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Patent US5256901A successfully refreshed from Google Patents.
US5256901A
Expired / Lapsed
US
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Ceramic package for memory semiconductor
Assignee: NGK Insulators Ltd
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Filing: 1992-07-20
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Granted: 1993-10-26
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Expires: 2012-07-20
Abstract
Abstract A ceramic package for a memory semiconductor accommodates therein the memory semiconductor and is sealingly closed by an ultraviolet ray transmissible ceramic lid. The ceramic lid is made of a polycrystalline alumina and formed with at least one groove in a sealing portion with the ceramic package. With the arrangement, the ceramic package is superior in sealing strength, air-tightness and ultraviolet ray transmission and can easily accommodate any increase of memory amount of semiconductor elements.
Inventors
- 👤 Toshio Ohashi
- 👤 Masaki Wakayama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:11
CPC Classifications
G; G11; G11C; G11C5/00; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
92 words
A ceramic package for a memory semiconductor, comprising: a ceramic package body having substantially flat shoulder portions which define a recess to accommodate said memory semiconductor; a ceramic lid comprising ultraviolet ray-transmissible polycrystalline alumina, a portion of said ceramic lid being fixed to said substantially flat shoulder portions of said ceramic package body through glass sealing means, said portion of said ceramic lid having at least one continuous groove of rectangular cross-section formed therein; and electrical leads for providing electrical communication between said memory semiconductor and an exterior of said ceramic package.
Claim 2
Dependent Claim
92 words
A ceramic package for a memory semiconductor, comprising: a ceramic package body having substantially flat shoulder portions which define a recess to accommodate said memory semiconductor; a ceramic lid comprising ultraviolet ray-transmissible polycrystalline alumina, a portion of said ceramic lid being fixed to said substantially flat shoulder portions of said ceramic package body through glass sealing means, said portion of said ceramic lid having at least one continuous groove of rectangular cross-section formed therein; and electrical leads for providing electrical communication between said memory semiconductor and an exterior of said ceramic package.
Claim 3
Dependent Claim
36 words
The ceramic package of claim 1, wherein said at least one continuous groove is formed in said portion of said ceramic lid in substantial alignment with a center of said shoulder portions of said ceramic package.
Claim 4
Dependent Claim
27 words
The ceramic package of claim 1, wherein said at least one continuous groove consists of a plurality of intersecting straight grooves along sides of said ceramic lid.
Claim 5
Dependent Claim
38 words
The ceramic package of claim 1, wherein said ceramic lid is made of a ceramic material selected from the group consisting of the Al 2 O 3 -MgO group and the Al 2 O 3 -MgO-rare earth group.
Claim 6
Dependent Claim
110 words
A ceramic package for a memory semiconductor, comprising: a ceramic package body having substantially flat shoulder portions which define a recess to accommodate said memory semiconductor; a ceramic lid comprising ultraviolet ray-transmissible polycrystalline alumina, a portion of said ceramic lid being fixed to said substantially flat shoulder portions of said ceramic package body through glass sealing means, said portion of said ceramic lid having at least one continuous groove formed therein, wherein a depth of said at least one continuous groove is less than one-half of a thickness of said ceramic lid; and electrical leads for providing electrical communication between said memory semiconductor and an exterior of said ceramic package.
Claim 7
Dependent Claim
110 words
A ceramic package for a memory semiconductor, comprising: a ceramic package body having substantially flat shoulder portions which define a recess to accommodate said memory semiconductor; a ceramic lid comprising ultraviolet ray-transmissible polycrystalline alumina, a portion of said ceramic lid being fixed to said substantially flat shoulder portions of said ceramic package body through glass sealing means, said portion of said ceramic lid having at least one continuous groove formed therein, wherein a depth of said at least one continuous groove is less than one-half of a thickness of said ceramic lid; and electrical leads for providing electrical communication between said memory semiconductor and an exterior of said ceramic package.
Claim 8
Dependent Claim
29 words
The ceramic package of claim 5, wherein the thickness of said ceramic lid is 0.2-0.35 mm and the depth of said at least one continuous groove is 40-80 μm.
Claim 9
Dependent Claim
29 words
The ceramic package of claim 5, wherein the thickness of said ceramic lid is 0.2-0.35 mm and the depth of said at least one continuous groove is 50 μm.
Claim 10
Dependent Claim
114 words
A ceramic package for a memory semiconductor, comprising: a ceramic package body having substantially flat shoulder portions which define a recess to accommodate said memory semiconductor; a ceramic lid comprising ultraviolet ray-transmissible polycrystalline alumina, a portion of said ceramic lid to be fixed to said substantially flat shoulder portions of said ceramic package body having at least one continuous groove formed therein; glass sealing means interposed between said portion of said ceramic lid and said substantially flat shoulder portions of said ceramic package body, said glass sealing means extending over the entirety of said shoulder portions, and extending into said groove and over portions of said ceramic lid adjacent both sides of said groove.
Claim 11
Dependent Claim
114 words
A ceramic package for a memory semiconductor, comprising: a ceramic package body having substantially flat shoulder portions which define a recess to accommodate said memory semiconductor; a ceramic lid comprising ultraviolet ray-transmissible polycrystalline alumina, a portion of said ceramic lid to be fixed to said substantially flat shoulder portions of said ceramic package body having at least one continuous groove formed therein; glass sealing means interposed between said portion of said ceramic lid and said substantially flat shoulder portions of said ceramic package body, said glass sealing means extending over the entirety of said shoulder portions, and extending into said groove and over portions of said ceramic lid adjacent both sides of said groove.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-25 | 1997-04-26 | 1997-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-25 | 2001-04-26 | 2001-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-25 | 2005-04-26 | 2005-10-26 | $7700.00 | Window Closed / Lapsed |