Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
86 words
A direct distribution wiring system for a substrate having at least two connection pads arranged in an array corresponding to terminals of an electronic device, said wiring system including at least two direct distribution structures on a surface of said substrate, each said direct distribution structure including one of said connection pads, a signal pad spaced from said connection pad and a connection between said connection pad and said signal pad, and a conductor extending between and spaced from said at least two direct distribution structures.
Claim 2
Dependent Claim
86 words
A direct distribution wiring system for a substrate having at least two connection pads arranged in an array corresponding to terminals of an electronic device, said wiring system including at least two direct distribution structures on a surface of said substrate, each said direct distribution structure including one of said connection pads, a signal pad spaced from said connection pad and a connection between said connection pad and said signal pad, and a conductor extending between and spaced from said at least two direct distribution structures.
Claim 3
Dependent Claim
25 words
A wiring system as recited in claim 1, further including a shunt extending from a portion of one said direct distribution structures to said conductor.
Claim 4
Dependent Claim
18 words
A wiring system as recited in claim 1, wherein said shunt is formed by a selectively deposited metallization.
Claim 5
Dependent Claim
23 words
A wiring system as recited in claim 2, further including a further connection pad attached to at least one end of said conductor.
Claim 6
Dependent Claim
20 words
A wiring system as recited in claim 1, wherein at least one of said connection and said conductor are severable.
Claim 7
Dependent Claim
22 words
A wiring system as recited in claim 1 wherein said conductor has an angle formed at a predetermined location along its length.
Claim 8
Independent Claim
88 words
A method of effecting a repair or engineering change in a substrate including a direct distribution structure on a surface of said substrate, said direct distribution structure including a connection pad for connecting a circuit element to said substrate, a terminal spaced from at least one said connection pad and a connection between said connection pad and said terminal, and a conductor extending in the proximity of and spaced from said direct distribution structure, including the step of forming a shunt between said connection pad and said conductor.
Claim 9
Independent Claim
88 words
A method of effecting a repair or engineering change in a substrate including a direct distribution structure on a surface of said substrate, said direct distribution structure including a connection pad for connecting a circuit element to said substrate, a terminal spaced from at least one said connection pad and a connection between said connection pad and said terminal, and a conductor extending in the proximity of and spaced from said direct distribution structure, including the step of forming a shunt between said connection pad and said conductor.
Claim 10
Dependent Claim
22 words
A method as recited in claim 7, including the further step of severing at least one of said conductor and said connection.
Claim 11
Dependent Claim
104 words
A direct distribution wiring system for a substrate comprising: a substrate; a plurality of direct distribution structures arrayed on a surface of said substrate in accordance with terminals of an electronic device, at least one of said direct distribution structures including a connection pad, a signal pad spaced from said connection pad, and a connection between said connection pad and said signal pad; a plurality of engineering change pads proximate to said direct distribution structures; and at least one conductor extending between and spaced from at least two of said direct distribution structures and connected to at least one of said engineering change pads.
Claim 12
Dependent Claim
104 words
A direct distribution wiring system for a substrate comprising: a substrate; a plurality of direct distribution structures arrayed on a surface of said substrate in accordance with terminals of an electronic device, at least one of said direct distribution structures including a connection pad, a signal pad spaced from said connection pad, and a connection between said connection pad and said signal pad; a plurality of engineering change pads proximate to said direct distribution structures; and at least one conductor extending between and spaced from at least two of said direct distribution structures and connected to at least one of said engineering change pads.
Claim 13
Dependent Claim
20 words
A direct distribution wiring system as recited in claim 1 wherein said engineering change pads surround said direct distribution structures.
Claim 14
Dependent Claim
27 words
A direct distribution wiring system as recited in claim 9, further including a shunt extending from a portion of one said direct distribution structures to said conductor.
Claim 15
Dependent Claim
20 words
A wiring system as recited in claim 9, wherein at least one of said connection and said conductor are severable.
Claim 16
Dependent Claim
22 words
A wiring system as recited in claim 9 wherein said conductor has an angle formed at a predetermined location along its length.