Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
160 words
A method for preparing an amorphous silicon solar cell in which there is formed on a substrate successively, a first electrode, a first conductive film, a thinner first substantially intrinsic film, a thicker second substantially intrinsic film, a second conductive film of a conductivity type different from that of the first conductive film, and a second electrode, which method comprises forming at least the thicker second substantially intrinsic film by the sequential steps of: (a) depositing a semiconductor film containing 20 atom % or less of bound hydrogen and/or bound deuterium, to a thickness of 10 to 1000 Å, and then (b) modifying the deposited film by exposing the film (i) to a discharge atmosphere containing a non-film-depositing reactive gas, (ii) to monovalent ions, or (iii) to atomic hydrogen or atomic deuterium and repeating the sequence of steps (a) and (b) multiple times whereby the thickness of the second substantially intrinsic film is thicker than the first substantially intrinsic film.
Claim 2
Independent Claim
160 words
A method for preparing an amorphous silicon solar cell in which there is formed on a substrate successively, a first electrode, a first conductive film, a thinner first substantially intrinsic film, a thicker second substantially intrinsic film, a second conductive film of a conductivity type different from that of the first conductive film, and a second electrode, which method comprises forming at least the thicker second substantially intrinsic film by the sequential steps of: (a) depositing a semiconductor film containing 20 atom % or less of bound hydrogen and/or bound deuterium, to a thickness of 10 to 1000 Å, and then (b) modifying the deposited film by exposing the film (i) to a discharge atmosphere containing a non-film-depositing reactive gas, (ii) to monovalent ions, or (iii) to atomic hydrogen or atomic deuterium and repeating the sequence of steps (a) and (b) multiple times whereby the thickness of the second substantially intrinsic film is thicker than the first substantially intrinsic film.
Claim 3
Dependent Claim
35 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein a thinner third substantially intrinsic film is further formed between the thicker second substantially intrinsic film and the second conductive film.
Claim 4
Dependent Claim
28 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein the semiconductor film thickness in the step (a) is from 10 to 100 Å.
Claim 5
Dependent Claim
36 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein the amount of bound hydrogen and/or bound deuterium in the semiconductor film in the step (a) is 10 atom % or less.
Claim 6
Dependent Claim
35 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein the modification step (b) is carried out by exposing the deposited film to a discharge atmosphere containing a non-film-depositing reactive gas.
Claim 7
Dependent Claim
39 words
The method for preparing an amorphous silicon solar cell according to claim 5 wherein the non-film-depositing reactive gas is at least one gas selected from the group consisting of hydrogen, deuterium, hydrogen fluoride, fluorine, nitrogen trifluoride, and carbon tetrafluoride.
Claim 8
Dependent Claim
29 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein the modification step (b) is carried out by exposing the deposited film to monovalent ions.
Claim 9
Dependent Claim
32 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein the modification step (b) is carried out by exposing the deposited film to atomic hydrogen or atomic deuterium.
Claim 10
Dependent Claim
31 words
The method for preparing an amorphous, silicon solar cell according to claim 1 wherein the final thickness of the thicker second substantially intrinsic film is from 500 Å to 2 μm.
Claim 11
Dependent Claim
37 words
The method for preparing an amorphous silicon solar cell according to claim 1 wherein the amount of bound hydrogen and/or bound deuterium in the obtained thicker second substantially intrinsic film is from 1 to 10 atom %.
Claim 12
Dependent Claim
12 words
An amorphous silicon solar cell formed by a method of claim 1.
Claim 13
Independent Claim
149 words
A method for preparing an amorphous silicon solar cell in which there is formed on a substrate successively, a first electrode, a first conductive film, a thinner first substantially intrinsic film, a thicker second substantially intrinsic film, a second conductive film of a conductivity type different from that of the first conductive film, and a second electrode, which method comprises forming at least the thicker second substantially intrinsic film by the sequential steps of: (a) depositing to a thickness of from 10 to 100 Å, a semiconductor film containing halogen atoms as deposited or to which halogen atoms are thereafter added thereto by exposure to a halogen-containing reactive gas and then (b) modifying the deposited film by subjecting it to dehydrohalogenation, and repeating the sequence of steps (a) and (b) multiple times whereby the thickness of the second substantially intrinsic film is thicker than the first substantially intrinsic film.
Claim 14
Independent Claim
149 words
A method for preparing an amorphous silicon solar cell in which there is formed on a substrate successively, a first electrode, a first conductive film, a thinner first substantially intrinsic film, a thicker second substantially intrinsic film, a second conductive film of a conductivity type different from that of the first conductive film, and a second electrode, which method comprises forming at least the thicker second substantially intrinsic film by the sequential steps of: (a) depositing to a thickness of from 10 to 100 Å, a semiconductor film containing halogen atoms as deposited or to which halogen atoms are thereafter added thereto by exposure to a halogen-containing reactive gas and then (b) modifying the deposited film by subjecting it to dehydrohalogenation, and repeating the sequence of steps (a) and (b) multiple times whereby the thickness of the second substantially intrinsic film is thicker than the first substantially intrinsic film.
Claim 15
Dependent Claim
35 words
The method for preparing an amorphous silicon solar cell according to claim 12 wherein a thinner third substantially intrinsic film is further formed between the thicker second substantially intrinsic film and the second conductive film.
Claim 16
Dependent Claim
47 words
The method for preparing an amorphous silicon solar cell according to claim 12 wherein the silicon semiconductor film is a halogenated silicon semiconductor film, and the step of the dehydrohalogenation is carried out by bringing the halogenated silicon semiconductor film into contact with a silicon hydride gas.
Claim 17
Dependent Claim
24 words
The method for preparing an amorphous silicon solar cell according to claim 14 wherein the dehydrohalogenation is carried out with the irradiation of light.
Claim 18
Dependent Claim
47 words
The method for preparing an amorphous silicon solar cell according to claim 12 wherein the silicon semiconductor film is a hydrogenated silicon semiconductor film, and the step of the dehydrohalogenation is carried out by bringing the hydrogenated silicon semiconductor film into contact with a silicon halide gas.
Claim 19
Dependent Claim
23 words
The method for preparing an amorphous silicon solar cell according to claim 16 wherein the dehydrohalogenation is achieved with the irradiation of light.
Claim 20
Dependent Claim
12 words
An amorphous silicon solar cell formed by a method of claim 12.
Claim 21
Independent Claim
73 words
A method for preparing an amorphous silicon semiconductor film which comprises the sequential steps of: (a) depositing on a substrate a semiconductor film containing 20 atom % or less of bound hydrogen and/or bound deuterium, to a thickness of from 10 to 1000 Å, and then (b) modifying the deposited film by exposing it to a discharge atmosphere containing deuterium and a non-film-depositing reactive gas, the sequence of steps being repeated multiple times.
Claim 22
Independent Claim
73 words
A method for preparing an amorphous silicon semiconductor film which comprises the sequential steps of: (a) depositing on a substrate a semiconductor film containing 20 atom % or less of bound hydrogen and/or bound deuterium, to a thickness of from 10 to 1000 Å, and then (b) modifying the deposited film by exposing it to a discharge atmosphere containing deuterium and a non-film-depositing reactive gas, the sequence of steps being repeated multiple times.
Claim 23
Dependent Claim
28 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the semiconductor film thickness in the step (a) is from 5 to 100 Å.
Claim 24
Dependent Claim
36 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the amount of bound hydrogen and/or bound deuterium in the semiconductor film in the step (a) is 10 atom % or less.
Claim 25
Dependent Claim
32 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the modification step (b) is carried out by exposing the formed film to monovalent ions including deuterium ions.
Claim 26
Dependent Claim
32 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the modification step (b) is carried out by exposing the formed film to atomic hydrogen and atomic deuterium.
Claim 27
Dependent Claim
38 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the non-film-depositing reactive gas contains at least one gas selected from the group consisting of hydrogen, hydrogen fluoride, fluorine, nitrogen trifluoride, and carbon tetrafluoride.
Claim 28
Dependent Claim
34 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the thickness of the film obtained by repeating the steps (a) and (b) is from 1000 Å to 10 μm.
Claim 29
Dependent Claim
40 words
The method for preparing an amorphous silicon semiconductor film according to claim 19 wherein the amount of bound hydrogen and/or bound deuterium in the film obtained by repeating the steps (a) and (b) is from 1 to 10 atom %.
Claim 30
Dependent Claim
10 words
A semiconductor film formed by a method of claim 19.