EP0384482A2
Expired / Lapsed
EP
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Composite semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1990-02-23
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Granted: —
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Expires: 2010-02-23
Abstract
Abstract A composite semiconductor device comprises a case (7) for packaging a plurality of semiconductor elements (4) connected to each other. The case (7) has a side wall (71, 72) provided with a cavity (73) and with an opening (10) for connecting the cavity (73) with the inside of the case (7). When resin (8, 9) injected into the case (7) is expanded due to the increase of temperature of the resin (8, 9) resulting from the conduction of the semiconductor elements, an increase of internal pressure due to the expansion is effectively absorbed by virtue of the cavity (73).
Inventors
- 👤 Takeshi C/O Mitsubishi Denki K.K. Yamamoto
- 👤 C/O Mitsubishi Denki K.K. Nakatsuka Masanori
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 05:17
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
93 words
A composite semiconductor device, comprising: - a base plate (1); - a plurality of semiconductor elements (4) mounted on the base plate (1) and connected to each other; - a case (7) fixed on the base plate (1) for packaging the semiconductor elements (4); and - a resin (8, 9) injected into the case (7) for sealing the semiconductor elements (4); - the case (7) having a side wall (71, 72) provided with a cavity (73) and with an opening (10) for connecting the cavity (73) with the inside of the case (7).
Claim 2
Dependent Claim
93 words
A composite semiconductor device, comprising: - a base plate (1); - a plurality of semiconductor elements (4) mounted on the base plate (1) and connected to each other; - a case (7) fixed on the base plate (1) for packaging the semiconductor elements (4); and - a resin (8, 9) injected into the case (7) for sealing the semiconductor elements (4); - the case (7) having a side wall (71, 72) provided with a cavity (73) and with an opening (10) for connecting the cavity (73) with the inside of the case (7).
Claim 3
Dependent Claim
53 words
The composite semiconductor device in accordance with claim 1, wherein - the resin (8, 9) comprises soft resin (8) injected up to a predetermined height of the case (7) and thermosetting resin (9) injected on the soft resin (8); - the opening (10) being provided under the predetermined height of the case (7).
Claim 4
Dependent Claim
27 words
The composite semiconductor device in accordance with claim 2, wherein the opening (10) is provided at a boundary between the base plate (1) and the case (7).
Claim 5
Dependent Claim
19 words
The composite semiconductor device in accordance with claim 2 or 3, wherein the soft resin (8) includes silicone gel.
Claim 6
Dependent Claim
19 words
The composite semiconductor device in accordance with claim 2 or 3, wherein the soft resin (8) includes silicone rubber.
Claim 7
Dependent Claim
21 words
The composite semiconductor device in accordance with any of claims 2 to 5, wherein the thermosetting resin (9) includes epoxy resin.
Claim 8
Dependent Claim
37 words
The composite semiconductor device in accordance with any of claims 1 to 6, wherein the side wall (71, 72) is provided with another opening (12) for connecting the cavity (73) with an outside of the case (7).
Claim 9
Dependent Claim
26 words
The composite semiconductor device in accordance with claim 7, wherein the other opening (12) is provided at an upper surface of the side wall (71, 72).
Claim 10
Dependent Claim
55 words
The composite semiconductor device in accordance with any of claims 1 to 8, wherein the side wall (71, 72) has a rectangular configuration and is provided with recesses (15) for fixation of the composite semiconductor device at opposite sides of the rectangular configuration, the cavity (73) being provided at a corner of the rectangular configuration.
Claim 11
Dependent Claim
25 words
The composite semiconductor device in accordance with claim 9, wherein the cavity (73) includes four cavities (73) provided at four corners of the rectangular configuration.
References Cited (Backward Citations)
No citation records indexed.
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