Abstract A semiconductor device includes a housing, a semiconductor element disposed in a lower section inside the housing, an external lead terminal at least partially disposed within the housing, a gelled filler disposed within the housing, the semiconductor element and at least a portion of the external lead terminal being embedded in the gelled filler, a hardened sealing resin layer disposed over the gelled filler, and at least one internal pressure absorbing chamber having a pocket-type sealed space, the internal pressure absorbing chamber passing through the sealing resin layer and being open at an upper surface side of the gelled filler. The semiconductor device prevents a rise in the internal pressure of the housing in response to thermal expansion of the gelled filler sealed within the housing, and the absorption of external moisture by the gelled filler. When the gelled filler expands according to a heat cycle, its increase in volume is absorbed by the internal pressure absorbing chamber to prevent leakage of the gelled filler and the application of stress to the semiconductor element. The absorption of moisture from the air outside of the semiconductor device by the gelled filler is prevented by defining the internal pressure absorbing chamber as a tightly closed pocket-type space to ensure that the semiconductor device is intrinsically resistant to humidity.
A semiconductor device comprising: a housing having a side wall and an upper cover; a semiconductor element disposed in a lower section inside the housing; an external lead terminal at least partially disposed within the housing; a gelled filler disposed within the housing, the semiconductor element and at least a portion of the external lead terminal being embedded in the gelled filler; a hardened sealing resin layer disposed over the gelled filler; at least one internal pressure absorbing chamber having a pocket-type sealed space, the internal pressure absorbing chamber passing through the sealing resin layer and being open at an upper surface side of the gelled filler; a first partition wall extending inwardly from the side wall of the housing and penetrating the sealing resin layer, the first partition wall having an upper end that is open and exposed above the sealing resin layer and a lower end that is buried in the gelled filler; and a second partition wall extending downwardly from the upper cover of the housing and surrounding the upper end of the first partition wall, the second partition wall having an extreme end buried in the sealing resin layer, and the internal pressure absorbing chamber being defined by both the first and second partition walls.
Claim 2
Dependent Claim
209 words
A semiconductor device comprising: a housing having a side wall and an upper cover; a semiconductor element disposed in a lower section inside the housing; an external lead terminal at least partially disposed within the housing; a gelled filler disposed within the housing, the semiconductor element and at least a portion of the external lead terminal being embedded in the gelled filler; a hardened sealing resin layer disposed over the gelled filler; at least one internal pressure absorbing chamber having a pocket-type sealed space, the internal pressure absorbing chamber passing through the sealing resin layer and being open at an upper surface side of the gelled filler; a first partition wall extending inwardly from the side wall of the housing and penetrating the sealing resin layer, the first partition wall having an upper end that is open and exposed above the sealing resin layer and a lower end that is buried in the gelled filler; and a second partition wall extending downwardly from the upper cover of the housing and surrounding the upper end of the first partition wall, the second partition wall having an extreme end buried in the sealing resin layer, and the internal pressure absorbing chamber being defined by both the first and second partition walls.
Claim 3
Dependent Claim
47 words
A semiconductor device in accordance with claim 1, wherein the internal pressure absorbing chamber has a space capacity set at a space capacity value, and the space capacity value is larger than a voluminal increase which the gelled filler undergoes in response to an increase in temperature.
Claim 4
Dependent Claim
49 words
A semiconductor device in accordance with claim 1, wherein the sealing resin layer comprises a thermosetting resin, the housing is filled with the thermosetting resin before an upper cover is fitted on the housing, and the thermosetting resin is hardened after the upper cover is fitted on the housing.