Patent US5243496A successfully refreshed from Google Patents.
US5243496A
Expired / Lapsed
US
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Molded case integrated circuit with a dynamic impedance reducing device
Assignee: STMicroelectronics SA
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Filing: 1991-10-28
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Granted: 1993-09-07
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Expires: 2011-10-28
Abstract
Abstract A device for reducing dynamic impedances in a molded case integrated circuit comprises a chip (15) and several annular metal planes (21, 22) separated from each other by an insulating film (27, 28), each plane comprising, on its external border, legs (23, 24) coupled to the exterior of the case and, on its internal border, legs (25, 26) coupled to pads of the chip (15). The legs (23-26) are connected to the exterior and to the pads of the chip through leads (20) of a conventional connection network.
Inventors
- 👤 Michel Mermet-Guyennet
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:20
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/475; H10W70/464; H10W70/467; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
61 words
A device for reducing dynamic impedances in a molded case integrated circuit comprising a chip and a plurality of annular metal planes separated from each other by an insulating film, each of said metal planes comprising, on its external border, legs coupled to the exterior of the molded case and, on its internal border, legs coupled to pads of said chip.
Claim 2
Independent Claim
61 words
A device for reducing dynamic impedances in a molded case integrated circuit comprising a chip and a plurality of annular metal planes separated from each other by an insulating film, each of said metal planes comprising, on its external border, legs coupled to the exterior of the molded case and, on its internal border, legs coupled to pads of said chip.
Claim 3
Dependent Claim
29 words
The device for reducing dynamic impedances according to claim 1, wherein the legs are coupled to the exterior and to the chip pads through leads of a connection network.
Claim 4
Dependent Claim
18 words
The device for reducing dynamic impedances according to claim 2, wherein said legs are soldered on the leads.
Claim 5
Dependent Claim
30 words
The device for reducing dynamic impedances according to claim 1, wherein the annular metal planes and their legs are obtained by etching a metal film fixed on the insulating film.
Claim 6
Dependent Claim
19 words
The device for reducing dynamic impedances according to claim 4, wherein the connection network is also obtained by etching.
Claim 7
Dependent Claim
26 words
The device for reducing dynamic impedances according to claim 5, wherein the leads of said connection network are connected to shortened leads of a lead frame.
Claim 8
Dependent Claim
22 words
The device for reducing dynamic impedances according to claim 1, wherein one of the annular metal planes is comprised of several portions.
Claim 9
Dependent Claim
24 words
The device for reducing dynamic impedances according to claim 7, wherein the one of annular metal planes comprises a capacitor connected between adjacent portions.
Claim 10
Dependent Claim
16 words
The device according to claim 1, wherein said insulating film is formed by a plastic tape.
Claim 11
Dependent Claim
99 words
An integrated circuit device comprising: an integrated circuit chip having a plurality of terminals to be connected to external circuits. a lead layer including a plurality of leads for coupling said terminals to said external circuits. a plurality of conductive layers formed on said lead layer, each of said conductive layers having first conductors coupled to the corresponding terminals and second conductors coupled to the corresponding external circuits, said first conductors being connected to said second conductors through the corresponding leads, and a plurality of insulating layers disposed between said conductive layers for their electrical insulation from each other.
Claim 12
Dependent Claim
99 words
An integrated circuit device comprising: an integrated circuit chip having a plurality of terminals to be connected to external circuits. a lead layer including a plurality of leads for coupling said terminals to said external circuits. a plurality of conductive layers formed on said lead layer, each of said conductive layers having first conductors coupled to the corresponding terminals and second conductors coupled to the corresponding external circuits, said first conductors being connected to said second conductors through the corresponding leads, and a plurality of insulating layers disposed between said conductive layers for their electrical insulation from each other.
Claim 13
Dependent Claim
23 words
The device of claim 10 further comprising a molded case enclosing said integrated circuit chip and said plurality of conductive and insulating layers.
Claim 14
Dependent Claim
18 words
The device of claim 10, wherein said first and second conductors comprise legs soldered to the corresponding leads.
Claim 15
Dependent Claim
18 words
The device of claim 10, wherein at least one of said conductive layers comprises a plurality of portions.
Claim 16
Dependent Claim
13 words
The device of claim 13 further comprising capacitance means coupled between said portions.
Claim 17
Dependent Claim
21 words
The device of claim 10, wherein said plurality of conductive layers comprises an upper conductive layer including a plurality of portions.
Claim 18
Dependent Claim
17 words
The device of claim 15 further comprising capacitance means coupled between at least two of said portions.
Claim 19
Dependent Claim
14 words
The device of claim 10, wherein said insulating layers are formed by plastic tapes.
Claim 20
Dependent Claim
21 words
The device of claim 10, wherein each of said conductive layer comprises an annular metal plane surrounding said integrated circuit chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-06 | 1997-03-08 | 1997-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-06 | 2001-03-08 | 2001-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-06 | 2005-03-08 | 2005-09-07 | $7700.00 | Window Closed / Lapsed |