Patent US2668616A successfully refreshed from Google Patents.
US4933744A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin encapsulated electronic devices
Assignee: Hitachi Ltd
•
Filing: 1988-02-01
•
Granted: 1990-06-12
•
Expires: 2008-02-01
Abstract
Abstract Resin encapsulated electronic devices are provided by encapsulating so-called flat-shaped, plate-like, or angular-shaped electronic devices with a resin composition containing rubber-like particles preferably having an average particle size of 150 mu m or less. In the course of production of said resin encapsulated electronic devices, no crack is produced in the electronic devices by the stress from the outside, and after production, said resin encapsulated electronic devices are amazingly lessened in formation of cracks by thermal stress and have high reliability.
Inventors
- 👤 Tadanori Segawa
- 👤 Hiroshi Suzuki
- 👤 Masahiro Kitamura
- 👤 Shunichi Numata
- 👤 Kunihiko Nishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 04:27
CPC Classifications
H; H01; H01G; H01G2/00; H01G2/12; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T428/00; Y10T428/23; Y10T428/239
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
105 words
A resin encapsulated electronic device having at least one flat-shaped integrated circuit element wherein the maximum lateral length of the element is four times or more as large as the thickness, said element having a passivation film formed thereon, and cured resin composition encapsulating said integrated circuit element; said cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein and being an encapsulating material for said integrated circuit element; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 2
Dependent Claim
105 words
A resin encapsulated electronic device having at least one flat-shaped integrated circuit element wherein the maximum lateral length of the element is four times or more as large as the thickness, said element having a passivation film formed thereon, and cured resin composition encapsulating said integrated circuit element; said cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein and being an encapsulating material for said integrated circuit element; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 3
Dependent Claim
25 words
A resin encapsulated electronic device according to claim 1, wherein said rubber particle content in said cured resin composition is 70 to 1.5% by volume.
Claim 4
Dependent Claim
41 words
A resin encapsulated electronic device according to claim 1, wherein the content of said rubber particles in the cured resin composition is 50 to 1.5% by volume when the rubber particles are formed from an aqueous latex or uncured liquid rubber.
Claim 5
Dependent Claim
23 words
A resin encapsulated electronic device according to claim 1, wherein said rubber particles have an average particle size of 150 μm or less.
Claim 6
Dependent Claim
23 words
A resin encapsulated electronic device according to claim 1, wherein said inorganic filler has a particle size of not greater than 200 μm.
Claim 7
Dependent Claim
46 words
A resin encapsulated electronic device according to claim 5, wherein the content of the rubber particles in the cured resin composition is 70 to 1.5% by volume and the content of the inorganic filler in the cured resin composition is not greater than 80% by volume.
Claim 8
Dependent Claim
19 words
A resin encapsulated electronic device according to claim 1, wherein said matrix resin is a silicone modified epoxy resin.
Claim 9
Dependent Claim
112 words
A resin encapsulated electronic device comprising outer leads, an integrated circuit element having a p-n junction; and internal fine connector wires which connect the integrated circuit element with the outer leads; at least the integrated circuit element, the connector wires and connection portions between said wires and said outer leads being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; said cured resin composition being an encapsulating material for said device; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 10
Dependent Claim
112 words
A resin encapsulated electronic device comprising outer leads, an integrated circuit element having a p-n junction; and internal fine connector wires which connect the integrated circuit element with the outer leads; at least the integrated circuit element, the connector wires and connection portions between said wires and said outer leads being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; said cured resin composition being an encapsulating material for said device; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 11
Dependent Claim
121 words
A resin encapsulated electronic device comprising copper foils as outer leads; an integrated circuit element having a p-n junction and metal balls or solder connecting the integrated circuit element with individual copper foils; at least the integrated circuit element, the metal balls or the solder and connection portions between the metal balls or the solder and the copper foils being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; said cured resin composition being an encapsulating material for said device, the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 12
Dependent Claim
121 words
A resin encapsulated electronic device comprising copper foils as outer leads; an integrated circuit element having a p-n junction and metal balls or solder connecting the integrated circuit element with individual copper foils; at least the integrated circuit element, the metal balls or the solder and connection portions between the metal balls or the solder and the copper foils being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; said cured resin composition being an encapsulating material for said device, the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 13
Dependent Claim
127 words
A resin encapsulated semiconductor device comprising a semiconductor element having p-n junctions formed on a portion of the major surface thereof and a cured resin composition containing a matrix resin of a silicon modified epoxy resin and rubber-like particles uniformly dispersed therein and encapsulating said semiconductor element, said rubber-like particles having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being formed from rubber-like material having one or more functional groups that are reactive with the matrix resin; the content of said rubber-like particles in the cured resin composition being not more than 70% by volume; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 14
Dependent Claim
127 words
A resin encapsulated semiconductor device comprising a semiconductor element having p-n junctions formed on a portion of the major surface thereof and a cured resin composition containing a matrix resin of a silicon modified epoxy resin and rubber-like particles uniformly dispersed therein and encapsulating said semiconductor element, said rubber-like particles having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being formed from rubber-like material having one or more functional groups that are reactive with the matrix resin; the content of said rubber-like particles in the cured resin composition being not more than 70% by volume; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 15
Dependent Claim
48 words
A resin encapsulated semiconductor device according to claim 10, wherein the rubber-like material is at least one member selected from the group consisting of polybutadiene-or butadiene-based copolymers, isoprene rubber, chloroprene rubber, polyurethane rubber, ethylene-propylene rubber, silicone rubber, fluorine rubber, fluorosilicone rubber, polyester rubber, natural rubber and polyphosphazene rubber.
Claim 16
Dependent Claim
23 words
A resin encapsulated semiconductor device according to claim 10, wherein the resin composition contains 50 to 1% by volume of the rubber-like particles.
Claim 17
Dependent Claim
17 words
A resin encapsulated semiconductor device according to claim 10, wherein the rubber-like material is a silicone rubber.
Claim 18
Dependent Claim
144 words
A resin encapsulated semiconductor device comprising an integrated circuit element having a passivation film formed thereon and an angular shape in section in the thicknesswise direction and a cured resin composition containing a matrix resin of a silicon modified epoxy resin and rubber-like particles uniformly dispersed therein and encapsulating said integrated circuit element; said rubber-like particles being made of a silicone rubber and having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being formed from a silicone rubber material having one or more functional groups which are reactive with the matrix resin; the content of the said rubber-like particles in the cured resin composition being not more than 70% by volume; and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 19
Dependent Claim
144 words
A resin encapsulated semiconductor device comprising an integrated circuit element having a passivation film formed thereon and an angular shape in section in the thicknesswise direction and a cured resin composition containing a matrix resin of a silicon modified epoxy resin and rubber-like particles uniformly dispersed therein and encapsulating said integrated circuit element; said rubber-like particles being made of a silicone rubber and having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being formed from a silicone rubber material having one or more functional groups which are reactive with the matrix resin; the content of the said rubber-like particles in the cured resin composition being not more than 70% by volume; and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 20
Dependent Claim
22 words
A resin encapsulated semiconductor device according to claim 14, wherein the resin composition contains 50 to 1% by volume of rubber-like particles.
Claim 21
Dependent Claim
180 words
In a semiconductor device in which a semiconductor chip is encapsulated directly or indirectly with a resin encapsulation of a cured resin composition, said semiconductor chip having at least one major surface whose area is much larger than that of a side surface thereof, said major surface being disposed with a necessary functioning element, the improvement wherein the thickness of said encapsulation in a direction perpendicular to said major surface of said semiconductor chip is not greater than 24 times the thickness of said semiconductor chip, and said cured resin composition contains a matrix resin and rubber-like particles uniformly dispersed therein; said rubber-like particles having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being formed from a rubber-like material having one or more functional groups reactive with the matrix resin; the content of said rubber-like particles in the cured resin composition being not more than 70% by volume and said resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 22
Dependent Claim
180 words
In a semiconductor device in which a semiconductor chip is encapsulated directly or indirectly with a resin encapsulation of a cured resin composition, said semiconductor chip having at least one major surface whose area is much larger than that of a side surface thereof, said major surface being disposed with a necessary functioning element, the improvement wherein the thickness of said encapsulation in a direction perpendicular to said major surface of said semiconductor chip is not greater than 24 times the thickness of said semiconductor chip, and said cured resin composition contains a matrix resin and rubber-like particles uniformly dispersed therein; said rubber-like particles having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being formed from a rubber-like material having one or more functional groups reactive with the matrix resin; the content of said rubber-like particles in the cured resin composition being not more than 70% by volume and said resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 23
Dependent Claim
29 words
A semiconductor device according to claim 16, wherein said major surface has a passivation film covering pn-junction surfaces, said passivation film having a thickness of not greater than 3μm.
Claim 24
Dependent Claim
153 words
A semiconductor device comprising a semiconductor element having a p-n junction formed on an electroconductive substrate which can be part of a lead, said semiconductor element being connected to one or more leads by one or more fine connector wires, said semiconductor element, said electroconductive substrate, said connector wires and a part of each lead being encapsulated with a cured resin composition containing a matrix resin and rubber-like particles uniformly dispersed therein, said rubber-like particles having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being made of a rubber-like material having one or more functional groups which are reactive with the matrix resin; the content of said rubber-like particles in the cured resin composition being not more than 70% by volume and said resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 25
Dependent Claim
153 words
A semiconductor device comprising a semiconductor element having a p-n junction formed on an electroconductive substrate which can be part of a lead, said semiconductor element being connected to one or more leads by one or more fine connector wires, said semiconductor element, said electroconductive substrate, said connector wires and a part of each lead being encapsulated with a cured resin composition containing a matrix resin and rubber-like particles uniformly dispersed therein, said rubber-like particles having a particle size of 30 μm or less and having an elastic modulus of 30 kg/mm 2 or less at room temperature, said rubber-like particles being made of a rubber-like material having one or more functional groups which are reactive with the matrix resin; the content of said rubber-like particles in the cured resin composition being not more than 70% by volume and said resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 26
Dependent Claim
38 words
A resin encapsulate semiconductor device according to claim 18, wherein said functional groups are selected from the group consisting of a carboxyl group, an epoxy group, a hydroxyl group, an isocyanate group, an amino group and vinyl group.
Claim 27
Dependent Claim
42 words
A resin encapsulated semiconductor device according to claim 18, wherein said matrix resin is selected from the group consisting of an epoxy resin, a phenolic resin, an addition-type imide resin, a urethane resin, an epoxy isocyanate resin, and a diallyl phthalate resin.
Claim 28
Dependent Claim
97 words
A resin encapsulated integrated circuit device having at least one flat-shaped integrated circuit element wherein the maximum lateral length of the element is four times or more as large as the thickness, and a cured resin composition encapsulating said integrated circuit element; said cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein and being an encapsulating material for said device; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 29
Dependent Claim
97 words
A resin encapsulated integrated circuit device having at least one flat-shaped integrated circuit element wherein the maximum lateral length of the element is four times or more as large as the thickness, and a cured resin composition encapsulating said integrated circuit element; said cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein and being an encapsulating material for said device; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 30
Dependent Claim
28 words
A resin encapsulated integrated circuit device according to claim 21, wherein the content of said rubber particles in said cured resin compostion is 70 to 1.5% by volume.
Claim 31
Dependent Claim
41 words
A resin encapsulated integrated circuit device according to 21, wherein the content of said rubber particles in said cured resin composition is 50 to 1.5% by volume when the rubber particles are formed from an aqueous latex or uncured liquid rubber.
Claim 32
Dependent Claim
41 words
A resin encapsulated integrated circuit device according to 21, wherein the content of said rubber particles in said cured resin composition is 50 to 1.5% by volume when the rubber particles are formed from an aqueous latex or uncured liquid rubber.
Claim 33
Dependent Claim
24 words
A resin encapsulated integrated circuit device according to claim 21, wherein said rubber particles have an average particle size of 150 μm or less.
Claim 34
Dependent Claim
24 words
A resin encapsulated integrated circuit device according to claim 21, wherein said inorganic filler has a particle size of not greater than 200 μm.
Claim 35
Dependent Claim
47 words
A resin encapsulated integrated circuit device according to claim 25, wherein the content of the rubber particles in the cured resin composition is 70 to 1.5% by volume and the content of the inorganic filler in the cured resin composition is not greater than 80% by volume.
Claim 36
Dependent Claim
20 words
A resin encapsulated integrated circuit device according to claim 21, wherein said matrix resin is a silicone modified epoxy resin.
Claim 37
Dependent Claim
104 words
A resin encapsulated semiconductor device comprising electrical leads, an integrated circuit element having a p-n junction and internal fine connector wires which connect the integrated circuit element with the leads, at least the integrated circuit element, the connector wires and the leads being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; said cured resin composition being an encapsulating material for said device; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 38
Dependent Claim
104 words
A resin encapsulated semiconductor device comprising electrical leads, an integrated circuit element having a p-n junction and internal fine connector wires which connect the integrated circuit element with the leads, at least the integrated circuit element, the connector wires and the leads being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; said cured resin composition being an encapsulating material for said device; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 39
Dependent Claim
110 words
A resin encapsulating semiconductor device comprising copper foils as electrical leads, an integrated circuit element having a p-n junction and metal balls or solder connecting the integrated circuit element with individual copper foils; at least the integrated circuit element, the metal balls or the solder and connection portions between the copper foils and the metal balls or the solder being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 40
Dependent Claim
110 words
A resin encapsulating semiconductor device comprising copper foils as electrical leads, an integrated circuit element having a p-n junction and metal balls or solder connecting the integrated circuit element with individual copper foils; at least the integrated circuit element, the metal balls or the solder and connection portions between the copper foils and the metal balls or the solder being encapsulated with a cured resin composition containing a matrix resin and rubber particles uniformly dispersed therein; the rubber particles having rubber elasticity and being formed from a rubber-like material reactive with the matrix resin and the cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 41
Dependent Claim
67 words
A semiconductor device encapsulated by a cured resin composition; said cured resin composition comprising a matrix resin and rubber particles uniformly dispersed therein and being the encapsulating material for said semiconductor device; the rubber particles having rubber elasticity and being formed of a rubber-like material reactive with the matrix resin during curing; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
Claim 42
Dependent Claim
67 words
A semiconductor device encapsulated by a cured resin composition; said cured resin composition comprising a matrix resin and rubber particles uniformly dispersed therein and being the encapsulating material for said semiconductor device; the rubber particles having rubber elasticity and being formed of a rubber-like material reactive with the matrix resin during curing; said cured resin composition further comprising 80% by volume or less of an inorganic filler.
References Cited (Backward Citations)
JPS506279A
Cited
JPS506280A
Cited
US4042955A
Cited
US4001655A
Cited
US4024570A
Cited
US4092487A
Cited
US4047075A
Cited
US4220962A
Cited
US4327369A
Cited
US4529755A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-11 | 1993-12-11 | 1994-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-11 | 1997-12-11 | 1998-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-11 | 2001-12-11 | 2002-06-12 | $7700.00 | Window Closed / Lapsed |