JPS537172A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Solder-sealed ceramic package
Assignee: Hitachi Ltd
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Filing: 1976-07-09
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Granted: —
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Expires: 1996-07-09
Abstract
Abstract PURPOSE: Entry of molten solder into package body is prevented by beforehand forming a groove on one or both of a ceramic package body and cover. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Kaneichi Otsuki
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 22:21
CPC Classifications
B; B23; B23K; B23K2101/00; B23K2101/36
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