member, said dissipation fin member is mounted on a surface of said electrically insulated base body, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member and from said dissipation fin member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 9

A semiconductor device having a package structure comprising an electrically insulated base body, a semiconductor element being mounted on a first portion of said electrically insulated base body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 10

A semiconductor device having a package structure comprising an electrically insulated base body, a semiconductor element being mounted on a first portion of said electrically insulated base body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 11

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body having a thermal conductivity of above 160 W/mK at a room temperature, a semiconductor element being mounted on said electrically insulated base body, said semiconductor element having input/output electrode portions, said semiconductor element having a heat generation amount of above 5 W, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said electrically insulated base body has a dissipation fin member, and said dissipation fin member is mounted on a surface of said electrically insulated base body, whereby said dissipation fin member cools said semiconductor element so as to maintain a temperature of below 85° C. during an operation of said semiconductor element, and said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 12

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body having a thermal conductivity of above 160 W/mK at a room temperature, a semiconductor element being mounted on said electrically insulated base body, said semiconductor element having input/output electrode portions, said semiconductor element having a heat generation amount of above 5 W, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said electrically insulated base body has a dissipation fin member, and said dissipation fin member is mounted on a surface of said electrically insulated base body, whereby said dissipation fin member cools said semiconductor element so as to maintain a temperature of below 85° C. during an operation of said semiconductor element, and said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 13

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said package member has a fixing means, separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 14

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said package member has a fixing means, separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 15

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said heat dissipation body further has a dissipation fin member, said package member has a fixing means, separate from said flexible insulated substance member and from said dissipation fin member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 16

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said heat dissipation body further has a dissipation fin member, said package member has a fixing means, separate from said flexible insulated substance member and from said dissipation fin member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 17

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions of above 400, said semiconductor element having a heat generation amount of above 5 W, package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member and said heat dissipation body further has a dissipation fin member, said package member has a fixing means, separate from said flexible insulated substance member and from said dissipation fin member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 18

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions of above 400, said semiconductor element having a heat generation amount of above 5 W, package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member and said heat dissipation body further has a dissipation fin member, said package member has a fixing means, separate from said flexible insulated substance member and from said dissipation fin member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 19

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, a package member for packaging said silicon chip member, said package member being comprised of an epoxy system resin composition material, a carrier film member being inserted into said package member, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, separate from said carrier film member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 20

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, a package member for packaging said silicon chip member, said package member being comprised of an epoxy system resin composition material, a carrier film member being inserted into said package member, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, separate from said carrier film member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 21

A semiconductor device having a package structure according to claim 10, wherein a dissipation fin member for dissipating a generation heat of said electrically insulated base body is provided on said electrically insulated base body.

Claim 22

A semiconductor device having a package structure according to claim 10, wherein a filling agent is filled up between said electrically insulated base body and one surface of said wiring substrate.

Claim 23

A semiconductor device having a package structure according to claim 10, further comprising: a metallic plate mounted on another surface of said wiring substrate.

Claim 24

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on one surface of said electrically insulated base body, said silicon chip member having input/output electrode portions, a package member for packaging said silicon chip member, said package member being comprised of an epoxy system resin composition material, a carrier film member being inserted into said package member, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, separate from said carrier film member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 25

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on one surface of said electrically insulated base body, said silicon chip member having input/output electrode portions, a package member for packaging said silicon chip member, said package member being comprised of an epoxy system resin composition material, a carrier film member being inserted into said package member, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said package member has a fixing means, separate from said carrier film member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 26

A semiconductor device having a package structure according to claim 14, wherein a dissipation fin member for dissipating a generation heat of said electrically insulated base body is provided on said electrically insulated base body.

Claim 27

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, an insulated cap member for packaging said silicon chip member, a carrier film member being inserted between said insulated cap member and said electrically insulated base body, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said insulated cap member, said insulated cap member has a fixing means, separate from said carrier film member, for fixing said insulated cap member to a wiring substrate, said fixing means is formed integral with said insulated cap member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said insulated cap member, and said fixing means extends outwardly from at least a second portion of said insulated cap member different than said first portion so that the mechanical fixing of said insulated cap member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 28

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, an insulated cap member for packaging said silicon chip member, a carrier film member being inserted between said insulated cap member and said electrically insulated base body, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said insulated cap member, said insulated cap member has a fixing means, separate from said carrier film member, for fixing said insulated cap member to a wiring substrate, said fixing means is formed integral with said insulated cap member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said insulated cap member, and said fixing means extends outwardly from at least a second portion of said insulated cap member different than said first portion so that the mechanical fixing of said insulated cap member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 29

A semiconductor device having a package structure according to claim 16, wherein a dissipation fin member for dissipating a generation heat of said electrically insulated base body is provided on said electrically insulated base body.

Claim 30

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, an insulated cap member for packaging said silicon chip member, a carrier film member being inserted between said insulated cap member and said electrically insulated base body, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said insulated cap member, said insulated cap member has a fixing means, separate from said carrier film member, for fixing said insulated cap member to a wiring substrate, said fixing means is formed integrally with said insulated cap member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said insulated cap member, and said fixing means extends outwardly from at least a second portion of said insulated cap member different than said first portion so that the mechanical fixing of said insulated cap member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 31

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, an insulated cap member for packaging said silicon chip member, a carrier film member being inserted between said insulated cap member and said electrically insulated base body, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said insulated cap member, said insulated cap member has a fixing means, separate from said carrier film member, for fixing said insulated cap member to a wiring substrate, said fixing means is formed integrally with said insulated cap member, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said insulated cap member, and said fixing means extends outwardly from at least a second portion of said insulated cap member different than said first portion so that the mechanical fixing of said insulated cap member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 32

A semiconductor device having a package structure according to claim 18, wherein a dissipation fin member for dissipating a generation heat of said electrically insulated base body is provided on said electrically insulated base body.

Claim 33

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 34

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, said package member has a fixing means, which is integral with said package member and separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 35

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions of above 400, said semiconductor element having a heat generation amount of above 5 W, package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member and said heat dissipation body has a fixing means, separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 36

A semiconductor device having a package structure comprising a heat dissipation body, a semiconductor element being mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions of above 400, said semiconductor element having a heat generation amount of above 5 W, package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member and said heat dissipation body has a fixing means, separate from said flexible insulated substance member, for fixing said package member to a wiring substrate, said fixing means is formed integrally with said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 37

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, a package member for packaging said silicon chip member, said package member being comprised of an epoxy system resin composition material, a carrier film member being inserted into said package member, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said electrically insulated base body has a fixing means, separate from said carrier film member, for fixing said package member to a wiring substrate, said fixing means is formed integral with said electrically insulated base body, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 38

A semiconductor device having a package structure comprising an electrically insulated base body, said electrically insulated base body comprising at least one of an aluminum nitride sintering body, a silicon carbide sintering body, an aluminum oxide sintering body and a beryllium oxide sintering body, said electrically insulated base body having a thermal conductivity of above 160 W/mK, a silicon chip member being mounted on a first portion of said electrically insulated base body, said silicon chip member having input/output electrode portions, a package member for packaging said silicon chip member, said package member being comprised of an epoxy system resin composition material, a carrier film member being inserted into said package member, and said carrier film member having lead wires, each of said input/output electrode portions of said silicon chip member being connected electrically to each of said lead wires of said carrier film member, wherein a second portion of said electrically insulated base body is exposed on a surface of said package member, said electrically insulated base body has a fixing means, separate from said carrier film member, for fixing said package member to a wiring substrate, said fixing means is formed integral with said electrically insulated base body, said wiring substrate is connected electrically to said lead wires of said carrier film member, said carrier film member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 39

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, and said input/output electrode portions of said semiconductor element being connected electrically to a wiring substrate through said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, and said package member is fixed to said wiring substrate through a fixing means which is integral with said package member, and said package member flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 40

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, and said input/output electrode portions of said semiconductor element being connected electrically to a wiring substrate through said lead wires of said flexible insulated substance member, wherein a second portion of said heat dissipation body is exposed on a surface of said package member, and said package member is fixed to said wiring substrate through a fixing means which is integral with said package member, and said package member flexible insulated substance member, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 41

An electronic apparatus having a wiring substrate and a package structure type semiconductor device, said semiconductor device being packaged on said wiring substrate, and said semiconductor device comprising a heat dissipation body, a semiconductor element being mounted on said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, and said input/output electrode portions of said semiconductor element being connected electrically to said wiring substrate through said lead wires of said flexible insulated substance member, wherein said package member is fixed tightly to said wiring substrate, by a fixing means which is integral with said package member, and separated from said flexible insulated substance member, said heat dissipation body is disposed to dissipate a heat which is generated by an operation of said semiconductor element toward an outside of said package member, and said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 42

An electronic apparatus having a wiring substrate and a package structure type semiconductor device, said semiconductor device being packaged on said wiring substrate, and said semiconductor device comprising a heat dissipation body, a semiconductor element being mounted on said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, a flexible insulated substance member being inserted into said package member, said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, and said input/output electrode portions of said semiconductor element being connected electrically to said wiring substrate through said lead wires of said flexible insulated substance member, wherein said package member is fixed tightly to said wiring substrate, by a fixing means which is integral with said package member, and separated from said flexible insulated substance member, said heat dissipation body is disposed to dissipate a heat which is generated by an operation of said semiconductor element toward an outside of said package member, and said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 43

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is fixed to said wiring substrate through a fixing means, separate from said flexible insulated substance member, said fixing means is formed integrally on said package member, a second portion of said heat dissipation body is exposed on a surface of said package member, said heat dissipation body has a dissipation fin member, which is separate from said fixing means, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 44

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is fixed to said wiring substrate through a fixing means, separate from said flexible insulated substance member, said fixing means is formed integrally on said package member, a second portion of said heat dissipation body is exposed on a surface of said package member, said heat dissipation body has a dissipation fin member, which is separate from said fixing means, said flexible insulated substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 45

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is fixed to a wiring substrate through a fixing means, separate from said flexible insulated substance member, said fixing means is formed integrally on said package member, a second portion of said heat dissipation body is exposed on a surface of said package member, said heat dissipation body has a dissipation fin member which is separate from said fixing means, whereby said dissipation fin member cools said semiconductor element to set a temperature of below 85° C. during an operation of said semiconductor element, said flexible insulating substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 46

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrode portions, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is fixed to a wiring substrate through a fixing means, separate from said flexible insulated substance member, said fixing means is formed integrally on said package member, a second portion of said heat dissipation body is exposed on a surface of said package member, said heat dissipation body has a dissipation fin member which is separate from said fixing means, whereby said dissipation fin member cools said semiconductor element to set a temperature of below 85° C. during an operation of said semiconductor element, said flexible insulating substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 47

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrodes of above 400 and having a heat generation amount of above 5 W, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is fixed to a wiring substrate through a fixing means, separate from said flexible insulated substance member, said fixing means is formed integrally on said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, a second portion of said heat dissipation body is exposed on a surface of said package member, and said heat dissipation body has a dissipation fin member which is separate from said fixing means, whereby said dissipation fin member cools said semiconductor element to set a temperature of below 85° C. during an operation of said semiconductor element, said flexible insulating substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 48

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on a first portion of said heat dissipation body, said semiconductor element having input/output electrodes of above 400 and having a heat generation amount of above 5 W, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said input/output electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein said package member is fixed to a wiring substrate through a fixing means, separate from said flexible insulated substance member, said fixing means is formed integrally on said package member, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, a second portion of said heat dissipation body is exposed on a surface of said package member, and said heat dissipation body has a dissipation fin member which is separate from said fixing means, whereby said dissipation fin member cools said semiconductor element to set a temperature of below 85° C. during an operation of said semiconductor element, said flexible insulating substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 49

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on said heat dissipation body, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a fixing means, separate from said flexible insulated substance member, is formed integrally with said insulated resin composition material of said package member, said heat dissipation body is fixed adhesively to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said wiring substrate serves as a dissipation fin member, said flexible insulating substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 50

An electronic apparatus having a package structure type semiconductor device, said semiconductor device comprising a heat dissipation body, a semiconductor element mounted on said heat dissipation body, a package member for packaging said semiconductor element, said package member being comprised of an insulated resin composition material, a flexible insulated substance member being inserted into said package member, and said flexible insulated substance member having lead wires, each of said electrode portions of said semiconductor element being connected electrically to each of said lead wires of said flexible insulated substance member, wherein a fixing means, separate from said flexible insulated substance member, is formed integrally with said insulated resin composition material of said package member, said heat dissipation body is fixed adhesively to a wiring substrate, said wiring substrate is connected electrically to said lead wires of said flexible insulated substance member, said wiring substrate serves as a dissipation fin member, said flexible insulating substance member extends outside at least a first portion of said package member, and said fixing means extends outwardly from at least a second portion of said package member different than said first portion so that the mechanical fixing of said package member to said wiring substrate is independent of and separated from the electrical connection of said lead wires to said wiring substrate.

Claim 51

A semiconductor device according to claim 1, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 52

A semiconductor device according to claim 2, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 53

A semiconductor device according to claim 3, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 54

A semiconductor device according to claim 4, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 55

A semiconductor device according to claim 5, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 56

A semiconductor device according to claim 7, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 57

A semiconductor device according to claim 8, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 58

A semiconductor device according to claim 9, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 59

A semiconductor device according to claim 10, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means includes four portions extending, respectively, from the four corners of the rectangular shape while the carrier film member extends outside respective sides of the rectangular shape between the four corners.

Claim 60

A semiconductor device according to claim 14, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means includes four portions extending, respectively, from the four corners of the rectangular shape while the carrier film member extends outside respective sides of the rectangular shape between the four corners.

Claim 61

A semiconductor device according to claim 16, wherein the insulated cap member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means includes four portions extending, respectively, from the four corners of the insulated cap member while the carrier film member extends outside respective sides of the rectangular shape between the four corners.

Claim 62

A semiconductor device according to claim 18, wherein the insulated cap member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means includes four portions extending, respectively, from the four corners of the insulated cap member while the carrier film member extends outside respective sides of the rectangular shape between the four corners.

Claim 63

A semiconductor device according to claim 20, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangular while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 64

A semiconductor device according to claim 21, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 65

A semiconductor device according to claim 22, wherein the first portion of the electrically insulated base body where said silicon chip member is mounted is an upper side of the electrically insulated base body, and wherein the fixing means extend from a lower surface of the electrically insulated base body while the carrier film member extends beyond peripheral edges of the electrically insulated base body.

Claim 66

A semiconductor device according to claim 23, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 67

A semiconductor device according to claim 25, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 68

A semiconductor device according to claim 26, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 69

A semiconductor device according to claim 27, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.

Claim 70

A semiconductor device according to claim 28, wherein the package member has a substantially rectangular shape when viewed from the top of the semiconductor device, and wherein the fixing means extend from the four corners of the rectangle while the flexible insulated substance member extends outside respective sides of the rectangular shape between the four corners.