Semiconductor power module

Abstract

Abstract The semiconductor power module has a housing (6), preferably of plastic, in which a baseplate (2) made, for example of ceramic is inserted. The module contains power semiconductor components (4) and terminal components (5) and is encapsulated in the standard way both with a soft potting compound (9) and with a hard potting compound (10). To prevent damage to the module (1) when the module (1) is heated and the soft potting compound (9) consequently increases in volume, the invention provides a relief volume (8) into which the soft potting compound (9) can expand. In addition to this, a soft potting compound (9) is chosen which has an adequate residual viscosity after curing to provide the desired flow behaviour. <IMAGE>

Inventors

• 👤 Georg Nippert

Bibliographic Details