Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
82 words
In a carrier for a large scale integrated circuit chip including a built-in capacitor structure in the carrier, with the capacitor located beneath the chip with the parallel plates of the capacitor parallel to the plane of the surface of the carrier supporting said chip, the improvement comprising said capacitor formed of at least one capacitor segment sandwiched between a pair of parallel conductive charge redistribution planes with said segment and said planes extending substantially parallel to said surface of said carrier.
Claim 2
Dependent Claim
82 words
In a carrier for a large scale integrated circuit chip including a built-in capacitor structure in the carrier, with the capacitor located beneath the chip with the parallel plates of the capacitor parallel to the plane of the surface of the carrier supporting said chip, the improvement comprising said capacitor formed of at least one capacitor segment sandwiched between a pair of parallel conductive charge redistribution planes with said segment and said planes extending substantially parallel to said surface of said carrier.
Claim 3
Dependent Claim
65 words
a carrier in accordance with claim 1 wherein said capacitor is formed from a plurality of interconnected segments located between said charge redistribution planes, with each of said segments being electrically connected to a separate connection link on the surface of said carrier, said link being adapted for easy deletion of the connection between defective segments of said capacitor from the remainder of said capacitor.
Claim 4
Dependent Claim
153 words
In a carrier for a large scale integrated circuit chip system, said carrier having an upper surface on which at least one chip is bonded, said carrier including a capacitor structure located at a level below a chip site with the parallel plates of the capacitor extending within the body of said carrier, the improvement comprising said capacitor being formed of a single capacitor segment forming a first plate and a plurality of capacitor segments forming a complementary segmented plate juxtaposed with said first plate, with each of said plurality of capacitor segments being connected by at least one via connected from said segment to a corresponding deletable strap connection on said upper surface of said carrier whereby a defective one of said capacitor segments can be eliminated from connection in any circuit in which it is included by means of an externally applied tool applied to said upper surface of said carrier.
Claim 5
Dependent Claim
153 words
In a carrier for a large scale integrated circuit chip system, said carrier having an upper surface on which at least one chip is bonded, said carrier including a capacitor structure located at a level below a chip site with the parallel plates of the capacitor extending within the body of said carrier, the improvement comprising said capacitor being formed of a single capacitor segment forming a first plate and a plurality of capacitor segments forming a complementary segmented plate juxtaposed with said first plate, with each of said plurality of capacitor segments being connected by at least one via connected from said segment to a corresponding deletable strap connection on said upper surface of said carrier whereby a defective one of said capacitor segments can be eliminated from connection in any circuit in which it is included by means of an externally applied tool applied to said upper surface of said carrier.
Claim 6
Dependent Claim
22 words
In a carrier in accordance with claim 3, said capacitor segments being aligned substantially parallel to said upper surface of said carrier.
Claim 7
Dependent Claim
24 words
In a carrier in accordance with claim 3, with each of said deletable straps being connected to a charge redistribution plane within said carrier.
Claim 8
Dependent Claim
27 words
In a carrier in accordance with claim 5, said charge redistribution plane being located between said top surface and said capacitor segments forming said complementary segmented plate.
Claim 9
Dependent Claim
20 words
In a carrier in accordance with claim 6, a redistribution plane located parallel to said plates below said complementary plate.
Claim 10
Dependent Claim
22 words
In a carrier in accordance with claim 3, said plates being located in planes normal to said top surface of said carrier.
Claim 11
Dependent Claim
19 words
In a carrier in accordance with claim 3, wherein said capacitor structure is located directly below said chip site.